Patents by Inventor Takashi Urai
Takashi Urai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133109Abstract: A disclosed drum-type washing machine having a softening apparatus comprises: a cylindrical water tank accommodating laundry and having a rotating drum; a case for accommodating the water tank; and a softening apparatus having a hardness component remover for removing hardness components from washing water, and a regeneration agent accommodation unit spaced apart from the hardness component remover on opposite sides from a center of the tub, and for accommodating a regeneration agent that regenerates a function of the hardness component remover.Type: ApplicationFiled: December 27, 2023Publication date: April 25, 2024Inventors: Atsushi OHYAGI, Hitoshi MINAI, Takashi ANDO, Tomoyuki OKUNO, Yasushi URAI
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Publication number: 20240125561Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: December 21, 2023Publication date: April 18, 2024Applicant: FUJITSU LIMITEDInventors: Kento OHGA, Hideo KUBO, Kenji SASABE, Masahide KODAMA, Atsushi ENDO, Keita HIRAI, Nobumitsu AOKI, Takashi URAI
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Patent number: 11892246Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: GrantFiled: January 4, 2022Date of Patent: February 6, 2024Assignee: FUJITSU LIMITEDInventors: Kento Ohga, Hideo Kubo, Kenji Sasabe, Masahide Kodama, Atsushi Endo, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Publication number: 20240032251Abstract: A cooling device includes a container in which refrigerant is sealed. The container includes; a heat reception plate that forms part of the container and that receives heat from a heat generating element; an evaporator that causes the refrigerant in a liquid phase to evaporate with heat reception in the container; a condenser that causes the refrigerant in a gas phase to condense with heat dissipation in the container; and a plurality of recessed portions formed in a surface of the heat reception plate inside the container.Type: ApplicationFiled: April 19, 2023Publication date: January 25, 2024Applicant: Fujitsu LimitedInventors: Hideo Kubo, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Yuki Kanai, Toru Kobayashi, Hiroshi Satou, Takashi Urai, Hiromasa Miyata
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Publication number: 20230320029Abstract: A liquid cooling module includes a heat-receiver, an inlet-passage in which a flow-path through which the liquid-refrigerant flowed from an inlet flows is formed, a first flow-passage in which the flow-path continues from the inlet-passage, and that is formed as spreading in a fan-like shape as viewed in a normal-direction of a heat-receiving-surface, a second flow-passage in which the flow-path continues from the first flow-passage, and that is formed toward the heat-receiver in the normal-direction, a diffuser in which grooves that continue from the second flow-passage in the heat-receiver and diffuses the liquid-refrigerant along a surface on an opposite side of the heat-receiving-surface is formed, a third flow-passage in which the flow-path continues from the grooves, and that is formed in the normal-direction and a direction in which the flow-path is separating from the heat-receiver, and an outlet-passage in which the flow-path continues from the third flow-passage to an outlet.Type: ApplicationFiled: February 1, 2023Publication date: October 5, 2023Applicant: Fujitsu LimitedInventors: Yuki Kanai, Kenji Sasabe, Keita Hirai, Hideo Kubo, Atsushi Endo, Masahide Kodama, Takashi Urai
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Publication number: 20230240046Abstract: A heat sink comprises a bottom plate and a plurality of fins. The bottom plate is formed in a T-shape of a head portion and a body portion and includes a coupling region in which the body portion is thermally coupled to a heat generation element; and the plurality of fins that are erected at the head portion and the body portion of the bottom plate and extend in a direction from the head portion toward the body portion. With the plurality of fins, a pressure loss of first air which flows through a center portion of the head portion is smaller than a pressure loss of second air which flows through a side portion of the head portion in a case where air flows between the plurality of fins along the direction.Type: ApplicationFiled: October 31, 2022Publication date: July 27, 2023Applicant: Fujitsu LimitedInventors: Kenji Sasabe, Hideo Kubo, Keita Hirai, Atsushi Endo, Masahide Kodama, Nobumitsu Aoki, Yuki Kanai, Takashi Urai
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Publication number: 20220307772Abstract: A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.Type: ApplicationFiled: December 2, 2021Publication date: September 29, 2022Applicant: FUJITSU LIMITEDInventors: KENJI SASABE, Hideo Kubo, Keita Hirai, KENTO OHGA, Masahide KODAMA, ATSUSHI ENDO, Takashi Urai, Nobumitsu Aoki
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Publication number: 20220299273Abstract: A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.Type: ApplicationFiled: January 4, 2022Publication date: September 22, 2022Applicant: FUJITSU LIMITEDInventors: KENTO OHGA, Hideo Kubo, KENJI SASABE, Masahide KODAMA, ATSUSHI ENDO, Keita Hirai, Nobumitsu Aoki, Takashi Urai
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Patent number: 11246236Abstract: A liquid cooling jacket with first and second heat receivers and a biasing spring. The first heat receiver having a first refrigerant pipe through which a refrigerant flow and a first heat conductive sheet that receives heat by being in contact with a cooling target. The second heat receiver is configured to approach and separate from the first heat receiver while facing the first heat conductive sheet. The spring biases the first heat receiver and the second heat receiver in an approaching direction.Type: GrantFiled: June 3, 2020Date of Patent: February 8, 2022Assignee: FUJITSU LIMITEDInventors: Takashi Urai, Yuki Kanai
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Patent number: 11122711Abstract: An electronic unit to be stored in a first storage section of an electronic device that includes the first storage section on a first side and a second storage section on a second side opposite to the first side, the electronic unit includes a first board on which a first heating element is mounted; a first connector disposed at an end on the first side of the first board; and a duct disposed at the end on the first side of the first board, the duct having a guide surface that guides wind to the first heating element as a fan of the electronic device operates.Type: GrantFiled: April 2, 2020Date of Patent: September 14, 2021Assignee: FUJITSU LIMITEDInventors: Tetsuhiro Kinoshita, Takashi Urai
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Publication number: 20200390006Abstract: A liquid cooling jacket includes a first heat receiver configured to include a first refrigerant pipe through which a refrigerant flows and a first heat conductive sheet that receives heat by being in contact with a cooling target, a second heat receiver capable of approaching and separating from the first heat receiver and configured to face the first heat conductive sheet, and a spring configured to bias the first heat receiver and the second heat receiver in an approaching direction.Type: ApplicationFiled: June 3, 2020Publication date: December 10, 2020Applicant: FUJITSU LIMITEDInventors: Takashi Urai, Yuki Kanai
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Publication number: 20200329587Abstract: An electronic unit to be stored in a first storage section of an electronic device that includes the first storage section on a first side and a second storage section on a second side opposite to the first side, the electronic unit includes a first board on which a first heating element is mounted; a first connector disposed at an end on the first side of the first board; and a duct disposed at the end on the first side of the first board, the duct having a guide surface that guides wind to the first heating element as a fan of the electronic device operates.Type: ApplicationFiled: April 2, 2020Publication date: October 15, 2020Applicant: FUJITSU LIMITEDInventors: Tetsuhiro KINOSHITA, Takashi Urai
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Patent number: 9750128Abstract: A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.Type: GrantFiled: February 26, 2016Date of Patent: August 29, 2017Assignee: FUJITSU LIMITEDInventors: Atsushi Endo, Hideki Kimura, Katsuhiko Nakata, Yoichi Sato, Takashi Urai, Masahide Kodama
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Publication number: 20160270206Abstract: A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.Type: ApplicationFiled: February 26, 2016Publication date: September 15, 2016Applicant: FUJITSU LIMITEDInventors: ATSUSHI ENDO, HIDEKI KIMURA, Katsuhiko Nakata, Yoichi SATO, Takashi Urai, Masahide KODAMA
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Patent number: 9101079Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.Type: GrantFiled: August 16, 2013Date of Patent: August 4, 2015Assignee: FUJITSU LIMITEDInventors: Nobumitsu Aoki, Takeshi Nishiyama, Takashi Urai, Masumi Suzuki, Michimasa Aoki, Jie Wei, Fumihiro Tawa, Yoshinori Uzuka
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Publication number: 20140071624Abstract: A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.Type: ApplicationFiled: August 16, 2013Publication date: March 13, 2014Applicant: FUJITSU LIMITEDInventors: Nobumitsu AOKI, Takeshi NISHIYAMA, Takashi URAI, Masumi SUZUKI, Michimasa AOKI, JIE WEI, Fumihiro TAWA, Yoshinori UZUKA
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Patent number: 8238103Abstract: An electronic component unit includes: a substrate; an electronic component mounted on the surface of the substrate; a heat dissipating member received on the electronic component; a cylinder member having one end coupled to the substrate, the cylinder member having the other end defining an opening opposed to the heat dissipating member; and a piston member having one end coupled to the heat dissipating member, the piston member having the other end inserted in the cylinder member through the opening to establish a closed decompressed space inside the cylinder member.Type: GrantFiled: May 15, 2009Date of Patent: August 7, 2012Assignee: Fujitsu LimitedInventor: Takashi Urai
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Patent number: 7978475Abstract: A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates.Type: GrantFiled: September 22, 2009Date of Patent: July 12, 2011Assignee: Fujitsu LimitedInventor: Takashi Urai
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Publication number: 20100020498Abstract: An electronic component unit includes: a substrate; an electronic component mounted on the surface of the substrate; a heat dissipating member received on the electronic component; a cylinder member having one end coupled to the substrate, the cylinder member having the other end defining an opening opposed to the heat dissipating member; and a piston member having one end coupled to the heat dissipating member, the piston member having the other end inserted in the cylinder member through the opening to establish a closed decompressed space inside the cylinder member.Type: ApplicationFiled: May 15, 2009Publication date: January 28, 2010Applicant: FUJITSU LIMITEDInventor: Takashi URAI
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Publication number: 20100008048Abstract: A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates.Type: ApplicationFiled: September 22, 2009Publication date: January 14, 2010Applicant: FUJITSU LIMITEDInventor: Takashi URAI