Patents by Inventor Takatoshi Hagiwara

Takatoshi Hagiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, and a method of producing semiconductor device
    Publication number: 20030153134
    Abstract: A method for manufacturing a semiconductor device including providing first and second semiconductor chips each having a main surface having a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface. A first lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions. After electrically connecting the external terminals to the inner portions of the lead frames and resin-sealing the first and second semiconductor chips so that the first and second lead frames are superimposed, the frame body of the second lead frame is removed and a first processing fluid is applied to the outer portions of the first lead frame and the second lead frame.
    Type: Application
    Filed: February 27, 2003
    Publication date: August 14, 2003
    Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
  • Method of producing a semiconductor device having two semiconductor chips sealed by a resin
    Patent number: 6551858
    Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: April 22, 2003
    Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.
    Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
  • Semiconductor device with two stacked chips in one resin body and method of producing
    Patent number: 6479322
    Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: November 12, 2002
    Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.
    Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
  • Semiconductor device, and a method of producing semiconductor device
    Publication number: 20020119598
    Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.
    Type: Application
    Filed: April 29, 2002
    Publication date: August 29, 2002
    Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
  • Semiconductor device with two stacked chips in one resin body and method of producing
    Patent number: 6410365
    Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: June 25, 2002
    Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.
    Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
  • Semiconductor device, and a method of producing semiconductor device
    Publication number: 20020064903
    Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.
    Type: Application
    Filed: January 2, 2002
    Publication date: May 30, 2002
    Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara