Abstract: A heater device is provided with: a transparent substrate; a heating wire arranged on a first face side of the transparent substrate; and a transparent adhesive layer formed on the first face side of the transparent substrate so as to cover the heating wire. The values of the thickness and viscosity of the adhesive layer are selected such that, when the heater device is affixed onto a windshield by means of the adhesive layer, a wedge angle of a concave portion that is formed on the transparent substrate in the vicinity of the heating wire due to a height of the heating wire is no greater than 0.1°.

Abstract: In one embodiment, a semiconductor device includes a lower interconnect layer including a plurality of lower interconnects, and a plurality of lower pads provided on the lower interconnects. The device further includes a plurality of upper pads provided on the lower pads and being in contact with the lower pads, and an upper interconnect layer including a plurality of upper interconnects provided on the upper pads. The lower pads include a plurality of first pads and a plurality of second pads. The upper pads include a plurality of third pads provided on the second pads and a plurality of fourth pads provided on the first pads, a lower face of each third pad is larger in area than a upper face of each second pad, and a lower face of each fourth pad is smaller in area than a upper face of each first pad.

Abstract: An image forming apparatus includes: a photoreceptor that forms a toner image; a light emission element that exposes the photoreceptor; at least one light emission controller that controls light emission of the light emission element; and a hardware processor that transmits a signal including a control parameter for controlling the light emission element with respect to the light emission controller, wherein the light emission controller stops light emission control over the light emission element according to communication that receives the signal including the control parameter from the hardware processor.

Abstract: Provided are 2-(piperidin-1-yl)pyrimidin-4(3H)-ones or pharmaceutically acceptable salts thereof, each characterized by having a 1,8-diazaspiro[4.5]deca-3-ene, 1-oxa-8-azaspiro[4.5]deca-3-ene, 2,8-diazaspiro[4.5]deca-3-ene, 2-oxa-8-azaspiro[4.5]deca-3-ene, 2,9-diazaspiro[5.5]undeca-3-ene, 1-oxa-9-azaspiro[5.5]undeca-3-ene, 1,9-diazaspiro[5.5]undeca-4-ene, or 3,9-diazaspiro[5.

Abstract: A money depositing and dispensing machine 1 includes: a storage compartment 100 provided with a first front opening 101; a stowage compartment 200 disposed on a lower side of the storage compartment 100; a storage portion 12 stored in the storage compartment 100 and storing paper sheets; and a conveying unit 13 stored in the storage compartment 100 and for conveying the paper sheets stored in the storage portion 12 to the stowage compartment 200. The conveying unit 13 is configured to be slidable in a direction of the first front opening 101 provided in the storage compartment 100. The stowage compartment 200 stows the paper sheets conveyed by the conveying unit 13.

Abstract: A liquid composition contains a macrocyclic compound enclosing a metal ion, water, and an organic solvent, wherein a recording medium where the liquid composition has been applied has at least one of an antibacterial activity or an antiviral activity.

Abstract: A semiconductor device according to an embodiment comprises a first chip and a second chip. The first chip includes a first wire, a first connection pad electrically connected to the first wire, and a first dummy pad. The second chip includes a second wire, a second connection pad electrically connected to the second wire and joined to the first connection pad, and a second dummy pad joined to the first dummy pad. A thickness of the first dummy pad is smaller than a thickness of the first connection pad and a thickness of the second dummy pad is also smaller than a thickness of the second connection pad, or the thickness of the first dummy pad is smaller than the thickness of the first connection pad or the thickness of the second dummy pad is smaller than the thickness of the second connection pad.

Abstract: A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

Abstract: A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.

Abstract: A radio-frequency module includes a module substrate having a major surface on which a ground electrode pattern is formed and an integrated circuit disposed on the major surface of the module substrate. The integrated circuit includes a control/power supply circuit having at least one of a control circuit and a power supply circuit and a second electrical circuit having at least one of an amplifier, a switch, and a filter. In plan view, the ground electrode pattern overlaps at least a part of the control/power supply circuit and does not overlap at least a part of the second electrical circuit.

Abstract: A semiconductor device according to the present embodiment includes a first chip and a second chip. A first pad is disposed so as to be exposed from a first region on a first surface. A first mark is provided by a first pattern and is disposed so as to be exposed from a second region. The second chip includes a second substrate, a second wire, a second pad, and a second mark. The second wire is disposed on the second substrate. The second pad is disposed so as to be exposed from a third region on a second surface, and is electrically connected to the second wire and the first pad. The second mark is provided by a second pattern corresponding to the first pattern, is disposed so as to be exposed from a fourth region, and has a thinner thickness than the second pad.

Abstract: [Problem] To provide a solid-state imaging device enabling summed-readout mode and cyclic-readout mode. [Solution] A device includes virtual-pixel units implemented by pixels of transfer-route controlling-scheme, the virtual-pixel units having a shape of polygon, the polygons are tessellated. The virtual-pixel unit encompasses a photoelectric-conversion region, charge detectors to which ordinal numbers are labeled, configured to accumulate signal charges transferred from the photoelectric-conversion region, and transfer-control elements configured to control movement of signal charges from the photoelectric-conversion region to one of the charge detectors. N pieces of charge detectors of the same ordinal number are arranged in boundary between the photodiodes and the intersection-shared sites.

Abstract: An autonomous system including a plurality of autonomous bodies, each of the autonomous bodies includes a situation grasping unit that grasps situation, an operation determining unit that determines an operation based on the grasped situation, and an operation executing unit that executes the determined operation, the plurality of autonomous bodies included in the autonomous body system includes one or more first autonomous bodies and two or more second autonomous bodies, situation grasped by the situation grasping unit of the first autonomous body includes situation of the second autonomous body, the situation grasped by the situation grasping unit of the second autonomous body includes a result of an operation executed by the operation executing unit of the first autonomous body, and the operation determining unit of the second autonomous body determines an operation based on the result of the operation executed by the operation executing unit of the first autonomous body.

Abstract: A display system includes a display that displays a first image simulating a road on which a host vehicle is traveling, and a display controller that causes the display to display a second image simulating a recommended lane given to a controller that performs driving control of the host vehicle at a position associated with the first image, and to display a third image simulating a target trajectory generated by the controller that performs driving control of the host vehicle at a position associated with the first image, wherein the display controller changes the third image to an image simulating the target trajectory for lane change without changing a display position of the second image when the controller executes driving control for causing the host vehicle to return to an original lane after causing the host vehicle to perform lane change.

Abstract: A distance image capturing apparatus has a light source unit that emits an intermittent light pulse into a space, a light receiving unit that includes a plurality of pixels each having a photoelectric conversion device and electric charge accumulating units, and a distance image processing unit. The distance image processing unit acquires an electric charge amount distributed by a predetermined fixed number of times and accumulated in the accumulating units. The distance image processing unit acquires electric charge amounts accumulated in the accumulating units with different number of times of electric charge distribution as one set and selects one of a first electric charge amount with a larger number of electric charge distribution and a second electric charge amount for acquiring a distance from a subject based on a comparison result with a threshold.

Abstract: A permanent magnet including R and T. R are rare earth elements including Sm and at least one selected from Y and Gd. T is Fe alone or Fe and Co. T maybe partly substituted with M, and M is one or more selected from Ti, V, Cr, Mo, W, Zr, Hf, Nb, Ta, Al, Si, Cu, Zn, Ga and Ge. In a total content of R, Sm content is 60 at % or more and 95 at % or less, and a total content of Y and Gd is 5 at % or more and 35 at % or less. The permanent magnet includes main phase crystal grains having a ThMn12 type crystal structure.

Abstract: A video encoding apparatus is a video encoding apparatus for subjecting a video image to motion compensated prediction coding, comprising an acquisition module to acquire available blocks of blocks having motion vectors from encoded blocks adjacent to a to-be-encoded block and number of the available blocks, an acquisition/selection module to select one selection block from the encoded available blocks, a selection information encoder to encode selection information specifying the selection block using a code table corresponding to the number of available blocks, and an image encoder to subject the to-be-encoded block to motion compensated prediction coding using a motion vector of the selection block.

Abstract: A planar light-emitting device having a linear light-emitter having a substrate extending in a predetermined direction, a first line and a second line including a plurality of light-emitting elements arranged along the predetermined direction on the substrate, the first line and the second line being arranged side by site along the predetermined direction with an interval, a first frame arranged on the substrate so as to surround the first line, a second frame arranged on the substrate so as to surround the second line, a first seal arranged inside the first frame for sealing the plurality of light-emitting elements, a second seal arranged inside the second frame for sealing the plurality of light-emitting elements, and a plurality of electrodes arranged on the substrate and electrically connected with the plurality of light-emitting elements, and a light guide plate having an incidence surface having a first flat portion facing to the first line, a second flat portion facing to the second line, a projecting

Abstract: A method of manufacturing a semiconductor device, includes: alternately stacking a first film and a second film on a surface of a semiconductor substrate to form a multilayer film; partially removing the multilayer film to form stacks and a depression between one of the stacks and another one of the stacks and expose an end portion of the surface; forming a first insulating film to fill the depression; forming a first protective film on the stacks, the first insulating film, and the end portion; forming a second insulating film on the first protective film, the second insulating film overlapping at least a part of the other one of the stacks and the end portion; and removing the second insulating film in a thickness direction using chemical mechanical polishing.

Abstract: Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.