Abstract: A work holding mechanism includes a body part having a three-dimensional shape including at least a recess or a protrusion, and an adsorption part for holding a work by adsorbing the work onto the body part in conformity to the three-dimensional shape of the recess or the protrusion provided in the body part. The work is held by being adsorbed in conformity to the three-dimensional shape of the body part, and, therefore, the amount of usage of the work in a work molding system can be reduced as compared with when the work is held so as to have a flat shape.

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

Abstract: This invention relates to silane moisture curable polymer composition and more particularly, to such a polymer composition that is highly diluted by a non-silane containing component, while retaining good high temperatures properties. The invention is a polymer composition comprising a base resin comprising less than 59 wt % of a silane crosslinkable polyethylene (A), an thermoplastic polyolefin free from silane groups (B) wherein the polymer composition comprise a filler with a BET Nitrogen Surface Area larger than 3 m2/g (C). The invention also relates to a cable layer of such polymer composition suitably a semiconducting layer of a power cable.

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract: This invention relates to silane moisture curable polymer composition and more particularly, to such a polymer composition that is highly diluted by a non-silane containing component, while retaining good high temperatures properties. The invention is a polymer composition comprising a base resin comprising less than 59 wt % of a silane crosslinkable polyethylene (A), an thermoplastic polyolefin free from silane groups (B) wherein the polymer composition comprise a filler with a BET Nitrogen Surface Area larger than 3 m2/g (C). The invention also relates to a cable layer of such polymer composition suitably a semiconducting layer of a power cable.

Abstract: The present invention relates to a semiconductive polyolefin composition comprising graphene nanoplatelets. It also relates to a semiconductive polyolefin composition comprising the combination of graphene nanoplatelets and carbon black. Moreover, the present invention is related to a process for producing the semiconductive polyolefin composition as well to the use of the semiconductive polyolefin composition in a power cable. Further, the invention is also related to an article, preferably a power cable comprising at least one semiconductive layer comprising said polyolefin composition.

Abstract: The present invention relates to a high-pressure radical ethylene polymerization process in which ethylene is polymerized with a polyunsaturated olefin comprising at least 6 carbon atoms and at least two non-conjugated double bonds of which at least one is terminal, characterized in that a polyunsaturated olefin grade is used as a starting material which yields a percentage of less than 6.3% in the zero conversion test or which has a decomposition temperature as measured by DSC of 130° C. or more.

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: The present invention relates to a flame retardant polymer composition comprising a crosslinkable terpolymer comprising ethylene monomer units, a silane group containing comonomer units and comonomer units comprising a polar group; a metal carbonate filler and a silicone fluid or gum; wherein the content of the comonomer units comprising a polar group is between 2 and 25 wt % of the terpolymer and the content of the silane group containing comonomer units is between 0.2 and 4 wt % of the terpolymer. The present invention is also directed to the process for the production of the polymer composition, to a cable and/or to an electrical device having a layer comprising said polymer composition, and uses thereof.

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract: The present invention relates to a flame retardant polymer composition comprising a crosslinkable terpolymer comprising ethylene monomer units, a silane group containing comonomer units and comonomer units comprising a polar group; a metal carbonate filler and a silicone fluid or gum; wherein the content of the comonomer units comprising a polar group is between 2 and 25 wt % of the terpolymer and the content of the silane group containing comonomer units is between 0.2 and 4 wt % of the terpolymer. The present invention is also directed to the process for the production of the polymer composition, to a cable and/or to an electrical device having a layer comprising said polymer composition, and uses thereof.

Abstract: The present invention relates to a high-pressure radical ethylene polymerization process in which ethylene is polymerized with a polyunsaturated olefin comprising at least 6 carbon atoms and at least two non-conjugated double bonds of which at least one is terminal, characterized in that a polyunsaturated olefin grade is used as a starting material which yields a percentage of less than 6.3% in the zero conversion test or which has a decomposition temperature as measured by DSC of 130° C. or more.

Abstract: The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

Abstract: The invention relates to a crosslinkable semiconductive polymer composition comprising (a) a polyolefin, carbon black and a compound (b), to a cable, preferably to a crosslinkable comprising the polymer composition, to a production thereof, and preferably to a crosslinked cable comprising the polymer composition of the invention.

Abstract: The present invention relates to a semiconductive polyolefin composition comprising graphene nanoplatelets. It also relates to a semiconductive polyolefin composition comprising the combination of graphene nanoplatelets and carbon black. Moreover, the present invention is related to a process for producing the semiconductive polyolefin composition as well to the use of the semiconductive polyolefin composition in a power cable. Further, the invention is also related to an article, preferably a power cable comprising at least one semiconductive layer comprising said polyolefin composition.

Abstract: A method of separating an adhesive-bonded body is provided, by which a pair of pieces bonded together by using an adhesive can be easily securely separated from each other, wherein the adhesive has excellent adhesive force without being influenced by environmental temperature, excellent storage stability and wide scope of selection of the piece to be bonded. An adhesive-bonded body 1 includes a pair of pieces 2 bonded together and an adhesive layer 4. The adhesive layer 4 bonds the pair of pieces 2 to each other. Ultrasonic vibration is applied to the adhesive-bonded body 1 which is put between a tool horn 6 and an anvil 7 of an ultrasonic vibration applying device 3. The ultrasonic vibration is generated by applying a voltage to a piezoelectric vibrator 5 and vibrates the tool horn 6. The tool horn 6 vibrates ultrasonically together with one piece 2. The pair of the pieces 2 bonded together shifts relatively each other due to the ultrasonic vibration.

Abstract: An object of the present invention is to provide an anti-inflammatory agent and an anti-inflammatory medical material, which have a good anti-inflammatory effect and high safety. The present invention relates to an anti-inflammatory agent and an anti-inflammatory medical material, which contain as an active ingredient a polyphosphoric acid that is particularly 1 type of liner phosphoric acid represented by a general formula Hn+2(PnO3n+1) (wherein n denotes an integer between 3 and 800) or a mixture of 2 or more types of such linear phosphoric acid.

Abstract: Described is an optical element having plural electrodes and, disposed therebetween, a stimuli-responsive polymer gel, a liquid which can be absorbed therein and an ion supplying material. As the ion supplying material, preferred is a material showing a volumetric change, in the form of the element, of 0 to 100% under external stimuli. According to the present invention, a novel optical element showing a large change in light transmittance, reflectance or absorption amount and exhibits stable optical properties in repetition can be provided.