Patents by Inventor Takashi Terada

Takashi Terada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079214
    Abstract: A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.
    Type: Application
    Filed: January 13, 2022
    Publication date: March 7, 2024
    Inventors: Yuji Mimura, Hiroshi Maeda, Takuro Masuzumi, Takashi Terada, Masaru Honda, Ryoichi Sakamoto, Takashi Fuse, Yusuke Kubota
  • Publication number: 20240079222
    Abstract: A surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas. The surface modifying apparatus includes a processing vessel; a measuring unit; and a controller. The processing vessel is configured to accommodate the substrate therein. The measuring unit is configured to measure a value indicating an amount of moisture in the processing vessel. The controller is configured to determine whether or not bonding strength between the substrate and the another substrate, when it is assumed that the substrate modified in the processing vessel is bonded to the another substrate, is good based on the value indicating the amount of moisture in the processing vessel measured by the measuring unit.
    Type: Application
    Filed: January 19, 2022
    Publication date: March 7, 2024
    Inventors: Takashi Terada, Yuji Mimura, Hiroshi Maeda, Takuro Masuzumi, Masaru Honda, Ryoichi Sakamoto
  • Publication number: 20230390856
    Abstract: A welding gun includes a fixed electrode fixed to an arm, a movable electrode held by a holding member separated from the arm, a pressure driver including a rod portion that is fixed to the holding member, and linearly advances and retracts. The pressure driver applies pressure to a welding target sandwiched between the movable electrode and the fixed electrode by advancing the holding member to the arm with the rod portion, and a guide mechanism that is disposed to extend parallel to an axis of the rod portion, and guides the holding member. The rod portion is fixed to the holding member to be offset to an extended line of an axis of the fixed electrode, and the guide mechanism includes only one guide rod fixed to any of movable portions including the movable electrode, the holding member, and the rod portion.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 7, 2023
    Inventors: Takehiro Izumi, Takashi Terada, Toshirou Jou
  • Publication number: 20230230986
    Abstract: A solid-state imaging element according to the present disclosure includes a first light receiving pixel, a second light receiving pixel, and a metal layer. The first light receiving pixel receives visible light. The second light receiving pixel receives infrared light. The metal layer is provided to face at least one of a photoelectric conversion unit of the first light receiving pixel and a photoelectric conversion unit of the second light receiving pixel on an opposite side of a light incident side, and contains tungsten as a main component.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 20, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yoshiaki MASUDA, Kazuyoshi YAMASHITA, Shinichiro KURIHARA, Syogo KUROGI, Yusuke UESAKA, Toshiki SAKAMOTO, Hiroyuki KAWANO, Masatoshi IWAMOTO, Takashi TERADA, Sintaro NAKAJIKI, Shinta KOBAYASHI, Chihiro ARAI
  • Publication number: 20230215901
    Abstract: A solid-state imaging element that includes a semiconductor layer, a floating diffusion region (FD), a penetrating pixel separation region, and a non-penetrating pixel separation region. In the semiconductor layer, a visible-light pixel (PDc) that receives visible light and an infrared-light pixel (PDw) that receives infrared light are two-dimensionally arranged. The floating diffusion region is provided in the semiconductor layer and is shared by adjacent visible-light and infrared-light pixels. The penetrating pixel separation region is provided in a region excluding a region corresponding to the floating diffusion region in an inter-pixel region of the visible-light pixel and the infrared-light pixel, and penetrates the semiconductor layer in a depth direction.
    Type: Application
    Filed: April 12, 2021
    Publication date: July 6, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kazuyoshi YAMASHITA, Yoshiaki MASUDA, Shinichiro KURIHARA, Syogo KUROGI, Yusuke UESAKA, Toshiki SAKAMOTO, Hiroyuki KAWANO, Masatoshi IWAMOTO, Takashi TERADA, Sintaro NAKAJIKI
  • Publication number: 20230197748
    Abstract: The solid-state imaging element includes a plurality of first light receiving pixels that receives visible light, a plurality of second light receiving pixels that receives infrared light, a separation region, and a light shielding wall. The plurality of first light receiving pixels and the plurality of second light receiving pixels are arranged in a matrix, and the separation regionis arranged in a lattice pattern, light and has a plurality of intersection portions The light shielding wall is provided in the separation region and includes a first light shielding wall provided along a first direction in plan view, and a second light shielding wall provided along a second direction intersecting the first direction in plan view. In addition, the first light shielding wall and the second light shielding wall are spaced apart at the intersection portionof at least a part of the separation region.
    Type: Application
    Filed: April 13, 2021
    Publication date: June 22, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke UESAKA, Kazuyoshi YAMASHITA, Yoshiaki MASUDA, Shinichiro KURIHARA, Syogo KUROGI, Toshiki SAKAMOTO, Hiroyuki KAWANO, Masatoshi IWAMOTO, Takashi TERADA, Sintaro NAKAJIKI
  • Publication number: 20230055853
    Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Takashi Terada, Yuji Mimura, Hiroshi Maeda, Kazutaka Noda, Masaru Honda, Ryoichi Sakamoto, Yutaka Yamasaki, Tatsuya Kitayama, Akira Fukutomi
  • Publication number: 20220384386
    Abstract: A bonding system includes a surface modifying apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate with plasma of a processing gas. The bonding apparatus is configured to bond two substrates modified by the surface modifying apparatus by an intermolecular force. The surface modifying apparatus includes: a processing chamber configured to accommodate therein the substrate; a processing gas supply configured to supply a processing gas containing moisture into the processing chamber; and a plasma forming unit configured to form the plasma of the processing gas containing the moisture.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 1, 2022
    Inventors: Yuji Mimura, Hiroshi Maeda, Takashi Terada, Masaru Honda, Ryoichi Sakamoto, Yutaka Yamasaki
  • Publication number: 20220302077
    Abstract: A bonding apparatus includes a first holder configured to hold a first substrate divided into multiple chips with a tape and a ring frame therebetween, the first substrate being attached to the tape, and an edge of the tape being attached to the ring frame; a second holder configured to hold a second substrate, which is disposed on an opposite side to the tape with respect to the first substrate therebetween, while maintaining a distance from the first substrate; and a pressing device configured to press the multiple chips one by one with the tape therebetween to press and bond the corresponding chip to the second substrate.
    Type: Application
    Filed: August 12, 2020
    Publication date: September 22, 2022
    Inventors: Takashi Terada, Takayuki Ishii
  • Publication number: 20220285196
    Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.
    Type: Application
    Filed: April 27, 2020
    Publication date: September 8, 2022
    Inventors: Yutaka Yamasaki, Takashi Terada
  • Publication number: 20220277979
    Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.
    Type: Application
    Filed: April 27, 2020
    Publication date: September 1, 2022
    Inventors: Yutaka Yamasaki, Takashi Terada
  • Patent number: 11217617
    Abstract: An imaging element of the present disclosure includes: a photoelectric conversion section 21 provided in a substrate 30; a polarizer 50 formed over the photoelectric conversion section 21, with a single ground insulating layer 31 interposed therebetween; and a light shielding section 41A formed on an upper side of a peripheral region 21? around the photoelectric conversion section 21.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: January 4, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Kentaro Akiyama, Takuma Matsuno, Takashi Terada, Tomohiro Yamazaki
  • Patent number: 11056152
    Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell array including: a plurality of memory cells stacked above a substrate, and a plurality of word lines respectively coupled to gates of the plurality of memory cells and extending in a first direction; and a first film including a first area above the memory cell array and a second area different from the first area, and having a compressive stress higher than silicon oxide. In the first area, a plurality of first trenches extending in the first direction are aligned in a second direction that intersects the first direction. In the second area, a second trench in a mesh form is provided.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: July 6, 2021
    Assignee: Kioxia Corporation
    Inventors: Takuto Tanaka, Takeo Mori, Takashi Terada, Takamichi Tsuchiya
  • Publication number: 20210043234
    Abstract: According to one embodiment, a semiconductor memory device includes: a memory cell array including: a plurality of memory cells stacked above a substrate, and a plurality of word lines respectively coupled to gates of the plurality of memory cells and extending in a first direction; and a first film including a first area above the memory cell array and a second area different from the first area, and having a compressive stress higher than silicon oxide. In the first area, a plurality of first trenches extending in the first direction are aligned in a second direction that intersects the first direction. In the second area, a second trench in a mesh form is provided.
    Type: Application
    Filed: February 24, 2020
    Publication date: February 11, 2021
    Applicant: Kioxia Corporation
    Inventors: Takuto TANAKA, Takeo MORI, Takashi TERADA, Takamichi TSUCHIYA
  • Patent number: 10854620
    Abstract: According to one embodiment, a semiconductor memory device includes: first interconnect layers; second interconnect layers; a first memory pillar extending through the first interconnect layers; a second memory pillar extending through the second interconnect layers; a first film provided above the first interconnect layers, having a planar shape corresponding to the first interconnect layers and extending in the first direction; and a second film provided above the second interconnect layers, separate from the first film in the second direction, having a planar shape corresponding to the second interconnect layers and extending in the first direction. The first and second films have a compressive stress higher than a silicon oxide film.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: December 1, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Takeo Mori, Takashi Terada
  • Patent number: 10833045
    Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: November 10, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Munehisa Kodama, Takashi Terada
  • Publication number: 20200152683
    Abstract: An imaging element of the present disclosure includes: a photoelectric conversion section 21 provided in a substrate 30; a polarizer 50 formed over the photoelectric conversion section 21, with a single ground insulating layer 31 interposed therebetween; and a light shielding section 41A formed on an upper side of a peripheral region 21? around the photoelectric conversion section 21.
    Type: Application
    Filed: April 18, 2018
    Publication date: May 14, 2020
    Inventors: Kentaro Akiyama, Takuma Matsuno, Takashi Terada, Tomohiro Yamazaki
  • Patent number: 10614685
    Abstract: An imaging apparatus includes a camera which images a person, a first sensor which outputs a first signal according to infrared light, a second sensor which outputs a second signal according to infrared light, and controller which starts imaging the person by the camera based on magnitudes of the first signal and the second signal. An infrared light detection area of the first sensor is far from an entrance of a building in comparison with an infrared light detection area of the second sensor, and the infrared light detection area of the second sensor is close to the entrance of the building in comparison with the infrared light detection area of the first sensor.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: April 7, 2020
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takashi Terada, Toshinori Komesu, Kenji Ichikawa, Yuya Kuroki
  • Publication number: 20190130711
    Abstract: An imaging apparatus includes a camera which images a person, a first sensor which outputs a first signal according to infrared light, a second sensor which outputs a second signal according to infrared light, and controller which starts imaging the person by the camera based on magnitudes of the first signal and the second signal. An infrared light detection area of the first sensor is far from an entrance of a building in comparison with an infrared light detection area of the second sensor, and the infrared light detection area of the second sensor is close to the entrance of the building in comparison with the infrared light detection area of the first sensor.
    Type: Application
    Filed: February 1, 2018
    Publication date: May 2, 2019
    Inventors: Takashi TERADA, Toshinori KOMESU, Kenji ICHIKAWA, Yuya KUROKI
  • Publication number: 20190130710
    Abstract: An imaging apparatus which is installed on the outside of a building, and is installed so that a front of the imaging apparatus faces a person who comes to an entrance of the building includes a first sensor element which outputs a first signal according to infrared light, a second sensor element which outputs a second signal of which a polarity is inverted to a polarity of the first signal according to the infrared light, and a camera which starts imaging a person based on magnitudes of the first signal and the second signal. The first sensor element is disposed over the second sensor element in front view of the imaging apparatus.
    Type: Application
    Filed: February 1, 2018
    Publication date: May 2, 2019
    Inventors: Takashi TERADA, Toshinori KOMESU, Kenji ICHIKAWA, Yuya KUROKI