Patents by Inventor Takasi Sekiba

Takasi Sekiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip semiconductor chip module
    Patent number: 6287949
    Abstract: A semiconductor device including a plurality of chip units each defined by a side wall and arranged in a state such that a side wall of a chip unit abuts a corresponding side wall of an adjacent chip unit, and an interconnection structure for interconnecting a plurality of terminals of a side wall of a chip unit to corresponding terminals of a side wall of an adjacent chip unit that abuts the chip unit at the respective side walls.
    Type: Grant
    Filed: September 1, 1998
    Date of Patent: September 11, 2001
    Assignee: Fujitsu Limited
    Inventors: Syuji Mori, Takasi Sekiba, Osamu Kudo
  • Multi-chip semiconductor chip module
    Patent number: 5834843
    Abstract: A semiconductor device including a plurality of chip units each defined by a side wall and arranged in a state such that a side wall of a chip unit abuts a corresponding side wall of an adjacent chip unit, and an interconnection structure for interconnecting a plurality of terminals of a side wall of a chip unit to corresponding terminals of a side wall of an adjacent chip unit that abuts the chip unit at the respective side walls.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: November 10, 1998
    Assignee: Fujitsu Limited
    Inventors: Syuji Mori, Takasi Sekiba, Osamu Kudo