Abstract: A moving environment system capable of opening a door in a state in which a robot is away from the door by an appropriate distance while also reducing unnecessary opening of the door is provided. A moving environment system includes: an autonomous mobile robot; and an automatic door including a sensor configured to detect an object that has entered a predetermined detection area, in which the detection area includes a detection area for a passerby and a detection area for an autonomous mobile robot, the detection area for the autonomous mobile robot is set so as to include an area through which a frequency of people passing is equal to or smaller than a predetermined frequency, and the autonomous mobile robot passes through the automatic door via the detection area for the autonomous mobile robot.

Abstract: A rotatable polygon mirror includes a plurality of reflecting surfaces provided in parallel to a rotational axis direction, first surface and second surface of polygonal shape perpendicular to the plurality of reflecting surface and of which each side is continued to the plurality of reflecting surfaces. The second surface is opposite to the first surface. A through hole penetrates though the first and second surfaces in parallel to the rotational axis direction and to engage with a rotational shaft of a driving portion. As seen in the rotational axis direction, the through hole has substantially similar shape to the polygonal shape of the first and the second surfaces, and vertexes of the similar shape of the through hole are different in phase from apexes of the polygonal shape of the first and second surfaces with respect to a rotational direction of the polygon mirror.

Abstract: An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.

Abstract: A semiconductor device is formed of a casing, a substrate situated in the casing, at least one semiconductor chip fixed on the substrate, and at least one lead-out terminal for connecting the semiconductor chip to outside. The lead-out terminal includes a soldered portion soldered to the substrate, and a fixed portion fixed to the casing. A stress relaxing device or cutout is formed between the soldered portion and the fixed portion of the lead-out terminal to relieve stress along three axial directions orthogonal to each other. Thus, the crack formation is prevented in the soldered portion of the lead-out terminal while the resistance and impedance of the lead-out terminal are maintained at low values.

Abstract: A cleanser composition comprising a phosphate type surfactant and an amide ether carboxylic acid as the essential components. This cleanser composition is lowly irritant to the skin etc., and excellent in lathering property, gives creamy foam in quality, and can give an excellent feeling to the skin cleansed even when it is used in hard water.

Abstract: A semiconductor module includes a ceramic substrate for mounting plural semiconductor chips. Even if cracks and cleavages are formed in the ceramic substrate, further damages, such as lowering dielectric or insulation strength is prevented. The semiconductor module includes IGBTs arranged on one ceramic substrate soldered to a metal base plate, and the upper surface of the ceramic substrate is divided into zones. On each zone, a copper foil with one IGBT is mounted. A snap line is formed between the zones to localize the cracks and cleavages formed by bending stress to the snap line. The copper foils on the zones are connected to each other by a conductor bridge disposed over the snap line.

Abstract: A cleanser composition comprising an alkylphosphate type surfactant and an ether acetic acid type surfactant represented by the following formula (3) :R.sup.4 --O--(CH.sub.2 CH.sub.2 O).sub.p --CH.sub.2 CO.sub.2 X.sup.3(3)wherein R.sup.4 represents an alkyl or alkenyl group having 8 to 18 carbon atoms, X.sup.3 represents a hydrogen atom, an alkali metal atom, a triethanolammonium group or an ammonium group, and p represents a number of 3 to 15.The cleanser composition is excellent in cleansing property of the skin and hair, and low irritant. Further, even when the cleanser composition contains a phosphate salt in a concentration of 30% by weight or above, the viscosity of the composition is not increased and the incorporation of a third component thereinto is easy.

Abstract: A liquid-absorbent composite comprises (a) a water-absorbent polymer, (b) a water-insoluble inorganic material and (c) a water-insoluble hydrophilic fibrous material at a weight ratio between (a), (b) and (c) in the range of 100:5-1200:5-1200. It is very useful as the absorbent component for a sanitary napkin and a medical pad.

Abstract: An absorbent article using, as a surface material (or a liquid-permeable top sheet), a nonwoven fabric is disclosed, the nonwoven fabric containing at least 10% by weight of a conjugate fiber comprising first and second parts differing from each other, wherein the second part covers at least a part of the first part, at least the first part contains an inorganic component in a proportion higher than that contained in the second part, and the content of the inorganic component in the first part is at least 1.5% by weight based on the weight of the first part. The nonwoven fabric has excellent cutting properties while retaining satisfactory strength, absorbency and touch.

Abstract: A sanitary article comprises an absorbent and a sheet of a surface material to envelop the absorbent, the sheet comprising an opaque, hydrophobic film, having recesses in its land portion, the recesses being formed to have a bottom and side walls, the side walls having a slanting part, the slanting part being provided therein with an opening so that the slanting part having the opening may not be covered with the land portion.

Abstract: An absorbent article comprising a surface material, a liquid-impermeable backing material and an absorbent located therebetween, wherein said surface material comprises a liquid-retentive structure body with a three-dimensional skeleton structure having an average interskeleton distance of from 150 to 700 .mu.m and a hydrophobic film being integrally provided with the liquid-retentive structure body so as to form a skin-contact face, and have openings penetrating through the liquid-retentive structure body and the hydrophobic film is disclosed. An absorbent article comprising an absorbent and the above-mentioned surface material is also disclosed.

Abstract: An absorbent article comprises a liquid-permeable surface sheet, a liquid-impermeable leak-proof sheet and an absorbent layer disposed between the two sheets, said leak-proof sheet having on the outside surface a composite comprising a hydrophobic polymer having a glass transition temperature of zero degree centigrade or lower and foamed beads of a polymer. It is improved in the anti-slipping property, the leak-proof property and the permeability to moisture.

Abstract: An absorbent composition having excellent stability comprising an absorbent resin and 0.01 to 30 percent by weight, based on the dried weight of said absorbent resin, of a radical chain terminator.

Abstract: A highly absorptive resin is produced by crosslinking a starting polymer being hydrophilic, having a carboxylic group or a carboxylate group, having a water content of 10 to 40 percent by weight, with a polyglycidyl ether having 4 or more epoxy groups, being water-soluble. The resin has a long life in absorption.