Abstract: A non-transitory computer readable medium stores a program causing a computer to execute: viewably displaying, on the basis of an operation performed by a user, any of a plurality of partial content items constituting content; storing view history of the content; determining, on the basis of the view history, a type of view state of the content if at least one of the partial content items constituting the content has been viewed; determining, on the basis of the type of view state, whether or not the content satisfies a display condition set for each type of view state, the display condition including a condition that the content has a partial content item that has not been viewed; and displaying, in a predetermined display area, an image indicating the content if the content satisfies the display condition.

Abstract: A non-transitory computer readable medium stores a program causing a computer to execute: sending a comment input by a user when transmission of the comment is ordered and the comment satisfies a predetermined transmission condition; displaying the sent comment in a list; specifying an amount of value to be donated to a donation target; and sending the comment and the specified amount of value when transmission of the comment and the specified amount of value is ordered and the comment satisfies the transmission condition, wherein displaying the sent comment in the list includes displaying the comment and the specified amount of value with being associated with each other when the comment and the specified amount of value are sent, and wherein the value can be donated only when the comment is sent.

Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.

Abstract: A content sharing system and content importance level judging method are provided. The content sharing system provides an importance level of arbitrary content is individually judged with respect to users and a notice message valuable for a user is appropriately notified to a client or the outside tool. Further, an access user is able to set the disclosure level of access record of a user accessed the content. In the content sharing system, an importance level of content of multimedia data on a server shared with clients of a plurality of users is judged, in which the importance level of the content with respect to each user is individually calculated by interpreting existing data or a user environment, the client condition is judged, a notice rule setting is changed in accordance with the client condition or an instruction from the client, and a notice message is issued to an appropriate address based on the calculated importance level and a notice rule of the content.

Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.

Abstract: In an IC card, there is provided a technique capable of large expandability of a memory volume, and a memory volume and a cost matched with a user's requirement. A SIM adapter 101 has a top panel 104 for covering a recess portion. In the top panel 104, when a memory card 103 is not inserted, the top panel 104 is positioned at a first height, and, when the memory card 103 is inserted, a part of the top panel 104 is engaged with a part of the SIM adapter 101 so that the top panel is latched at a second height higher than the first height. Also, into a SIM adapter, a top panel for fixing a memory card when the memory card is inserted is inserted, and a part of the top panel is engaged with a part of the SIM adapter so that the top panel is latched when the memory card is inserted.

Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.

Abstract: Connector terminals are arranged at the center of a thin memory card 1802, thereby preventing an electrical short circuit between the terminals. A step is provided to the thin memory card 1802, thereby allowing the IC chips to be stacked in a thick portion. Adhesion portions of the connector terminals 3303 are located at a position on a card insertion port side of a substrate 3002, thereby preventing the destruction of the connector terminals at the time of the card insertion. An upper retainer lid 3003 is provided on an upper portion of the connector terminals 3303, thereby preventing the deflection of the card.

Abstract: To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals.

Abstract: A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card 306 mounted with a flash memory, characterized in that the flash memory card 306 can be inserted into a Plug-in SIM adaptor 305a and/or a mini UICC adaptor 305b each mounted with a secure IC, the flash memory card 306 is inserted into the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b, thereby operating as a SIM attached with an expansion memory or a mini UICC attached with an expansion memory, and the flash memory card 306 can be physically removed from the Plug-in SIM adaptor 305a or the mini UICC adaptor 305b.

Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.

Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.

Abstract: A card tray to be mounted to a memory card can make the memory card mountable in a card slot for memory cards conforming to standards different from those to which the memory card conforms. The card tray has a main body and a recessed mount section. The recessed mount section is formed such that the holder of a second memory card can be mounted to one of the major surfaces of the main body. A memory-card-mounted body is produced when the second memory card is mounted to the recessed mount section. The card tray is configured such that, when the first memory card is placed on the memory-card-mounted body with the left and right edges thereof aligned with each other, the contact pieces of the first memory card and the contact pieces of the second memory card have longitudinally overlapping parts and transversally overlapping parts as viewed from above.

Abstract: To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals.

Abstract: In a memory card with a newly-added module for performing data communication, data communication is stably performed without receiving a noise effect. As an embodiment of the present invention, a memory card 100 has a thin-plate-shaped holding member 20, a memory section 24 provided as buried in the holding member 20, plural first connection pieces 2-10 connected to the memory section 24, a data communication section 26 provided as buried in the holding member 20, and two connection pieces 11, 12 connected to the data communication section 26. The two second connection pieces 11, 12 are disposed at the end of a row part R1 on which only the plural first connection pieces 2-10 are aligned. One first connection piece 10 positioned at the end of the row part R1 is a ground terminal. That is to say, in the plural first connection pieces 2-10, the first connection piece 10 adjacent to the second connection piece 11 is a ground terminal.

Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.

Abstract: This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.

Abstract: Polygonal data input in a first step is subjected to evaluation in which all edges of the polygon data are ranked in importance on the basis of a volume change caused by removal of that edge. The edges are sorted on the basis of an evaluation value in a third step. In a fourth step, the edge of a small evaluation value is determined to be an edge of a small influence on the general shape and is removed. In a fifth step, a new vertex is determined from the loss of vertex by the edge removal. In a sixth step, a movement of texture coordinates and a removal of the texture after the edge removal are executed on the basis of the area change of the texture due to the edge removal by a predetermined evaluating function. In a seventh step, by repeating the processes in the second to sixth steps, a polygon model approximated to a desired layer can be obtained.