Patents by Inventor Takatomi NISHIDA

Takatomi NISHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230013387
    Abstract: Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.
    Type: Application
    Filed: June 26, 2020
    Publication date: January 19, 2023
    Inventors: Takatomi NISHIDA, Kazuaki HANASAKI, Takashi MINAMIHORI
  • Patent number: 11261358
    Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion. The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: March 1, 2022
    Assignee: Sunstar Engineering Inc.
    Inventors: Kazunobu Takami, Takatomi Nishida
  • Patent number: 10774247
    Abstract: The present invention provides a one-component type thermosetting adhesive composition used as an automotive structural adhesive having high damping performance without reducing adhesive strength and having excellent low-temperature curability and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied. The present invention relates to a one-component type thermosetting adhesive composition comprising an epoxy resin and an amine-based latent curing agent, wherein the epoxy resin comprises: (1) a dibasic acid ester-based epoxy resin, (2) a butadiene-acrylonitrile copolymer modified epoxy resin, and (3) an unmodified bisphenol A type epoxy resin, and wherein a thermally cured product formed from the composition has: a loss tangent tan ? at 23° C. of not less than 0.2 as a damping performance, and a Young's modulus of not less than 50 MPa, and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: September 15, 2020
    Assignees: SUNSTAR ENGINEERING INC., MAZDA MOTOR CORPORATION
    Inventors: Takatomi Nishida, Shohei Yanagisawa, Katsuya Himuro, Kenichi Yamamoto, Motoyasu Asakawa, Tomoya Yoshida
  • Publication number: 20200208029
    Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion. The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.
    Type: Application
    Filed: August 3, 2018
    Publication date: July 2, 2020
    Inventors: Kazunobu TAKAMI, Takatomi NISHIDA
  • Publication number: 20190062611
    Abstract: The present invention provides a one-component type thermosetting adhesive composition used as an automotive structural adhesive having high damping performance without reducing adhesive strength and having excellent low-temperature curability and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied. The present invention relates to a one-component type thermosetting adhesive composition comprising an epoxy resin and an amine-based latent curing agent, wherein the epoxy resin comprises: (1) a dibasic acid ester-based epoxy resin, (2) a butadiene-acrylonitrile copolymer modified epoxy resin, and (3) an unmodified bisphenol A type epoxy resin, and wherein a thermally cured product formed from the composition has: a loss tangent tan ? at 23° C. of not less than 0.2 as a damping performance, and a Young's modulus of not less than 50 MPa, and a body structure for vehicle, on which the one-component type thermosetting adhesive composition is applied.
    Type: Application
    Filed: August 23, 2018
    Publication date: February 28, 2019
    Inventors: Takatomi NISHIDA, Shohei YANAGISAWA, Katsuya HIMURO, Kenichi YAMAMOTO, Motoyasu ASAKAWA, Tomoya YOSHIDA