Patents by Inventor Takatomo ISOMURA
Takatomo ISOMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136451Abstract: A light receiving device comprises a condensing lens, a lens holder for mounting the condensing lens, a semiconductor light receiving element, and a lens holder, and the light transmitted through the condensing lens enters the semiconductor light receiving element via the optical path section in the lens holder. The condensing lens is a compound eye lens with a plurality of convex lens surfaces on one side, and the lens holder connects the condensing lens to the semiconductor light receiving element, and has a cylindrical reflective surface facing the optical path section formed in such a way that the diameter and a diameter decreasing rate become smaller as it approaches the semiconductor light receiving element.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Applicant: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Takatomo ISOMURA, Etsuji OMURA
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Publication number: 20240128385Abstract: In the light receiving device 1 comprising a condensing lens, a lens holder for fixing the condensing lens, a semiconductor light receiving element, and a base for fixing the semiconductor light receiving element and the lens holder, wherein the light passing through the condensing lens enters the semiconductor light receiving element through the optical path in the lens holder. The condensing lens is a compound eye lens with a plurality of convex lens surfaces on one side, and the lens holder has a cylindrical reflective surface facing the optical path section formed in the shape of a truncated cone, the diameter of which decreases as it approaches the condensing lens. A part of light passing through the condensing lens is reflected by the reflective surface to enter the semiconductor light receiving element.Type: ApplicationFiled: December 26, 2023Publication date: April 18, 2024Applicant: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Takatomo ISOMURA, Etsuji OMURA
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Publication number: 20240021748Abstract: An optical power supply converter that photoelectrically converts light incident through optical fiber cables is provided with; a reflecting section having a concave reflecting mirror formed with a partially concave surface of an ellipsoid of revolution rotated about a major axis passing through first and second focuses of the ellipse; a light receiving element for photoelectric conversion disposed at the first focus; and an incident portion disposed near the second focus for attaching emitting ends of optical fiber cables that emit light toward the concave reflecting mirror through the second focus.Type: ApplicationFiled: July 30, 2023Publication date: January 18, 2024Applicant: KYOTO SEMICONDUCTOR CO., LTDInventors: Takatomo ISOMURA, Etsuji OMURA
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Patent number: 11843262Abstract: An optical power supply converter (1) that photoelectrically converts light from optical fiber cables comprises a reflecting unit (3) including a concave reflecting mirror (6) made of a rotating paraboloid, a light receiving element (2) including a light receiving surface (2a) at the focus of the mirror (6) orthogonal to the rotation axis of the mirror (6), and a plurality of mounting portions (9) for mounting the emitting ends (OE) of the fiber cables. The seperation distance (s), the shift distance (h) and the divergence angle (?) are set appropriately so as to concentrate all reflected light on the light receiving surface (2a).Type: GrantFiled: February 22, 2021Date of Patent: December 12, 2023Assignee: Kyoto Semiconductor Co., Ltd.Inventors: Takatomo Isomura, Etsuji Omura
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Publication number: 20230352604Abstract: A semiconductor light receiving device (1A, 1B) having a semiconductor substrate (2) transparent to incident light in an infrared region for optical communications, a light receiving portion (6) with a light absorption layer (4) on a first surface (2a) side of the semiconductor substrate (2) to absorb the incident light, and an anti-reflection portion (11, 21) in an irradiation region (10) where incident light transmitted through the light absorption layer (4) reaches on a second surface (2b) side of the semiconductor substrate (2), the anti-reflection portion (11, 21) is formed on the second surface (2b) of the semiconductor substrate (2) by layering a first metal film (12) having a real part and imaginary part of a complex refractive index of 3 or more and 5 or less, respectively, a dielectric film (13) having a refractive index of 2 or less, and a second metal film (14).Type: ApplicationFiled: July 6, 2023Publication date: November 2, 2023Applicant: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Takatomo ISOMURA, Etsuji Omura
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Publication number: 20230179027Abstract: An optical power supply converter (1) that photoelectrically converts light from optical fiber cables comprises a reflecting unit (3) including a concave reflecting mirror (6) made of a rotating paraboloid, a light receiving element (2) including a light receiving surface (2a) at the focus of the mirror (6) orthogonal to the rotation axis of the mirror (6), and a plurality of mounting portions (9) for mounting the emitting ends (OE) of the fiber cables. The seperation distance (s), the shift distance (h) and the divergence angle (?) are set appropriately so as to concentrate all reflected light on the light receiving surface (2a).Type: ApplicationFiled: February 22, 2021Publication date: June 8, 2023Inventors: Takatomo ISOMURA, Etsuji OMURA
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Publication number: 20230049438Abstract: The end-face incident type semiconductor light receiving device has a first light absorbing region on the main surface side of the semiconductor substrate and causes light incident from the end-face of the semiconductor substrate to enter the first light absorbing region by reflection or refraction, and the first reflective section is provided on the main surface side of the semiconductor substrate to cause light transmitted through the light absorbing region to enter the first light absorbing region, and a single second reflective section is provided on the back surface for causing the light reflected by the first reflective section and transmitted through the first light absorbing region to reflect directly toward the first light absorbing region.Type: ApplicationFiled: November 3, 2022Publication date: February 16, 2023Applicant: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Takatomo ISOMURA, Etsuji OMURA
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Patent number: 11276790Abstract: A semiconductor light receiving element of back-illuminated type comprises a light absorbing portion formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light, and a first convex lens portion larger than the light absorbing portion and having a radius of curvature R1 formed on a back surface of the semiconductor substrate, a second convex lens portion smaller than the light absorbing portion and having a radius of curvature R2 smaller than the radius of curvature R1; the second convex lens portion formed on the first convex lens portion and having a focal point between the second convex lens portion and the light absorbing portion; light incident on the second convex lens portion is diffused from the focal point toward the light absorbing portion.Type: GrantFiled: February 1, 2018Date of Patent: March 15, 2022Assignee: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Takatomo Isomura, Etsuji Omura
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Patent number: 11276791Abstract: In an edge incident type semiconductor light receiving device that reflects light incident parallel to the main surface of the semiconductor substrate opaque to the incident light to the light receiving section on the main surface side, a light guide section is formed to expose the light receiving section along the light incident direction from the light incident side end of the semiconductor substrate, and in order to guide the light incident on the light guide section to the light receiving section, a light reflection section having a given crossing angle with the main surface is provided at the end of the light guide section in the light incident direction.Type: GrantFiled: June 4, 2020Date of Patent: March 15, 2022Assignee: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Takatomo Isomura, Etsuji Omura
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Publication number: 20210384365Abstract: In an edge incident type semiconductor light receiving device that reflects light incident parallel to the main surface of the semiconductor substrate opaque to the incident light to the light receiving section on the main surface side, a light guide section is formed to expose the light receiving section along the light incident direction from the light incident side end of the semiconductor substrate, and in order to guide the light incident on the light guide section to the light receiving section, a light reflection section having a given crossing angle with the main surface is provided at the end of the light guide section in the light incident direction.Type: ApplicationFiled: June 4, 2020Publication date: December 9, 2021Inventors: Takatomo ISOMURA, Etsuji OMURA
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Patent number: 11145770Abstract: A semiconductor light receiving element comprises a light absorption region formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light; an incident region set to be concentric with and larger than the light absorption region; and a partially spherical concave reflecting portion formed on a back surface of the semiconductor substrate and capable of reflecting incident light incident on the incident region from the main surface side toward the light absorbing region; wherein, when the radius of curvature of the portion is R, the diameter of the incident region is B, the distance between the light absorbing region and the concave reflecting portion is W, and the diameter of the light absorbing region is P, then the radius of curvature R satisfies a condition of 2 BW/(B?P/2)?R?2BW/(B?P).Type: GrantFiled: February 1, 2018Date of Patent: October 12, 2021Assignee: Kyoto Semiconductor Co., Ltd.Inventors: Ken Usui, Takatomo Isomura, Etsuji Omura
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Publication number: 20210193850Abstract: A semiconductor light receiving element of back-illuminated type comprises a light absorbing portion formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light, and a first convex lens portion larger than the light absorbing portion and having a radius of curvature R1 formed on a back surface of the semiconductor substrate, a second convex lens portion smaller than the light absorbing portion and having a radius of curvature R2 smaller than the radius of curvature R1; the second convex lens portion formed on the first convex lens portion and having a focal point between the second convex lens portion and the light absorbing portion; light incident on the second convex lens portion is diffused from the focal point toward the light absorbing portion.Type: ApplicationFiled: February 1, 2018Publication date: June 24, 2021Inventors: Takatomo ISOMURA, Etsuji OMURA
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Publication number: 20210083131Abstract: An end surface incident-type light receiving element according to an aspect of the present disclosure is made of a semiconductor material, and includes an upper surface and a lower surface that are opposite to each other in the vertical direction, and an end surface that couples the upper surface and the lower surface and is to be arranged on a light source side, the light source side being a side from which the light source emits light. At least a portion of the end surface is inclined relative to the vertical direction such that the lower surface side is arranged closer to the light source than the upper surface side is. The lower surface is provided with one or more grooves. The inclined surfaces on the end surface side of one or more grooves are arranged so as to reflect incident light that is emitted from the light source and passes through the end surface.Type: ApplicationFiled: August 31, 2017Publication date: March 18, 2021Applicant: KYOTO SEMICONDUCTOR CO., LTD.Inventors: Etsuji OMURA, Takatomo ISOMURA, Ken USUI
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Publication number: 20200365745Abstract: A semiconductor light receiving element comprises a light absorption region formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light; an incident region set to be concentric with and larger than the light absorption region; and a partially spherical concave reflecting portion formed on a back surface of the semiconductor substrate and capable of reflecting incident light incident on the incident region from the main surface side toward the light absorbing region; wherein, when the radius of curvature of the portion is R, the diameter of the incident region is B, the distance between the light absorbing region and the concave reflecting portion is W, and the diameter of the light absorbing region is P, then the radius of curvature R satisfies a condition of 2BW/(B?P/2)?R?2BW/(B?P).Type: ApplicationFiled: February 1, 2018Publication date: November 19, 2020Inventors: Ken USUI, Takatomo ISOMURA, Etsuji OMURA