Abstract: An object is to accurately estimate loss-on-ignition in a short time. A loss-on-ignition estimation apparatus includes at least one processor configured to carry out an estimation step, the estimation step including estimating the loss-on-ignition of foundry sand with use of a learned model constructed by means of machine learning. The learned model is configured to receive, as input, (1) sand weight data relating to a weight of the foundry sand detected in a calcination period and (2) at least one of (i) sand property data relating to one or more properties of the foundry sand, (ii) additive data relating to one or more additives added to the foundry sand, and (iii) calcination environment data relating to a calcination environment detected in the calcination period. The learned model is configured to generate, as output, an estimated loss-on-ignition of the foundry sand.

Abstract: A tape cassette that includes a box-shaped cassette case whose outline being defined by a bottom wall, a top wall, and a side wall and including a plurality of corner portions, at least one tape contained within a tape containment area defined within the outline, a pair of cavities extending from the bottom wall and being provided between the tape containment area and the outline at opposite ends of a diagonal line connecting one of the corner portions to another of the corner portions, and a side face indicator portion provided in the side wall, indicating a type of the tape, and including a plurality of indicator portions disposed in a pattern in accordance with the type of the tape, each of the indicator portions being one of a switch hole and a surface portion.

Abstract: A tape cassette that includes a box-shaped cassette case whose outline being defined by a bottom wall, a top wall, and a side wall and including a plurality of corner portions, at least one tape contained within a tape containment area defined within the outline, a pair of cavities extending from the bottom wall and being provided between the tape containment area and the outline at opposite ends of a diagonal line connecting one of the corner portions to another of the corner portions, and a side face indicator portion provided in the side wall, indicating a type of the tape, and including a plurality of indicator portions disposed in a pattern in accordance with the type of the tape, each of the indicator portions being one of a switch hole and a surface portion.

Abstract: An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time.

Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.

Abstract: A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method for producing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of 550 m2/g or more and 1,500 m2/g or less. The sealing sheet is less likely to cause the inorganic filler to escape from a cured layer 11?.

Abstract: Provided is an antifouling composition including a tetrafunctional silane-based compound (A) having a specified structure, a trifunctional silane-based compound having a specified structure, and at least one metal catalyst (C) selected from the group consisting of a titanium-based catalyst, an aluminum-based catalyst, a tin-based catalyst, and a zinc-based catalyst, the antifouling composition satisfying the following relational expression (1). 1.5?y?2x+1??Expression (1): In the expression, x indicates the carbon number of an alkyl group that is selected for R2 in the formula (b) representing the silane-based compound (B) and indicates a number of 4 to 22; and y indicates a blending amount ratio (A)/(B) in a molar ratio of the silane-based compound (A) to the silane-based compound (B).

Abstract: An adhesive composition contains an acrylic copolymer and an adhesive aid, in which the acrylic copolymer contains 2-ethylhexyl acrylate as a main monomer, and the adhesive aid contains as a main component a rubber material having a reactive group. An adhesive sheet includes a base material and an adhesive layer containing the adhesive composition.

Abstract: Provided is an antifouling sheet having an antifouling layer formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B) wherein the content of the component (B) is 8 to 90 mol % relative to 100 mol % of the component (A), and the antifouling layer is a layer formed by drying and curing a coating film formed of the antifouling layer-forming composition, in an ammonia atmosphere. Also provided is a method for producing the antifouling sheet. The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droppings, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

Abstract: Provided is an antifouling composition including a tetrafunctional silane-based compound (A) having a specified structure, a trifunctional silane-based compound having a specified structure, and at least one metal catalyst (C) selected from the group consisting of a titanium-based catalyst, an aluminum-based catalyst, a tin-based catalyst, and a zinc-based catalyst, the antifouling composition satisfying the following relational expression (1). 1.5?y?2x+1??Expression (1): In the expression, x indicates the carbon number of an alkyl group that is selected for R2 in the formula (b) representing the silane-based compound (B) and indicates a number of 4 to 22; and y indicates a blending amount ratio (A)/(B) in a molar ratio of the silane-based compound (A) to the silane-based compound (B).

Abstract: Provided is an antifouling sheet having an interlayer (X) containing a (poly)silazane compound and having an antifouling layer (Y) layered on the surface of the interlayer (X), wherein the layer (Y) is formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B), the content of the component (B) in the antifouling layer-forming composition is 8 to 90 mol % relative to 100 mol % of the component (A). The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droplets, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

Abstract: Provided is an antifouling sheet having an antifouling layer formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B) wherein the content of the component (B) is 8 to 90 mol % relative to 100 mol % of the component (A), and the antifouling layer is a layer formed by drying and curing a coating film formed of the antifouling layer-forming composition, in an ammonia atmosphere. Also provided is a method for producing the antifouling sheet. The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droppings, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

Abstract: An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time.

Abstract: An electrically peelable pressure sensitive adhesive composition consists of an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant using a monomer mixture comprising an alkyl(meth)acrylate, and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less, wherein a content of the component (B) based on 100 parts by mass of active ingredient of the component (A) is 3.5 parts by mass or more. In the electrically peelable pressure sensitive adhesive composition, the adhesiveness before voltage application is high, but the adhesiveness can decrease effectively by voltage application for a short time.

Abstract: A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

Abstract: A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

Abstract: A plasma 10 is generated within a film formation chamber 2, and mainly a nitrogen gas 11 is excited within the film formation chamber 2. Then, the excited nitrogen gas 11 is mixed with a diborane gas 13 diluted with a hydrogen gas to react them, thereby forming a boron nitride film 15 on a substrate 4. At the initial stage of film formation, the nitrogen gas 11 is supplied in excess to suppress the occurrence of an amorphous phase on the interface. As a result, the boron nitride film 15 improved in moisture absorption resistance on the interface with the substrate and maintaining low dielectric constant properties is formed.

Abstract: A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

Abstract: A process for producing a resin-sealed semiconductor device having high reliability which is produced more easily and efficiently without voids, the process comprising the steps of: (a) providing a semiconductor wafer having circuits on a surface; (b) applying a resin sheet composed of a support and an adhesive resin layer releasable from the support, on the circuit surface of the semiconductor wafer, and fixing an outer periphery of the resin sheet with a ring frame; (c) cutting the semiconductor wafer and the resin layer by each circuit to form chips; (d) picking up each chip together with the resin layer from the support; (e) mounting each chip on a predetermined position of a chip mounting substrate through the resin layer; and (f) firmly bonding the chip on the chip mounting substrate so as to achieve conduction between the chip and the chip mounting substrate.

Abstract: An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.