Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract: There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract: While enlargement of cover members attached to an engine body is avoided, the flexibility of the shapes of the cover members is increased and it is made possible to lead to a predetermined position drainage discharged from a cooling water pump attached to the external surface of a lateral wall of the engine body. A drainage discharge hole for discharging drainage is provided in a lower portion of a pump case. An engine side rib leads downward drainage discharged from the drainage discharge hole is integrally provided on an engine body forming part of the engine body so as to project from an external surface of a lateral surface thereof.

Abstract: There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Abstract: A vehicle fuel tank assembly is provided with a fuel tank and a fuel pump unit. The fuel tank is mounted on a saddle-riding type vehicle. The fuel tank has a flat shape elongated in the front-to-rear direction. The fuel pump unit includes a main body, a support body extending from the upper part of the main body in the longitudinal direction of the fuel tank, and a fuel level gauge supported and extending on the support body. The fuel level gauge includes a fuel level gauge body, a float arm pivotally supported by the gauge body, and a float on the free end of the float arm. The float arm extends in the longitudinal direction of the fuel tank and takes a highest swing position in an intermediate level of the height of the fuel tank. The fuel tank assembly enables fuel level detection in a wide range.

Abstract: A vehicle fuel tank assembly is provided with a fuel tank and a fuel pump unit. The fuel tank is mounted on a saddle-riding type vehicle. The fuel tank has a flat shape elongated in the front-to-rear direction. The fuel pump unit includes a main body, a support body extending from the upper part of the main body in the longitudinal direction of the fuel tank, and a fuel level gauge supported and extending on the support body. The fuel level gauge includes a fuel level gauge body, a float arm pivotally supported by the gauge body, and a float on the free end of the float arm. The float arm extends in the longitudinal direction of the fuel tank and takes a highest swing position in an intermediate level of the height of the fuel tank. The fuel tank assembly enables fuel level detection in a wide range.

Abstract: While enlargement of cover members attached to an engine body is avoided, the flexibility of the shapes of the cover members is increased and it is made possible to lead to a predetermined position drainage discharged from a cooling water pump attached to the external surface of a lateral wall of the engine body. A drainage discharge hole for discharging drainage is provided in a lower portion of a pump case. An engine side rib leads downward drainage discharged from the drainage discharge hole is integrally provided on an engine body forming part of the engine body so as to project from an external surface of a lateral surface thereof.

Abstract: A seat for a vehicle and a seat for a watercraft include a polyurethane-made first cushion body covered with a seat skin. A thermoplastic elastomer-made second cushion body is disposed between the first cushion body and a bottom plate 43. The relationships of t1<t2, 5 mm?t1?30 mm, and 20 mm?t2?50 mm are established, where t1 is the material thickness of the first cushion body, and t2 is the material thickness of the second cushion body. The resulting configuration provides a seat for a vehicle and a seat for watercraft which are capable of securing a good ride comfort.

Abstract: A seat for a vehicle and a seat for a watercraft include a polyurethane-made first cushion body covered with a seat skin. A thermoplastic elastomer-made second cushion body is disposed between the first cushion body and a bottom plate 43. The relationships of t1<t2, 5 mm?t1?30 mm, and 20 mm?t2?50 mm are established, where t1 is the material thickness of the first cushion body, and t2 is the material thickness of the second cushion body. The resulting configuration provides a seat for a vehicle and a seat for watercraft which are capable of securing a good ride comfort.

Abstract: There is provided a highly reliable rotary compressor which uses polyalkylene glycol as a lubricant or polyalfa olefin as base oil in a compressor utilizing as a refrigerant carbon dioxide which is a natural refrigerant, and prevents abnormal abrasion of a roller and a vane.

Abstract: There is provided a highly reliable rotary compressor which uses polyalkylene glycol as a lubricant or polyalfa olefin as base oil in a compressor utilizing as a refrigerant carbon dioxide which is a natural refrigerant, and prevents abnormal abrasion of a roller and a vane.

Abstract: An object of the present invention is to obtain a good refrigerator using polyvinyl ether oil as a refrigerator oil, which is compatible with a hydrofluorocarbon type refrigerant not containing chlorine (such as R134a) without suffering conventional problems. A refrigerator of the present invention comprises a refrigerating cycle using a hydrofluorocarbon type refrigerant not containing chlorine or a refrigerant mixture thereof, with a refrigerator oil compatible with the refrigerant sealed, wherein the refrigerator oil comprises a polyvinyl ether type compound having a structural unit represented by the general formula (1) as the main component, with a pour point of −40° C. or less, a two-liquid separation temperature of −20° C. or less, a total acid number of 0.02 mgKOH/g or less, a viscosity of 8 to 100 cst at 40° C.

Abstract: A rotary compressor uses a freon without containing chlorine ions and uses polyol ester as a lubricant or plyvinyl ether as a base oil for providing a highly reliable rotary compressor, and for preventing abnormal abrasion. The rotary compressor has a roller and a vane sliding contact with an outer cirumference of the roller. A sliding contact portion between the vane and the roller is formed with a radius of curvature Rv, and satisfies T<Rv<Rr, wherein T is the thickness of the vane and Rr is the radius of curvature of the outer circumference of the roller.