Patents by Inventor Takatoshi Kawamura

Takatoshi Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9576927
    Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: February 21, 2017
    Assignee: SHINKAWA LTD.
    Inventors: Osamu Kakutani, Takatoshi Kawamura, Kohei Seyama, Akira Sato
  • Publication number: 20150333032
    Abstract: A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.
    Type: Application
    Filed: June 5, 2015
    Publication date: November 19, 2015
    Inventors: OSAMU KAKUTANI, TAKATOSHI KAWAMURA, KOHEI SEYAMA, AKIRA SATO
  • Patent number: 6861018
    Abstract: Heat-up characteristics are obtained individually for a plurality of heat zones of an injection molding machine. A heat-up time is obtained from the heat-up characteristic of each heat zone and the difference between a preset temperature and an actual temperature. A heat zone that requires the longest heat-up time is specified. Heat-up of each heat zone is controlled in accordance with the longest heat-up time.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: March 1, 2005
    Assignee: Fanuc LTD
    Inventors: Hideki Koyama, Takatoshi Kawamura, Hiromasa Otake
  • Patent number: 6651868
    Abstract: A retaining device for holding at a place a workpiece such as a lead frame including a pair of first slits formed so as to surround the bonding window opened in the retainer. Furthermore, second slits are formed so as to extend to the outside from the end portions of the first slits, thus forming first connecting areas; and third slits are formed on the outside of the second slits so as to be perpendicular to the first connecting areas, thus forming second connecting areas.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: November 25, 2003
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Takatoshi Kawamura
  • Publication number: 20030047828
    Abstract: Heat-up characteristics are obtained individually for a plurality of heat zones of an injection molding machine. A heat-up time is obtained from the heat-up characteristic of each heat zone and the difference between a preset temperature and an actual temperature. A heat zone that requires the longest heat-up time is specified. Heat-up of each heat zone is controlled in accordance with the longest heat-up time.
    Type: Application
    Filed: August 20, 2002
    Publication date: March 13, 2003
    Applicant: Fanuc Ltd.
    Inventors: Hideki Koyama, Takatoshi Kawamura, Hiromasa Otake
  • Patent number: 6439496
    Abstract: A spool holder structure used in, for instance, a bonding apparatus and equipped with a spool holder that holds a spool around which a wire is wound, a holder shaft which is fastened to the inner circumference of the spool holder, a holder fastening shaft made of an insulating material and fastened to the inner circumference of the holder shaft, and a motor that has an output shaft fastened to the holder fastening shaft, in which the holder shaft is fastened to an attachment plate of, for instance, the bonding apparatus via a conductive bearing so that the holder shaft is rotatable, and the conductive bearing is grounded.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: August 27, 2002
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Yoshimitsu Terakado, Takatoshi Kawamura, Tadashi Akiike
  • Publication number: 20020096552
    Abstract: A retaining device for holding at a place a workpiece such as a lead frame including a pair of first slits formed so as to surround the bonding window opened in the retainer. Furthermore, second slits are formed so as to extend to the outside from the end portions of the first slits, thus forming first connecting areas; and third slits are formed on the outside of the second slits so as to be perpendicular to the first connecting areas, thus forming second connecting areas.
    Type: Application
    Filed: January 16, 2002
    Publication date: July 25, 2002
    Applicant: KABUSDHIKI KAISHA SHINKAWA
    Inventor: Takatoshi Kawamura
  • Publication number: 20010002038
    Abstract: A spool holder structure used in, for instance, a bonding apparatus and equipped with a spool holder that holds a spool around which a wire is wound, a holder shaft which is fastened to the inner circumference of the spool holder, a holder fastening shaft made of an insulating material and fastened to the inner circumference of the holder shaft, and a motor that has an output shaft fastened to the holder fastening shaft, in which the holder shaft is fastened to an attachment plate of, for instance, the bonding apparatus via a conductive bearing so that the holder shaft is rotatable, and the conductive bearing is grounded.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 31, 2001
    Applicant: KABUSHIKI KAISHA SHINKAWA
    Inventors: Yoshimitsu Terakado, Takatoshi Kawamura, Tadashi Akiike
  • Patent number: 5320315
    Abstract: A microscope mount for mounting a microscope, which is used for observation of bonding conditions, etc., to a bonding machine including a supporting shaft, a microscope attachment shaft and a pair of swing plates rotatably connected to the supporting shaft at one end and to the microscope attachment shaft at the other end. Pulleys are fixed on the shafts, and a belt is installed between the pulleys. A microscope is mounted on the microscope attachment shaft, and the mount is attached to the bonding machine. When in this state the mount is rotated about the supporting shaft, the facing direction of the microscope on the attachment shaft can be kept the same.
    Type: Grant
    Filed: February 27, 1992
    Date of Patent: June 14, 1994
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Takatoshi Kawamura, Takashi Takeuchi