Abstract: In an image taking apparatus, an imaging unit senses an image of a subject, and a face detection unit detects a face in the image sensed by the imaging unit. A motion detection unit detects an amount of face motion indicating an amount of shake of an area of the face detected by the face detection unit in the image sensed by the imaging unit and also detects an amount of background motion indicating an amount of shake of an area other than the face area. A shake correction unit corrects the shake of the image sensed by the imaging unit according to the amount of face motion and the amount of background motion detected by the motion detection unit.

Abstract: An image obtained as a result of an image-taking process carried out at a screen rate higher than a standard screen rate is stored in a recording medium in the contemporary video format. To put it more concretely, the image obtained as a result of an image-taking process is supplied at a first screen rate to first compression/coding means for carrying out a compression/coding process at the first screen rate and image data obtained as a result of the compression/coding process is temporarily stored in temporary storage means. After image data output by the first compression/coding means during a predetermined period of time is stored in the temporary storage means, decompression/decoding means reads out the image data from the temporary storage means at a second screen rate lower than the first screen rate, carries out a decompression/decoding process on the image data and stores a result of the decompression/decoding process in recording means.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.

Abstract: An image display apparatus having an electronic zoom function. The apparatus includes: imaging means capable of changing a start position of reading an image; in order for at least a part of a predetermined range of the image data to be written at the time of reading the image from a memory, writing means for extracting the predetermined range of the image and writing the extracted image in the memory; reading means for starting to read the image in the memory at the time of reading the image, converting the predetermined range of the image read from the memory into an image of a predetermined resolution, and outputting the image; and when the range of the image read is wider than a range to be expanded, control means for controlling the start position of reading so as to narrow the range of the image to be read.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.

Abstract: An image pickup apparatus having an image capturing unit capturing an image, a first recording unit temporarily recording an original image signal output from the image capturing unit, a processing unit performing predetermined signal processing upon the original image signal output from the image capturing unit, and an instructing unit instructing the processing unit to capture a still image. When the processing unit is instructed to capture a still image by the instructing unit while performing moving image signal processing upon the original image signal output from the image capturing unit, the processing unit may cause the first recording unit to record the original image signal output from the image capturing unit. In addition, the processing unit may read out the recorded original image signal from the first recording unit and perform still image signal processing upon the read out original image signal while suspending the moving image signal processing.

Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.

Abstract: A camera having a digital video tape recorder integrated therein establishes various camera settings in preparation of imaging a video image, images the video image so as to produce a video signal, generates camera setting data which identifies the various camera settings (e.g., iris setting, shutter speed, white balance mode and focusing mode) that were established for imaging the video image, and records the video signal in a first location of a track on a record medium, e.g., a magnetic tape, and records the camera setting data in a second location of the track on the record medium. When the video signal and camera setting data are reproduced from the record medium, display data is generated from the reproduced camera setting data and is output along with the video signal so as to allow a user to modify (i.e., process) the video signal using the stored camera setting data.

Abstract: An apparatus controls a recording operation, performed by a recording system on a recording medium, of a data signal which includes a copy inhibiting signal. When the copy inhibiting signal is detected, the recording operation is inhibited in the recording system which enters a stand-by state. The recording operation then resumes if the copy inhibiting signal is no longer detected. Alternatively, when the copy inhibiting signal is detected, the data signal is muted while the recording operation continues. The muting operation is cancelled and the normal recording is resumed once the copy inhibiting signal is no longer detected.