Patents by Inventor Takashige Nishisako

Takashige Nishisako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040245651
    Abstract: A first inventive semiconductor device includes: a die pad 1; a mother chip 2; a daughter chip 3; a conductor film 7 formed on the back surface of the daughter chip 3; bumps 4; a lead 5; and a bonding wire 6, as shown in FIG. 1B. The conductor film 7 is connected to an external member via the bonding wire 6 and the lead 5, thus stabilizing a substrate potential. In addition, the conductor film 7 has a high heat conductivity and a low electrical resistance, thereby improving the heat radiation performance of the semiconductor device and suppressing noise radiation.
    Type: Application
    Filed: June 9, 2003
    Publication date: December 9, 2004
    Inventors: Takashige Nishisako, Yasuhiro Ishiyama, Hisakazu Kotani