Patents by Inventor Takashi Watsuji

Takashi Watsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8877100
    Abstract: A paste composition for forming an electrode on a silicon semiconductor substrate, the paste containing aluminum powder; an organic vehicle and a hydroxide. The paste composition finds applicability in a solar cell element wherein the electrode is formed by applying the paste on the silicon semiconductor substrate and thereafter, firing the paste composition.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: November 4, 2014
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Gaochao Lai, Takashi Watsuji, Haruzo Katoh
  • Patent number: 8197718
    Abstract: Provided are a paste composition making it possible to improve the adhesive property of a backside electrode and restrain an aluminum electrode layer from exfoliating, and a solar cell element having an electrode formed by use of this composition. The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) which comprises aluminum powder, an organic vehicle, and a tackifier. The solar cell element has the electrode (8) formed by painting a paste composition having the above-mentioned characteristic onto the silicon semiconductor substrate (1) and then firing the resultant.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: June 12, 2012
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Jun Nakahara, Gaochao Lai, Haruzo Katoh, Takashi Watsuji
  • Publication number: 20110272019
    Abstract: Provided are a paste composition capable of avoiding deteriorations in a mechanical strength and an adhesion property of an electrode layer, of sufficiently attaining a desired BSF effect, and of suppressing deformation (bow) of the silicon semiconductor substrate even in a case where a silicon semiconductor substrate is rendered thin; and a solar cell element including an impurity layer, or an impurity layer and an electrode layer, which is (or are) formed by using the above-mentioned composition. The paste composition is used for forming a p+ layer (7) or an aluminum electrode layer (5) on a silicon semiconductor substrate (1) and includes an aluminum-coated compound powder.
    Type: Application
    Filed: January 14, 2010
    Publication date: November 10, 2011
    Inventors: Takashi Watsuji, Ken Kikuchi, Yutaka Ochi, Naoaki Ishibashi
  • Patent number: 7938988
    Abstract: Provided are: a paste composition which is capable of keeping a desired function for a backside electrode of a solar cell and strengthening the bond between an aluminum electrode layer and a p type silicon semiconductor substrate even if glass frit as a substance giving a bad effect on the environment is not incorporated into the composition or the content of glass frit as a substance giving a bad effect on the environment therein is decreased; and a solar cell element provided with an electrode formed by use of the composition. The paste composition is a paste composition for forming an aluminum electrode layer (8) over a p type silicon semiconductor substrate (1), comprising aluminum powder, an organic vehicle, and a metal alkoxide. The solar cell element provided with the aluminum electrode layer (8) formed by applying the paste composition having the above-mentioned characteristic to the p type silicon semiconductor substrate (1) and then firing the resultant.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: May 10, 2011
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Takashi Watsuji, Haruzo Katoh, Ken Kikuchi
  • Patent number: 7879262
    Abstract: Provided are an aluminum paste composition capable of inhibiting formation of blisters and globules of aluminum in a back surface electrode layer, which is caused at the time of firing, of reducing bow of a silicon semiconductor substrate even when a thinner silicon semiconductor substrate is used, and of attaining a high BSF effect and a high energy conversion efficiency; and a solar cell element comprising an electrode formed by using the composition. The aluminum paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1), comprising: aluminum powder; an organic vehicle; and a plasticizer. The solar cell element comprises the electrode (8) formed by applying on the silicon semiconductor substrate (1) the paste composition having the above-mentioned features and thereafter, firing the paste composition.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: February 1, 2011
    Assignee: Toyo Aluminum Kabushiki Kaisha
    Inventors: Haruzo Katoh, Takashi Watsuji
  • Patent number: 7850789
    Abstract: Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less erosion, and allows favorable external appearances of brazed portions (fillets); an aluminum-containing member coated with the pasty composition for aluminum brazing; and a method, using the pasty composition for aluminum brazing, for brazing the aluminum-containing members. The pasty composition for aluminum brazing contains an aluminum-containing powder. In a case where on a cumulative grading curve of the aluminum-containing powder, a particle diameter D ?m which corresponds to a Q volume % is indicated as D(Q) ?m, D(50) ?m is greater than or equal to 20 ?m and less than or equal to 150 ?m; and D(90) ?m/D(10) ?m is less than or equal to 5. A mass percentage of particles, in the aluminum-containing powder, which pass through a screen mesh having an opening of 45 ?m is less than or equal to 50%.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: December 14, 2010
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Haruzo Katoh, Takashi Watsuji, Ken Matsumura
  • Publication number: 20100180948
    Abstract: Provided are a paste composition which is capable of sufficiently achieving at least a BSF effect equivalent to or greater than a conventionally achieved BSF effect even when the paste composition is used in either case where a thick back surface electrode layer is formed on a thick silicon semiconductor substrate or where a thin back surface electrode layer is formed on a thin silicon semiconductor substrate and which is capable of not only achieving the BSF effect equivalent to or greater than the conventionally achieved BSF effect but also suppressing a deformation of the silicon semiconductor substrate after being fired when the paste composition is used in the case where the thin back surface electrode layer is formed on the thin silicon semiconductor substrate; and a solar cell element comprising an electrode formed by using the above-mentioned paste composition.
    Type: Application
    Filed: April 7, 2008
    Publication date: July 22, 2010
    Inventors: Gaochao Lai, Yutaka Ochi, Yoshiteru Miyazawa, Takashi Watsuji, Haruzo Katoh
  • Publication number: 20090250103
    Abstract: Provided are an aluminum paste composition capable of inhibiting formation of blisters and globules of aluminum in a back surface electrode layer, which is caused at the time of firing, of reducing bow of a silicon semiconductor substrate even when a thinner silicon semiconductor substrate is used, and of attaining a high BSF effect and a high energy conversion efficiency; and a solar cell element comprising an electrode formed by using the composition. The aluminum paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1), comprising: aluminum powder; an organic vehicle; and a plasticizer. The solar cell element comprises the electrode (8) formed by applying on the silicon semiconductor substrate (1) the paste composition having the above-mentioned features and thereafter, firing the paste composition.
    Type: Application
    Filed: September 8, 2006
    Publication date: October 8, 2009
    Inventors: Haruzo Katoh, Takashi Watsuji
  • Publication number: 20090233118
    Abstract: Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less erosion, and allows favorable external appearances of brazed portions (fillets); an aluminum-containing member coated with the pasty composition for aluminum brazing; and a method, using the pasty composition for aluminum brazing, for brazing the aluminum-containing members. The pasty composition for aluminum brazing contains an aluminum-containing powder. In a case where on a cumulative grading curve of the aluminum-containing powder, a particle diameter D ?m which corresponds to a Q volume % is indicated as D(Q) ?m, D(50) ?m is greater than or equal to 20 ?m and less than or equal to 150 ?m; and D(90) ?m/D(10) ?m is less than or equal to 5. A mass percentage of particles, in the aluminum-containing powder, which pass through a screen mesh having an opening of 45 ?m is less than or equal to 50%.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 17, 2009
    Applicant: Toyo Aluminium Kabushiki Kaisha
    Inventors: Haruzo Katoh, Takashi Watsuji, Ken Matsumura
  • Publication number: 20090223563
    Abstract: Provided are a paste composition capable of inhibiting formation of blisters and globules of aluminum in a back surface electrode layer, which is caused at the time of firing, and of reducing deformation of a silicon semiconductor substrate; and a solar cell element comprising an electrode formed by using the composition. The paste composition is used for forming an electrode (8) on a silicon semiconductor substrate (1) and comprises: aluminum powder; an organic vehicle; and a hydroxide. The solar cell element comprises the electrode (8) formed by applying on the silicon semiconductor substrate (1) the paste composition having the above-mentioned features and thereafter, firing the paste composition.
    Type: Application
    Filed: September 22, 2006
    Publication date: September 10, 2009
    Inventors: Gaochao Lai, Takashi Watsuji, Haruzo Katoh
  • Publication number: 20080302411
    Abstract: Provided are a paste composition making it possible to improve the adhesive property of a backside electrode and restrain an aluminum electrode layer from exfoliating, and a solar cell element having an electrode formed by use of this composition. The paste composition is a paste composition for forming an electrode (8) on a silicon semiconductor substrate (1) which comprises aluminum powder, an organic vehicle, and a tackifier. The solar cell element has the electrode (8) formed by painting a paste composition having the above-mentioned characteristic onto the silicon semiconductor substrate (1) and then firing the resultant.
    Type: Application
    Filed: June 1, 2006
    Publication date: December 11, 2008
    Inventors: Jun Nakahara, Gaochao Lai, Haruzo Katoh, Takashi Watsuji
  • Publication number: 20080135097
    Abstract: Disclosed herein are a paste composition capable of, even when the thickness of a silicon semiconductor substrate (1) is reduced, satisfactorily achieving a desired BSF effect and suppressing the deformation (bow) of the silicon semiconductor substrate (1) occurring after the firing of the paste composition without reducing the mechanical strength of an obtained electrode (8) and the adhesion of the electrode (8) to the silicon semiconductor substrate (1), an electrode (8) formed using the paste composition, and a solar cell element including the electrode (8). The paste composition is used for forming an electrode on a silicon semiconductor substrate (1), and contains aluminum powder, an organic vehicle, and whisker insoluble or hardly-soluble in the organic vehicle, the whisker being previously mixed with the aluminum powder and the organic vehicle.
    Type: Application
    Filed: March 7, 2006
    Publication date: June 12, 2008
    Inventors: Ken Kikuchi, Jun Nakahara, Takashi Watsuji, Gaochao Lai, Kazuhiko Yokoe
  • Patent number: 7380700
    Abstract: The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an excellent outward appearance of a brazed portion after brazing and can be applied to any existing industrial brazing furnaces, as well as a brazing method using the same. The paste composition for brazing comprises a brazing powder, butyl rubber and an organic solvent, wherein the brazing powder comprises at least one member selected from the group consisting of copper brazing powder, brass brazing powder, silver brazing powder, phosphorus copper brazing powder, nickel brazing powder, gold brazing powder, palladium brazing powder, copper-manganese brazing powder, silver-manganese brazing powder and cobalt brazing powder. The paste composition for brazing is applied onto at least a part of a surface of one base material and then the one base material is brazed onto the other base material.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: June 3, 2008
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventor: Takashi Watsuji
  • Patent number: 7368657
    Abstract: A paste composition for forming an electrically conductive layer on a p-type silicon semiconductor substrate comprises aluminum powder, an organic vehicle and powder of at least one inorganic compound selected from a group consisting of an oxide-based inorganic compound and a non-oxide-based inorganic compound. The oxide-based inorganic compound has a thermal expansion coefficient smaller than the thermal expansion coefficient of aluminum and a melting temperature, a softening temperature and a decomposition temperature each higher than the melting point of aluminum. The non-oxide-based inorganic compound has a thermal expansion coefficient smaller than the thermal expansion coefficient of aluminum and at least one of a melting temperature, a softening temperature or a decomposition temperature higher than the melting point of aluminum.
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: May 6, 2008
    Assignees: Toyo Aluminium Kabushiki Kaisha, Sharp Kabushiki Kaisha
    Inventors: Takashi Watsuji, Gao-Chao Lai, Tomohiro Machida, Satoshi Tanaka, Masaomi Hioki
  • Publication number: 20070221270
    Abstract: Provided are: a paste composition which is capable of keeping a desired function for a backside electrode of a solar cell and strengthening the bond between an aluminum electrode layer and a p type silicon semiconductor substrate even if glass frit as a substance giving a bad effect on the environment is not incorporated into the composition or the content of glass frit as a substance giving a bad effect on the environment therein is decreased; and a solar cell element provided with an electrode formed by use of the composition. The paste composition is a paste composition for forming an aluminum electrode layer (8) over a p type silicon semiconductor substrate (1), comprising aluminum powder, an organic vehicle, and a metal alkoxide. The solar cell element provided with the aluminum electrode layer (8) formed by applying the paste composition having the above-mentioned characteristic to the p type silicon semiconductor substrate (1) and then firing the resultant.
    Type: Application
    Filed: June 23, 2005
    Publication date: September 27, 2007
    Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Takashi Watsuji, Haruzo Katoh, Ken Kikuchi
  • Publication number: 20050116208
    Abstract: The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an excellent outward appearance of a brazed portion after brazing and can be applied to any existing industrial brazing furnaces, as well as a brazing method using the same. The paste composition for brazing comprises a brazing powder, butyl rubber and an organic solvent, wherein the brazing powder comprises at least one member selected from the group consisting of copper brazing powder, brass brazing powder, silver brazing powder, phosphorus copper brazing powder, nickel brazing powder, gold brazing powder, palladium brazing powder, copper-manganese brazing powder, silver-manganese brazing powder and cobalt brazing powder. The paste composition for brazing is applied onto at least a part of a surface of one base material and then the one base material is brazed onto the other base material.
    Type: Application
    Filed: March 12, 2003
    Publication date: June 2, 2005
    Inventor: Takashi Watsuji
  • Publication number: 20040003836
    Abstract: A paste composition for forming an electrically conductive layer on a p-type silicon semiconductor substrate comprises aluminum powder, an organic vehicle and powder of at least one inorganic compound selected from a group consisting of an oxide-based inorganic compound and a non-oxide-based inorganic compound. The oxide-based inorganic compound has a thermal expansion coefficient smaller than the thermal expansion coefficient of aluminum and a melting temperature, a softening temperature and a decomposition temperature each higher than the melting point of aluminum. The non-oxide-based inorganic compound has a thermal expansion coefficient smaller than the thermal expansion coefficient of aluminum and at least one of a melting temperature, a softening temperature or a decomposition temperature higher than the melting point of aluminum.
    Type: Application
    Filed: July 2, 2003
    Publication date: January 8, 2004
    Inventors: Takashi Watsuji, Gao-Chao Lai, Tomohiro Machida, Satoshi Tanaka, Masaomi Hioki
  • Patent number: 6497770
    Abstract: A flux-containing composition for brazing aluminum containing a fluoride flux, a binder of an alkyd resin, a mixture of an acrylic resin and a butyl rubber (or a petroleum resin), and/or a polyethylene resin, an organic solvent, and optionally a metallic powder for brazing is easy for handling and plastic working of a product coated with it, gives brazed areas (fillets) of good appearance, has low cost and better operating environment, and is capable of application to members having complicated shapes.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: December 24, 2002
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Takashi Watsuji, Haruzou Katou, Ken Matsumura, Ken Kikuchi
  • Patent number: 6409074
    Abstract: A flux composition for brazing aluminum, comprising a fluoride flux, at least one selected from a butyl rubber and a petroleum resin, and a solvent. The novel flux composition has excellent processing properties and provides brazed areas (fillets) with good appearance.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: June 25, 2002
    Assignee: Toyo Aluminium Kabushiki Kaisha
    Inventors: Haruzo Katoh, Takashi Watsuji, Ken Matsumura
  • Publication number: 20020005230
    Abstract: A flux-containing composition for brazing aluminum comprising:
    Type: Application
    Filed: February 15, 2001
    Publication date: January 17, 2002
    Inventors: Takashi Watsuji, Haruzou Katou, Ken Matsumura, Ken Kikuchi