Abstract: A bearing structure includes a radial bearing for rotatably supporting an end of a rotary shaft while the rotary shaft receives a thrust load. The rotary shaft has an outer periphery. The bearing structure is characterized by comprising a rolling body supported in the radial direction of the rotary shaft within the bearing, a support portion for rotatably supporting the rolling body, an extended portion extending from the support portion toward the axial direction of the rotary shaft. The support portion is fit over an outer periphery of the rotary shaft. The extended portion is press-fitted over the outer periphery of the rotary shaft.

Abstract: A bearing structure includes a radial bearing for rotatably supporting an end of a rotary shaft while the rotary shaft receives a thrust load. The rotary shaft has an outer periphery. The bearing structure is characterized by comprising a rolling body supported in the radial direction of the rotary shaft within the bearing, a support portion for rotatably supporting the rolling body, an extended portion extending from the support portion toward the axial direction of the rotary shaft. The support portion is fit over an outer periphery of the rotary shaft. The extended portion is press-fitted over the outer periphery of the rotary shaft.

Abstract: The position of a ball bearing (18) on a shaft (16) may be fixed, press fitting a sheave portion (10) onto the shaft (16) and sandwiching the ball bearing (18) between a flange (16a) and the sheave portion (10). Thus, the axial dimension of a stationary sheave half (4) for a continuously variable transmission may be reduced. Because one end (10c) of the sheave portion (10) is in contact with the ball bearing (18), thrust force from the sheave portion (10) is transmitted via the ball bearing (18) to the flange (16a), which will not loosen and, thereby, the structural integrity of the stationary sheave half (4) is maintained.

Abstract: A carrier C is integrally formed of a pair of flanges opposed to each other and designed to rotatably support rotating bodies therebetween and a plurality of joints for connecting the flanges. A groove is formed on the border between the flanges and the joints, and openings are made among the joints. Engagement holes for rotatably supporting rotational shafts of rotating bodies are made in the flanges.

Abstract: A carrier C is integrally formed of a pair of flanges opposed to each other and designed to rotatably support rotating bodies therebetween and a plurality of joints for connecting the flanges. A groove is formed on the border between the flanges and the joints, and openings are made among the joints. Engagement holes for rotatably supporting rotational shafts of rotating bodies are made in the flanges.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: To provide a composite material member for semiconductor device, an insulated semiconductor device and non-insulated semiconductor device using the composite material member, which are effective for obtaining a semiconductor device that alleviates thermal stress or thermal strain occurring during production or operation, has no possibilities of deformation, degeneration and rupture of each member, and is highly reliably and inexpensive. The composite material member for semiconductor device is characterized by being a composite metal plate with particles composed of cuprous oxide dispersed in a copper matrix, in which a surface of the composite metal plate is covered with a metal layer, and a copper layer with thickness of 0.5 &mgr;m or larger exists in an interface formed by the composite metal plate and the metal layer.

Abstract: A semiconductor power element heat dissipation board is provided having a high bonding strength without voids in the bonding portion, and high reliability without forming a thick brittle Al/Cu intermetallic chemical compound. The manufacturing method is simple.

Abstract: An object of the present invention is to provide a semiconductor power element heat dissipation board which has a high bonding strength without voids in the bonding portion, and has high reliability without forming a thick brittle Al/Cu intermetallic chemical compound, and of which the manufacturing method is simple, and to provide a conductor plate and a heat sink plate and a solder used for the semiconductor power element heat dissipation board, and to provide a power module and a composite plate using the semiconductor power element heat dissipation board.

Abstract: A process of forming an annular member from a cylindrical member, wherein a force is applied to the cylindrical member in an axial direction thereof, to thereby cause plastic deformation at one of opposite axial end portions of the cylindrical member, such that a flange extends in a generally radial direction from one of opposite axial ends of the cylindrical member which corresponds to the above-indicated one of the opposite axial end portions, and a shearing operation is effected on the flange to punch out the annular member.

Abstract: A carrier C is integrally formed of a pair of flanges opposed to each other and designed to rotatably support rotating bodies therebetween and a plurality of joints for connecting the flanges. A groove is formed on the border between the flanges and the joints, and openings are made among the joints. Engagement holes for rotatably supporting rotational shafts of rotating bodies are made in the flanges.

Abstract: According to a hydraulic bulge forming method, a bend pipe is inserted in a cavity, and when the bend pipe is subjected to bulge forming, the bend pipe is elastically deformed by supplying a pressure medium to an interior of the bend pipe so that an inside of the bent portion is bulged along a bulging region formed at a portion of the cavity corresponding to an inside of a bent portion of the bend pipe. Whereby a reduction in a wall thickness of the outside portion of the bent portion is suppressed, so that a danger of causing breaking can be prevented.

Abstract: A method of applying adhesives to leads of lead frame, a nozzle of a dispenser is moved horizontally above one lead and positioned against the lead at a predetermined distance. While keeping adhesives flowing from the nozzle of the dispenser, the dispenser is moved horizontally relative to the leads in a direction from one lead to the next lead so that the distance is kept constant. Then the adhesives are applied to a predetermined portion of each lead. When the application of adhesives to the last lead is complete, the nozzle is raised and moved horizontally. Therefore, the number of upward and downward movements of the nozzle is greatly reduced and the application time can be shortened. Preferably, the distance between the tip of the nozzle and the surface of the lead is to be one-fourth to three times as long as the inside diameter of the nozzle.

Abstract: A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.

Abstract: A novel composite superconductor includes a superconducting material and a normal conducting material. The composite superconductor has a number of closely spaced grooves on a surface being in contact with a refrigerant, and a number of ridges spaced apart from each other by the grooves and having acutely tapered ends. The surfaces of the grooves and the ridges are coated with a thin film of metal or its compound having higher heat resistance than that of the surface of the composite superconductor. Consequently, a high critical heat flux in film boiling and a high cooling capability can be provided, thereby making it possible to decrease the sectional area of the normal conducting material, to increase the effective current density and to miniaturize the size of a magnet.

Abstract: A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.