Abstract: The present disclosure provides a pellicle that includes: a pellicle frame; a pellicle film supported at one end surface of the pellicle frame; and an adhesive layer provided at another end surface of the pellicle frame, and satisfies the following Equation (1): [A60° C.]?4.0 gf/mm2 (1). In Equation (1), [A60° C.] represents a first peel strength when the pellicle is used in a test laminated body. The test laminated body is obtained by placing the pellicle on a quartz glass substrate such that the adhesive layer is in contact with a surface of the quartz glass substrate, and maintaining a load on the pellicle under prescribed conditions. The first peel strength represents a load per unit adhesion area, which load is required for peeling the pellicle included in the test laminated body from the quartz glass substrate using a standard universal tester under prescribed conditions.

Abstract: A pellicle includes: a pellicle frame; a pellicle film supported at one end surface of the pellicle frame; and an adhesive layer provided at another end surface of the pellicle frame. The adhesive layer has a swelling degree, which is represented by the following Equation (A), of 200% or lower. Equation (A): [post-immersion mass of 10-mg test piece collected from the adhesive layer/10 mg]×100. In Equation (A), the post-immersion mass represents a mass of the test piece after a 6-hour immersion of the test piece in 10 ml of a decane solution having a capillary column GC concentration of 99.0% or higher.

Abstract: A polymerizable composition for optical materials of the present invention includes a polymer (a) comprised of one or more compounds selected from compounds represented by the following General Formulas (1) to (4), a compound (b) of which light absorption characteristics vary by sensing changes in environment; and a polymerization reactive compound (c) (except for the polymer (a)).

Abstract: The purpose of the present disclosure is to provide a pellicle that has an adhesive layer having good flatness, and a method for producing the pellicle with good reproducibility. Said purpose is achieved by a pellicle having: a pellicle frame; a pellicle film provided so as to be stretched on one end surface of the pellicle frame; and an adhesive layer provided on the other end surface of the pellicle frame. The adhesive layer contains a cured product of a resin composition containing a curable polymer (A), and a curing agent (B1) and a curing agent (B2). The curing agent (B1) and the curing agent (B2) have different curing conditions.

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.

Abstract: Task of the present invention is to provide a tackifier solution having high solution stability and also provide, by using such a tackifier solution, a pellicle having only few tackifier residues and exhibiting reduced outgas generation. Present invention is a pellicle comprising a pellicle frame, a pellicle membrane stretched over an end surface of one opening of the pellicle frame, and a tackifier layer provided on an end surface of the other opening of the pellicle frame, wherein the tackifier layer contains a (meth)acrylic tackifier which is a solidified resin composition comprising a polymer (A) and a radical polymerization initiator (B), the polymer (A) having a structural unit derived from a (meth)acrylate and a side chain consisting of a carbon-carbon multiple bond-containing group.

Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.

Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.

Abstract: The purpose of the present invention is to provide a semiconductor substrate manufacturing method, which prevents detachment of a semiconductor wafer being ground, and which prevents cracking or chipping in a semiconductor substrate obtained. In order to solve the problem, the semiconductor substrate manufacturing method comprises: a polyimide layer forming step of forming a polyimide layer on a support material; a wafer attaching step of affixing the support material and a semiconductor wafer to each other with the polyimide layer disposed therebetween; a wafer grinding step of grinding the semiconductor wafer; a support material peeling step of peeling the support material from the polyimide layer; and a polyimide layer peeling step of peeling the polyimide layer from the semiconductor wafer. The polyimide layer includes polyimide which includes a benzophenone skeleton and an aliphatic structure, wherein an amine equivalent weight is 4000 to 20000.

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.

Abstract: Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.

Abstract: A polymerizable composition for optical materials of the present invention includes a polymer (a) comprised of one or more compounds selected from compounds represented by the following General Formulas (1) to (4), a compound (b) of which light absorption characteristics vary by sensing changes in environment; and a polymerization reactive compound (c) (except for the polymer (a)).

Abstract: The cyclic olefin copolymer of the present invention contains (A) a repeating unit derived from one or more kinds of olefins represented by the following General Formula (I), (B) a repeating unit derived from a cyclic non-conjugated diene represented by the following General Formula (III), and (C) a repeating unit derived from one or more kinds of cyclic olefins represented by the following General Formula (V), wherein when a total mole number of the repeating units is regarded as 100 mol %, the (B) repeating unit derived from a cyclic non-conjugated diene is contained in an amount of 19 mol % to 36 mol %.

Abstract: The cyclic olefin copolymer of the present invention contains (A) a repeating unit derived from one or more kinds of olefins represented by the following General Formula (I), (B) a repeating unit derived from a cyclic non-conjugated diene represented by the following General Formula (III), and (C) a repeating unit derived from one or more kinds of cyclic olefins represented by the following General Formula (V), wherein when a total mole number of the repeating units is regarded as 100 mol %, the (B) repeating unit derived from a cyclic non-conjugated diene is contained in an amount of 19 mol % to 36 mol %.