Abstract: The present invention provides an agent which induces acceleration of hard tissue formation, acceleration of cell differentiation and increase in cellular alkaline phosphatase activity, by directly acting on the cell. Specifically, it provides a hard tissue formation promoter, a cell differentiation inducer and a cellular alkaline phosphatase activity reinforcing agent comprising, as an active ingredient, a glycosaminoglycan or a salt thereof that keeps sulfate group and has the characteristics of the following (1) and (2): (1) a basic structure is a disaccharide repeating structure consisting of a hexuronic acid residue and a glucosamine residue, (2) one or less of the position among a 2-position hydroxyl group of a hexuronic acid residue, a 6-position hydroxyl group of a glucosamine residue and a 2-position amino group of the glucosamine residue in the basic structure of the aforementioned (1) does not have the sulfate group.

Abstract: Vias 7 penetrating a circuit substrate 2 or a seal ring 8 are provided on a part or the entire outer periphery of a molding semiconductor device 1 or in the cut region of the circuit substrate 2, so that adhesion between a substrate and a core 2C in the circuit substrate 2 is improved. Therefore, it is possible to suppress the exfoliation of the circuit substrate 2, improving the yields.

Abstract: A peptide having any one of the amino acid sequences of SEQ ID NO: 1 or 13, preferably a peptide having any one of the amino acid sequences of SEQ ID NOS: 2 to 9 or a peptide having any one of the amino acid sequences of SEQ ID NOS: 10 and 15 to 17, is used as an active ingredient of an agent for promoting growth or differentiation of cells such as osteoblasts, chondroblasts, cementoblasts, bone marrow-derived mesenchymal stem cells and periodontal ligament-derived cells.

Abstract: A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A peptide having any one of the amino acid sequences of SEQ ID NO: 1 or 13, preferably a peptide having any one of the amino acid sequences of SEQ ID NOS: 2 to 9 or a peptide having any one of the amino acid sequences of SEQ ID NOS: 10 and 15 to 17, is used as an active ingredient of an agent for promoting growth or differentiation of cells such as osteoblasts, chondroblasts, cementoblasts, bone marrow-derived mesenchymal stem cells and periodontal ligament-derived cells.

Abstract: An actuator, operated by being supplied with electric power, needs an initial setting for performing a desired operation by recognizing its starting position. The initial setting is conducted when an abnormality occurs in a signal which represents an operation of the actuator. The initial setting is also conducted when a system for the actuator recognizes a fact that a battery is electrically disconnected in association with information denoting a condition of the battery in a memory.

Abstract: In determining a starting point of a motor of an electric actuator during its initialization procedure, when a rotation angle sensor detects pulse signals in a certain initialization pattern, power supply to the motor is stopped by the control of a motor drive circuit. This electrical control of motor rotation enables the initialization procedure of the actuator to be carried out without using mechanical restriction means for locking purposes, and the influence of variations in the deflection amount of any stoppers is eliminated. The precision in determining the starting point in the initialization procedure is thus improved.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A motor stopping circuit is activated when a motor control circuit is stopped by a reset signal outputted from a reset circuit. This maintains an overrun angle small. As a result, a difference between a rotation angles measured when the motor control circuit is turned off and measured when the motor control circuit is turned on are small. Therefore, frequent origin setting operation is not required. This reduces sizes and manufacturing costs of a stopper and an actuator.

Abstract: In determining a starting point of a motor of an electric actuator during its initialization procedure, when a rotation angle sensor detects pulse signals in a certain initialization pattern, power supply to the motor is stopped by the control of a motor drive circuit. This electrical control of motor rotation enables the initialization procedure of the actuator to be carried out without using mechanical restriction means for locking purposes, and the influence of variations in the deflection amount of any stoppers is eliminated. The precision in determining the starting point in the initialization procedure is thus improved.

Abstract: A motor stopping circuit is activated when a motor control circuit is stopped by a reset signal outputted from a reset circuit. This maintains an overrun angle small. As a result, a difference between a rotation angles measured when the motor control circuit is turned off and measured when the motor control circuit is turned on are small. Therefore, frequent origin setting operation is not required. This reduces sizes and manufacturing costs of a stopper and an actuator.

Abstract: An actuator, operated by being supplied with electric power, needs an initial setting for performing a desired operation by recognizing its starting position. The initial setting is conducted when an abnormality occurs in a signal which represents an operation of the actuator. The initial setting is also conducted when a system for the actuator recognizes a fact that a battery is electrically disconnected in association with information denoting a condition of the battery in a memory.

Abstract: A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Abstract: The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

Abstract: An improved single-row multi-point-contact ball bearing for an electromagnetic clutch and pulley and for a compressor for an automobile air conditioner is provided, which has a low relative inclination between the inner and outer rings and rotatable at a high revolution of about 10,000 rpm, and yet inexpensive requiring a small axial space. A single-row four-point contact angular ball bearing is provided which comprises an one-piece inner and outer rings. Each raceway surface of the inner and outer rings is made to form a Gothic-arched configuration having two curved surfaces, and each radius of curvature of the two curved surfaces is made to range substantially 0.515 to 0.55 of the outer diameter of a ball.

Abstract: The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.