Abstract: A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.

Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 ?m and not more than 5.0 ?m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Abstract: In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 ?m to 5.00 ?m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 ?m to 1.00 ?m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

Abstract: Providing an anti-corrosion terminal material having high corrosion resistance effect and good adhesiveness of a film. A first film is formed on at least a part of a base material in which at least a surface is made of copper or copper alloy; in the first film, a zinc layer made of zinc or zinc alloy is formed on a mixed layer in which a copper-tin alloy region made of copper tin alloy and a tin region made of tin or tin alloy other than copper tin alloy are mixed; the zinc layer is in contact with both the copper-tin alloy region and the tin region of the mixed layer; a ratio R1/R2 is 0.05 or more and 2.5 or less where a length in contact with the copper-tin alloy region in a cross section along a thickness direction is R1 (?m) and a length in contact with the tin layer is R2 (?m).

Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 ?m and not more than 5.0 ?m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.

Abstract: In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 ?m to 5.00 ?m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 ?m to 1.00 ?m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

Abstract: A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 ?m to 1.2 ?m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 ?m to 1.5 ?m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 ?m to 1.0 ?m (inclusive) and an average crystal grain diameter of from 0.01 ?m to 0.5 ?m (inclusive).

Abstract: Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure. Provided are a base material made of copper or copper alloy, a zinc layer made of zinc or zinc alloy formed on the base material, and a tin layer made of tin or tin alloy formed on the zinc layer: in a whole of the zinc layer and the tin layer, a tin amount per unit area is 0.30 mg/cm2 to 7.00 mg/cm2 inclusive, a zinc amount per unit area is 0.07 mg/cm2 to 2.00 mg/cm2 inclusive, a content percentage of zinc in a vicinity of a surface in the tin layer is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer is 2% to 30% inclusive.

Abstract: Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure. Provided are a base material made of copper or copper alloy, a zinc layer made of zinc or zinc alloy formed on the base material, and a tin layer made of tin or tin alloy formed on the zinc layer: in a whole of the zinc layer and the tin layer, a tin amount per unit area is 0.30 mg/cm2 to 7.00 mg/cm2 inclusive, a zinc amount per unit area is 0.07 mg/cm2 to 2.00 mg/cm2 inclusive, a content percentage of zinc in a vicinity of a surface in the tin layer is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer is 2% to 30% inclusive.

Abstract: A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 ?m to 1.2 ?m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 ?m to 1.5 ?m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 ?m to 1.0 ?m (inclusive) and an average crystal grain diameter of from 0.01 ?m to 0.5 ?m (inclusive).

Abstract: An automated analyzer is offered which can dilute an analyte repeatedly without contamination due to carry-over and thus can yield reliable analysis results. The analyzer has an analyte turntable for holding analyte containers in which analyte is stored, a dilution turntable for holding dilution containers for storing a diluent, a dilution probe for aliquotting a liquid between two containers held on these two turntables, respectively, a diluent vessel for storing a diluent, and a diluent supply mechanism for supplying the diluent into the diluent vessel. The dilution probe has a function of aliquotting the diluent stored in the diluent vessel into the dilution containers held on the dilution turntable. The diluent vessel has a diluent discharging mechanism for discharging the diluent from inside the diluent vessel.

Abstract: An automated analyzer is offered which can dilute an analyte repeatedly without contamination due to carry-over and thus can yield reliable analysis results. The analyzer has an analyte turntable for holding analyte containers in which analyte is stored, a dilution turntable for holding dilution containers for storing a diluent, a dilution probe for aliquotting a liquid between two containers held on these two turntables, respectively, a diluent vessel for storing a diluent, and a diluent supply mechanism for supplying the diluent into the diluent vessel. The dilution probe has a function of aliquotting the diluent stored in the diluent vessel into the dilution containers held on the dilution turntable. The diluent vessel has a diluent discharging mechanism for discharging the diluent from inside the diluent vessel.

Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

Abstract: A Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 ?m to 1.5 ?m, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5, and the average thickness of the Cu3Sn layer is 0.01 ?m to 0.5 ?m.

Abstract: [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. [Means to Solve Problems] A Cu—Sn intermetallic compound layer 3 and an Sn-based surface layer 4 are formed in this order on the surface of a Cu-based substrate 1 through an Ni-based base layer 2, and, furthermore, the Cu—Sn intermetallic compound layer 3 is composed of a Cu3Sn layer 5 arranged on the Ni-based base layer 2 and a Cu6Sn5 layer 6 arranged on the Cu3Sn layer 5; the Cu—Sn intermetallic compound layer 3 obtained by bonding the Cu3Sn layer 5 and the Cu6Sn5 layer 6 is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer 4; thicknesses X of the recessed portions 7 are set to 0.05 ?m to 1.

Abstract: Introducing a silane reactant gas into a Jet Vapor Deposition microwave discharge source for deposition of silicon nitride films at increased rate. An array of regularly spaced micro-inlets in a JVD microwave discharge source delivers the silane reactant gas and act as non-interfering silane injectors to give a rate increase proportional to the number of micro-inlets while preserving deposited film quality.

Abstract: A microsensor or micromechanical device based upon the piezoelectric properties of thin film lead zirconate titanate (PZT) with a thickness of between 0.1 and 5 microns. The thin film PZT is sandwiched between first and second electrodes which are provided with electrical connection means for electrically connecting the electrodes to a voltage sensor or voltage source. The invention also relates to a method for making such microsensor or micromechanical device.