Patents by Inventor Takashi Wu

Takashi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6967845
    Abstract: An integrated heat dissipating device has a heat sink, a first set of fins, a second set of fins and at least one heat pipe. The heat sink has a thermal conductive block embedded therein and a through hole exposing the thermal conductive block from a top surface of the heat sink. The first set of fins has a plurality of horizontally extending fins stacked with each other along a vertical direction over the heat sink. The second set of fins is integrated by a plurality of vertically extending fins arranged in a curved shape between the heat sink and the first set of fins. The heat pipe has a vertical extension across the first set of fins and a horizontal extension underneath a bottom of the first set of fins. The horizontal extension is inserted into the through hole in contact with the thermal conductive block.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: November 22, 2005
    Assignee: Cpumate Inc.
    Inventors: Tsai Liang Chiang, Takashi Wu
  • Publication number: 20050094375
    Abstract: An integrated heat dissipating device has a heat sink, a first set of fins, a second set of fins and at least one heat pipe. The heat sink has a thermal conductive block embedded therein and a through hole exposing the thermal conductive block from a top surface of the heat sink. The first set of fins has a plurality of horizontally extending fins stacked with each other along a vertical direction over the heat sink. The second set of fins is integrated by a plurality of vertically extending fins arranged in a curved shape between the heat sink and the first set of fins. The heat pipe has a vertical extension across the first set of fins and a horizontal extension underneath a bottom of the first set of fins. The horizontal extension is inserted into the through hole in contact with the thermal conductive block.
    Type: Application
    Filed: November 5, 2003
    Publication date: May 5, 2005
    Inventors: Tsai Chiang, Takashi Wu