Patents by Inventor Takateru Adachi

Takateru Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121909
    Abstract: A centrifugal fan includes: a fan having a motor that rotates around a central axis, and a plurality of blades provided on an outer periphery of the motor; and a casing which accommodates the fan, and has an intake port provided in the axial direction of the central axis, and an exhaust port provided in a direction orthogonal to the central axis, wherein an end surface of each of the plurality of blades that faces the intake port is provided with an inclined portion that inclines such that a height thereof in the axial direction gradually decreases toward the motor, and the plurality of blades include a plurality of blade groups having different start point positions at which the inclined portions start to incline in a direction from the tips of the blades toward the motor.
    Type: Application
    Filed: August 16, 2023
    Publication date: April 11, 2024
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Junki Hashiba, Shusaku Tomizawa, Takateru Adachi
  • Publication number: 20230403823
    Abstract: A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.
    Type: Application
    Filed: April 13, 2023
    Publication date: December 14, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Takateru Adachi, Shusaku Tomizawa, Hajime Yoshizawa
  • Publication number: 20230207419
    Abstract: A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.
    Type: Application
    Filed: November 9, 2022
    Publication date: June 29, 2023
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
  • Patent number: 10831247
    Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 10, 2020
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Akinori Uchino, Kazuya Tatsuno, Takateru Adachi, Takuroh Kamimura
  • Patent number: 10681840
    Abstract: The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: June 9, 2020
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tsutomu Chonan, Takuroh Kamimura, Takateru Adachi, Atsushi Ohyama, Shogo Akiyama
  • Publication number: 20190313548
    Abstract: The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.
    Type: Application
    Filed: June 28, 2018
    Publication date: October 10, 2019
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tsutomu Chonan, Takuroh Kamimura, Takateru Adachi, Atsushi Ohyama, Shogo Akiyama
  • Patent number: 9971387
    Abstract: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: May 15, 2018
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Takuroh Kamimura, Tsutomu Chonan, Takateru Adachi, Kazuya Tatsuno, Shogo Akiyama
  • Publication number: 20180088637
    Abstract: There is provided an electronic apparatus that includes a heat radiation unit capable of radiating heat efficiently from a heat pipe. The electronic apparatus includes: a blower fan that blows air toward an exhaust port formed in a main body chassis; a heat radiation fin provided in an air-blowing outlet of the blower fan; and a heat pipe fixed to the heat radiation fin. In a region in contact with the heat pipe, the heat radiation fin is of a partial connection structure in which multiple fin members are partially fixed and connected to one another, and in a region with no contact with the heat pipe, the heat radiation fin is a structure of continuous fins.
    Type: Application
    Filed: August 8, 2017
    Publication date: March 29, 2018
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: AKINORI UCHINO, KAZUYA TATSUNO, TAKATERU ADACHI, TAKUROH KAMIMURA
  • Publication number: 20140185231
    Abstract: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.
    Type: Application
    Filed: December 24, 2013
    Publication date: July 3, 2014
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Takuroh Kamimura, Tsutomu Chonan, Takateru Adachi, Kazuya Tatsuno, Shogo Akiyama