Abstract: A resin composition which can be cured by application of heat or irradiation of light, comprising (A) a bismaleimide compound, (C) an acridine compound represented by the formula (1) or (2) as an thermosetting accelerator or a photo-polymerization initiator, and (B) an optional resin ingredient other than (A); a film and laminate produced by using the resin composition; and a method of producing a multilayer wiring board by using the resin composition as a material of insulating layers: ##STR1## wherein R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.7, R.sub.8 and R.sub.9 are hydrogen, a halogen, an alkyl or alkoxy group, R.sub.1 is an alkyl group, and R.sub.10 is an alkylene group.

Abstract: A photolithographically viahole-forming photosensitive element is formed of a light-transmitting base material and a photosensitive resin composition laminated as a layer on the light-transmitting base material. The photosensitive resin composition comprises:(a) 100 parts by weight of a mixture comprising:(a-1) 10 to 90 parts by weight of a rubber,(a-2) 5 to 40 parts by weight of a phenol resin, and(a-3) 10 to 80 parts by weight of an epoxy resin;(b) 1 to 10 parts by weight of an epoxy resin photoinitiator; and(c) 1 to 10 parts by weight of an aromatic polyazide compound.

Abstract: A photosensitive resin composition comprising (a) a polymer obtained by using an aliphatic amino group-containing monomer as a comonomer, (b) an ethylenic unsaturated compound, (c) a photosensitizer and/or a photosensitizer system and (d) an organic halogen compound shows high photosensitivity and excellent resistance to plating and is usable as plating resists or etching resists.