Abstract: Provided is a state estimation apparatus including an information acquisition unit which acquires brain wave information of a target person to whom a content is provided, and a state estimation unit which estimates a state of the target person to whom the content is provided, based on the brain wave information of the target person. The information acquisition unit may further acquire biometric information of the target person to whom the content is provided. The state estimation unit may estimate the state based on the brain wave information and the biometric information. The information acquisition unit may acquire the brain wave information of the target person before and while the content is provided. The state estimation unit may estimate the state based on a change from the brain wave information before the content is provided, to the brain wave information while the content is provided, and on the biometric information.

Abstract: A space presentation apparatus comprising an information acquisition unit which acquires subject brain wave information which is brain wave information of a subject, and a space presentation unit which presents a representation space to the subject is provided. The information acquisition unit acquires first brain wave information which is the subject brain wave information before the representation space is presented. The space presentation unit presents the representation space depending on the first brain wave information. The information acquisition unit acquires second brain wave information which is the subject brain wave information after the representation space is presented. The space presentation unit adjusts the representation space based on a change from the first brain wave information to the second brain wave information. The space presentation apparatus may further include a state estimation unit which estimates a state of the subject based on the subject brain wave information of the subject.

Abstract: Provided is a reaction generation apparatus comprising an information acquisition unit that acquires subject input information input by a subject and subject brain wave information of the subject when the subject input information is input, a state generation unit that generates subject state information representing a state of the subject, based on the subject brain wave information, and a reaction generation unit that generates reaction information representing a reaction of the subject, based on the subject input information and the state of the subject. The information acquisition unit may further acquire biological information of the subject when the subject input information is input. The state generation unit may generate the subject state information based on the subject brain wave information and the biological information.

Abstract: Provided is a congeniality estimation device including: an information acquisition unit that acquires at least one of first electroencephalogram information of a plurality of first target persons with a first attribute or second electroencephalogram information of a plurality of second target persons with a second attribute in the situation where each of the first target persons is interacting with each of the second target persons; and a congeniality estimation unit that estimates congeniality between each of the first target persons and each of the second target persons based on at least one of the first electroencephalogram information or the second electroencephalogram information.

Abstract: There is provided a communication device in which a reaction changes according to a state of an evaluation target person. The communication device includes an information acquisition unit which acquires brainwave information of the evaluation target person; a reaction determination unit which determines a first reaction of the communication device, based on the brainwave information; and a control unit which controls the communication device according to the first reaction determined by the reaction determination unit. The reaction determination unit may determine a content of an utterance of the communication device, based on the brainwave information. The control unit may control the communication device according to the content of the utterance determined by the reaction determination unit.

Abstract: Provided is an assistance apparatus including an information acquisition unit which acquires brain wave information of a target person in a state in which dialog is difficult in a case where a living subject conducts an engagement for the target person, and a determination unit which determines a state of the target person based on the brain wave information. The information acquisition unit acquires biological information of the target person. The determination unit determines the state of the target person based on the brain wave information and the biological information. The information acquisition unit acquires the brain wave information of the target person before the engagement. The determination unit generates state information indicating the state of the target person based on a change of the brain wave information before and after the engagement and the biological information, and determines the state of the target person based on the state information.

Abstract: A work support server is a work support apparatus and acquires biological data on plural workers who engage in shared work for operation of a plant, estimates a state of each of the plural workers on the basis of the biological data on the plural workers, makes an analysis of a state of each of the plural workers, and determines, on the basis of a result of the analysis, whether or not intervention in the shared work by the work support apparatus is necessary.

Abstract: A photoelectric conversion element evaluation apparatus includes: a probe light source that irradiates a photoelectric conversion element as the object of measurement with probe light; a pump light source that irradiates the photoelectric conversion element being irradiated with the probe light with pulsed pump light; and a light receiving element that detects time dependency of a change in an amount of the probe light obtained from the photoelectric conversion element.

Abstract: An inspection apparatus using polarized lights according to one aspect of the present invention includes an irradiator configured to irradiate an inspection target with a first plurality of lights. The first plurality of lights have different polarization states and different wavelengths from each other. The inspection apparatus further includes a light receiver configured to perform a wavelength demultiplexing of a second plurality of lights obtained from the inspection target to generate a third plurality of lights, to separately receive the third plurality of lights, and to output at least one light-receiving signal associated with the third plurality of lights and a processor configured to calculate at least one of an ellipse azimuth, a degree of polarization, and a polarization component intensity using the light-receiving signal and to determine whether the inspection target is defective or non-defective.

Abstract: A photoelectric conversion element evaluation apparatus includes: a probe light source that irradiates a photoelectric conversion element as the object of measurement with probe light; a pump light source that irradiates the photoelectric conversion element being irradiated with the probe light with pulsed pump light; and a light receiving element that detects time dependency of a change in an amount of the probe light obtained from the photoelectric conversion element.

Abstract: An inspection apparatus using polarized lights according to one aspect of the present invention includes an irradiator configured to irradiate an inspection target with a first plurality of lights. The first plurality of lights have different polarization states and different wavelengths from each other. The inspection apparatus further includes a light receiver configured to perform a wavelength demultiplexing of a second plurality of lights obtained from the inspection target to generate a third plurality of lights, to separately receive the third plurality of lights, and to output at least one light-receiving signal associated with the second plurality of lights and a processor configured to calculate at least one of an ellipse azimuth, a degree of polarization, and a polarization component intensity using the light-receiving signal and to determine whether the inspection target is defective or non-defective.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.