Patents by Inventor Takashi UETA

Takashi UETA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a plurality of semiconductor modules connected by a connection component
    Patent number: 10304777
    Abstract: A semiconductor device includes an assembly configured such that a plurality of semiconductor modules is connected by a component. Each of the plurality of semiconductor modules includes a semiconductor element including a front-surface electrode fixing a front-surface electrode plate and a back-surface electrode fixing a back-surface electrode plate, wherein the component is either of a first component and a second component. The first component being configured to connect adjacent semiconductor modules to each other such that a front-surface electrode plate of one of the adjacent semiconductor modules is connected to a back-surface electrode plate of the other one of the adjacent semiconductor modules. The second component is configured to connect adjacent semiconductor modules such that respective front-surface electrode plates are connected and respective back-surface electrode plates are connected. The semiconductor modules are connected by the first component or the second component.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: May 28, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takashi Ueta, Tomomi Okumura
  • SEMICONDUCTOR DEVICE
    Publication number: 20180130748
    Abstract: A semiconductor device includes an assembly configured such that a plurality of semiconductor modules is connected by a component. Each of the plurality of semiconductor modules includes a semiconductor element including a front-surface electrode fixing a front-surface electrode plate and a back-surface electrode fixing a back-surface electrode plate, wherein the component is either of a first component and a second component. The first component being configured to connect adjacent semiconductor modules to each other such that a front-surface electrode plate of one of the adjacent semiconductor modules is connected to a back-surface electrode plate of the other one of the adjacent semiconductor modules. The second component is configured to connect adjacent semiconductor modules such that respective front-surface electrode plates are connected and respective back-surface electrode plates are connected. The semiconductor modules are connected by the first component or the second component.
    Type: Application
    Filed: October 19, 2017
    Publication date: May 10, 2018
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takashi UETA, Tomomi OKUMURA