Patents by Inventor Takateru Adachi
Takateru Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12002733Abstract: A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.Type: GrantFiled: November 9, 2022Date of Patent: June 4, 2024Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
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Publication number: 20240121909Abstract: A centrifugal fan includes: a fan having a motor that rotates around a central axis, and a plurality of blades provided on an outer periphery of the motor; and a casing which accommodates the fan, and has an intake port provided in the axial direction of the central axis, and an exhaust port provided in a direction orthogonal to the central axis, wherein an end surface of each of the plurality of blades that faces the intake port is provided with an inclined portion that inclines such that a height thereof in the axial direction gradually decreases toward the motor, and the plurality of blades include a plurality of blade groups having different start point positions at which the inclined portions start to incline in a direction from the tips of the blades toward the motor.Type: ApplicationFiled: August 16, 2023Publication date: April 11, 2024Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Junki Hashiba, Shusaku Tomizawa, Takateru Adachi
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Publication number: 20230403823Abstract: A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.Type: ApplicationFiled: April 13, 2023Publication date: December 14, 2023Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Takateru Adachi, Shusaku Tomizawa, Hajime Yoshizawa
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Publication number: 20230207419Abstract: A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.Type: ApplicationFiled: November 9, 2022Publication date: June 29, 2023Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
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Patent number: 10831247Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.Type: GrantFiled: August 8, 2017Date of Patent: November 10, 2020Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Akinori Uchino, Kazuya Tatsuno, Takateru Adachi, Takuroh Kamimura
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Patent number: 10681840Abstract: The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.Type: GrantFiled: June 28, 2018Date of Patent: June 9, 2020Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Tsutomu Chonan, Takuroh Kamimura, Takateru Adachi, Atsushi Ohyama, Shogo Akiyama
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Publication number: 20190313548Abstract: The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.Type: ApplicationFiled: June 28, 2018Publication date: October 10, 2019Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Tsutomu Chonan, Takuroh Kamimura, Takateru Adachi, Atsushi Ohyama, Shogo Akiyama
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Patent number: 9971387Abstract: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.Type: GrantFiled: December 24, 2013Date of Patent: May 15, 2018Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Takuroh Kamimura, Tsutomu Chonan, Takateru Adachi, Kazuya Tatsuno, Shogo Akiyama
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Publication number: 20180088637Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.Type: ApplicationFiled: August 8, 2017Publication date: March 29, 2018Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: AKINORI UCHINO, KAZUYA TATSUNO, TAKATERU ADACHI, TAKUROH KAMIMURA
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Publication number: 20140185231Abstract: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.Type: ApplicationFiled: December 24, 2013Publication date: July 3, 2014Applicant: Lenovo (Singapore) Pte. Ltd.Inventors: Takuroh Kamimura, Tsutomu Chonan, Takateru Adachi, Kazuya Tatsuno, Shogo Akiyama