Abstract: A photoelectric conversion element evaluation apparatus includes: a probe light source that irradiates a photoelectric conversion element as the object of measurement with probe light; a pump light source that irradiates the photoelectric conversion element being irradiated with the probe light with pulsed pump light; and a light receiving element that detects time dependency of a change in an amount of the probe light obtained from the photoelectric conversion element.

Abstract: An inspection apparatus using polarized lights according to one aspect of the present invention includes an irradiator configured to irradiate an inspection target with a first plurality of lights. The first plurality of lights have different polarization states and different wavelengths from each other. The inspection apparatus further includes a light receiver configured to perform a wavelength demultiplexing of a second plurality of lights obtained from the inspection target to generate a third plurality of lights, to separately receive the third plurality of lights, and to output at least one light-receiving signal associated with the third plurality of lights and a processor configured to calculate at least one of an ellipse azimuth, a degree of polarization, and a polarization component intensity using the light-receiving signal and to determine whether the inspection target is defective or non-defective.

Abstract: A photoelectric conversion element evaluation apparatus includes: a probe light source that irradiates a photoelectric conversion element as the object of measurement with probe light; a pump light source that irradiates the photoelectric conversion element being irradiated with the probe light with pulsed pump light; and a light receiving element that detects time dependency of a change in an amount of the probe light obtained from the photoelectric conversion element.

Abstract: An inspection apparatus using polarized lights according to one aspect of the present invention includes an irradiator configured to irradiate an inspection target with a first plurality of lights. The first plurality of lights have different polarization states and different wavelengths from each other. The inspection apparatus further includes a light receiver configured to perform a wavelength demultiplexing of a second plurality of lights obtained from the inspection target to generate a third plurality of lights, to separately receive the third plurality of lights, and to output at least one light-receiving signal associated with the second plurality of lights and a processor configured to calculate at least one of an ellipse azimuth, a degree of polarization, and a polarization component intensity using the light-receiving signal and to determine whether the inspection target is defective or non-defective.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode.

Abstract: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Abstract: It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10. Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30, which faces the other board 20.

Abstract: A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: A semiconductor device is disclosed that comprises a board, a ground terminal disposed on the board, a connection terminal disposed on the board, a semiconductor chip mounted on the board, and a shield member electrically connected to the ground terminal. The semiconductor chip, the ground terminal, and the connection terminal are disposed on one side of the board, and the shield member is disposed directly on and covers the other side of the board.

Abstract: A semiconductor device is provided that includes a semiconductor chip, a substrate on which the semiconductor chip is mounted, a mounting terminal that is arranged on a first side of the substrate, and a testing terminal that is arranged on a second side of the substrate which second side is opposite the first side of the substrate.

Abstract: A semiconductor device includes a semiconductor chip, wirings, a substrate electrically connected to the semiconductor chip via the wirings and a plurality of discrete parts provided on a part of the substrate. The part is located closer to the center of the substrate than a wiring disposing area where the wirings are disposed.

Abstract: A semiconductor device is disclosed that includes a substrate, electronic components that are arranged at an electronic components mounting area of the substrate, a ground terminal that is arranged within the electronic components mounting area, transfer molded resin that covers the electronic components while exposing the ground terminal, a shield member that covers the electronic components and is connected to the ground terminal, and conductive adhesive that realizes electrical connection between the ground terminal and the shield member.

Abstract: A method of manufacturing a semiconductor package includes the steps of: forming, on one side of polyimide film (insulating substrate), a first metal wiring layer (first conductive pattern) having a first pad; forming, on the other side of the polyimide film, a fourth metal wiring layer (second conductive pattern) having a second pad; forming, on the polyimide film, a first solder resist layer having an opening of a size sufficient to expose all side surfaces of the first pad; electrically connecting a semiconductor element to the first pad through a first solder bump; filling insulating adhesive into a space between the polyimide film and the semiconductor element; and bonding a second solder bump with the second pad by heating the second solder bump.

Abstract: A semiconductor laser emits light through a front end and a rear end, the front end being coupled to an application system. The front end has a higher reflectivity than the rear end, to reduce problems caused by returning light. More light is therefore emitted through the rear end than through the front end. In a light source, the light emitted through the rear end is monitored by an optical detector coupled to a control circuit, which controls the voltage applied to the semiconductor laser.

Abstract: In an opto-semiconductor device, a light-emitting part formed on a substrate, a transparent insulating monocrystalline layer is formed over the entire surface of the substrate covering the light-emitting part, a contact window is opened through the transparent insulating monocrystalline layer in the center of the light-emitting part, and an electrode is formed of a transparent conductive monocrystalline layer passing through the contact window and connected to the central part of the light-emitting part, the electrode being formed on the transparent insulating monocrystalline layer. A transparent insulating monocrystalline layer may additionally be formed on the device including the electrode formed of the transparent conductive monocrystalline layer, and a photo-sensitive device formed of a monocrystalline layer may be provided on the transparent insulating monocrystalline layer.

Abstract: A laser diode comprises a substrate, a first blocking layer having a groove, an alternate combination of a lower cladding layer and a second blocking layer, an active layer formed in the groove, and an upper cladding layer. A light-amplifying region and a light-absorbing region are formed alternately in the waveguide. Both regions are disposed periodically at a period corresponding to bragg wavelength.

Abstract: A superluminescent diode has an active layer confined in a channel cut into current blocking layers on a semiconductor substrate. This structure gives a small output beam diameter and high coupling efficiency, even when coupled into single-mode fiber. At the end of the channel distant from the output facet, the active layer makes slanting contact with a rough diffusing surface formed by the current blocking layers and substrate. This easily-manufactured diffusing surface reduces optical gain within the active layer, thereby preventing lasing without requiring an antireflection coating.