Patents by Inventor Takatoshi Masuda

Takatoshi Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230156997
    Abstract: A memory unit having a plurality of memory chips comprises: the memory unit that has a plurality of memory chips that are stacked; and protruding terminals that are disposed protruding from a side surface along the stacking direction of the memory unit, wherein the protruding terminals have surfaces that are positioned in a direction orthogonal to the protrusion direction, and between said surfaces, the surface roughness of a surface facing one way is greater than the surface roughness of a surface facing the other way.
    Type: Application
    Filed: April 3, 2020
    Publication date: May 18, 2023
    Inventors: Fumitake OKUTSU, Takatoshi MASUDA
  • Patent number: 11616407
    Abstract: Provided is a segment-core coupled body, including a plurality of segment cores each including a core back and a tooth; and a plurality of coupling portions configured to couple the core backs to one another, wherein the plurality of segment cores and the plurality of coupling portions are each a laminated body of magnetic sheets, wherein the plurality of coupling portions each include: a posture holding portion adjacent to a gap defined between adjacent core backs; a first thin portion configured to couple one corner portion of the adjacent core backs and the posture holding portion; and a second thin portion configured to couple another corner portion of the adjacent core backs and the posture holding portion, and wherein, the posture holding portion projects toward a radially outer side with respect to the adjacent core backs.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: March 28, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tatsuro Hino, Akira Hashimoto, Yutaka Hirota, Masashi Nakamura, Takatoshi Masuda
  • Publication number: 20220223531
    Abstract: A semiconductor module that can absorb thermal stress, and a manufacturing method therefor are provided. A semiconductor module includes a film interposer that includes a plurality of through electrodes which run in the thickness direction; a logic chip that is disposed on one surface side of the film interposer, and is connected electrically to the through electrodes; and a RAM unit that is a RAM module disposed on the other surface side of the film interposer, and connected electrically to the logic chip via the through electrodes.
    Type: Application
    Filed: May 31, 2019
    Publication date: July 14, 2022
    Inventors: Takatoshi MASUDA, Fumitake OKUTSU
  • Patent number: 11095173
    Abstract: A stator core of a rotary electric machine includes: an outer core that is an annular back yoke portion; and an inner core in which a plurality of teeth are radially arranged and inner side end portions of the teeth adjacent to each other in a circumferential direction are connected to each other in the circumferential direction by connection portions and which is fitted to an inner side of the outer core, each connection portion has a hole penetrating in an axial direction, each connection portion is split into a plurality of sections by the hole, a width in a radial direction of the one connection portion at a portion of the connection portion that has a smallest width in the radial direction is equal to or greater than ¼ and less than ½ of a sheet thickness of each of sheets.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: August 17, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Kawamura, Akira Hashimoto, Hiroyuki Akita, Sachiko Kawasaki, Naohiro Motoishi, Takatoshi Masuda
  • Patent number: 10886823
    Abstract: A first terminal portion of a first terminal wire of one divisional coil, and a second terminal portion of a second terminal wire of another divisional coil, extend from the entrance side or the bottom side of a slot so as to be directed upward in the axial direction and arranged side by side in the radial direction of a stator on the upper side in the axial direction of a stator core. The end of the first terminal portion and the end of the second terminal portion are joined to each other by a joining part. At least one of the first terminal portion and the second terminal portion leading to the joining part has an engagement portion for positioning the first terminal portion and the second terminal portion with each other in the circumferential direction and the radial direction.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: January 5, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Kawamura, Naohiro Motoishi, Takatoshi Masuda
  • Patent number: 10756588
    Abstract: A stator coil is formed by: combining a first division coil which is a coil with two or more turns and disposed in slots and in which a first terminal end portion and a second terminal end portion are formed, a second division coil which is a coil with a number of winding turns decreased from that of the first division coil by 0.5 turns and disposed in the slots and in which a first terminal end portion is formed, and a joint coil which is a coil with one turn and disposed in the slots and in which a first terminal end portion and a second terminal end portion are formed so as to be extended to the outside; and selectively joining the terminal end portions of these coils.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: August 25, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Kawamura, Naohiro Motoishi, Takatoshi Masuda
  • Publication number: 20200251968
    Abstract: Provided is a segment-core coupled body, including a plurality of segment cores each including a core back and a tooth; and a plurality of coupling portions configured to couple the core backs to one another, wherein the plurality of segment cores and the plurality of coupling portions are each a laminated body of magnetic sheets, wherein the plurality of coupling portions each include: a posture holding portion adjacent to a gap defined between adjacent core backs; a first thin portion configured to couple one corner portion of the adjacent core backs and the posture holding portion; and a second thin portion configured to couple another corner portion of the adjacent core backs and the posture holding portion, and wherein, the posture holding portion projects toward a radially outer side with respect to the adjacent core backs.
    Type: Application
    Filed: August 22, 2018
    Publication date: August 6, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tatsuro HINO, Akira HASHIMOTO, Yutaka HIROTA, Masashi NAKAMURA, Takatoshi MASUDA
  • Publication number: 20190260251
    Abstract: A stator coil is formed by: combining a first division coil which is a coil with two or more turns and disposed in slots and in which a first terminal end portion and a second terminal end portion are formed, a second division coil which is a coil with a number of winding turns decreased from that of the first division coil by 0.5 turns and disposed in the slots and in which a first terminal end portion is formed, and a joint coil which is a coil with one turn and disposed in the slots and in which a first terminal end portion and a second terminal end portion are formed so as to be extended to the outside; and selectively joining the terminal end portions of these coils.
    Type: Application
    Filed: June 5, 2017
    Publication date: August 22, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Koji KAWAMURA, Naohiro MOTOISHI, Takatoshi MASUDA
  • Publication number: 20190097502
    Abstract: A first terminal portion of a first terminal wire of one divisional coil, and a second terminal portion of a second terminal wire of another divisional coil, extend from the entrance side or the bottom side of a slot so as to be directed upward in the axial direction and arranged side by side in the radial direction of a stator on the upper side in the axial direction of a stator core. The end of the first terminal portion and the end of the second terminal portion are joined to each other by a joining part. At least one of the first terminal portion and the second terminal portion leading to the joining part has an engagement portion for positioning the first terminal portion and the second terminal portion with each other in the circumferential direction and the radial direction.
    Type: Application
    Filed: March 3, 2017
    Publication date: March 28, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji KAWAMURA, Naohiro MOTOISHI, Takatoshi MASUDA
  • Publication number: 20190036390
    Abstract: A stator core of a rotary electric machine includes: an outer core that is an annular back yoke portion; and an inner core in which a plurality of teeth are radially arranged and inner side end portions of the teeth adjacent to each other in a circumferential direction are connected to each other in the circumferential direction by connection portions and which is fitted to an inner side of the outer core, each connection portion has a hole penetrating in an axial direction, each connection portion is split into a plurality of sections by the hole, a width in a radial direction of the one connection portion at a portion of the connection portion that has a smallest width in the radial direction is equal to or greater than ¼ and less than ½ of a sheet thickness of each of sheets.
    Type: Application
    Filed: February 22, 2017
    Publication date: January 31, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Kawamura, Akira Hashimoto, Hiroyuki Akita, Sachiko Kawasaki, Naohiro Motoishi, Takatoshi Masuda
  • Publication number: 20180331605
    Abstract: Each pair of the forming die and the clamping die holding a straight portion of a plane-bent intermediate coil from both sides in the circumferential direction have equal widths in the radial direction of the coil forming device, and the forming dies and the clamping dies holding a plurality of the straight portions disposed from an inner peripheral side of the coil forming device toward an outer peripheral side of the coil forming device are disposed alternately in the circumferential direction with the straight portions interposed therebetween.
    Type: Application
    Filed: May 11, 2016
    Publication date: November 15, 2018
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Naohiro MOTOISHI, Koji KAWAMURA, Takatoshi MASUDA, Yuji TAKIZAWA
  • Publication number: 20180006512
    Abstract: Provided are: a back yoke portion formed in an annular shape; a plurality of tooth portions arranged annularly on an inner periphery of the back yoke portion and forming a plurality of slots that are spaced apart in a circumferential direction and open on an outer peripheral side, the plurality of tooth portions being fitted to an inner peripheral surface of the back yoke portion; a coil housed in the plurality of slots; and a wedge disposed between the coil and the back yoke portion, at an opening of each of the plurality of slots.
    Type: Application
    Filed: January 29, 2016
    Publication date: January 4, 2018
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hironori TSUIKI, Koji KAWAMURA, Takatoshi MASUDA
  • Patent number: 9159622
    Abstract: A dividing method for a wafer includes a step of irradiating a laser beam along streets to form modified regions in an inside of a wafer, a step of dividing the wafer into individual chips beginning with starting points given by the modified regions, a step of placing a processing chamber in which the wafer is charged to a vacuum state and fill the processing chamber with inert gas, and a step of introducing etching gas into the processing chamber filled with the inert gas to etch side faces of the chips.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: October 13, 2015
    Assignee: Disco Corporation
    Inventors: Sakae Matsuzaki, Takatoshi Masuda, Nozomi Maemoto, Yu Yoshino, Takehiko Senoo, Toshihiro Aida, Tomoya Biro
  • Publication number: 20150044857
    Abstract: A dividing method for a wafer includes a step of irradiating a laser beam along streets to form modified regions in an inside of a wafer, a step of dividing the wafer into individual chips beginning with starting points given by the modified regions, a step of placing a processing chamber in which the wafer is charged to a vacuum state and fill the processing chamber with inert gas, and a step of introducing etching gas into the processing chamber filled with the inert gas to etch side faces of the chips.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 12, 2015
    Inventors: Sakae Matsuzaki, Takatoshi Masuda, Nozomi Maemoto, Yu Yoshino, Takehiko Senoo, Toshihiro Aida, Tomoya Biro
  • Publication number: 20140209240
    Abstract: A vacuum processing apparatus for processing a workpiece under vacuum. The vacuum processing apparatus includes a housing having a first vacuum chamber for processing the workpiece and a second vacuum chamber partitioned from the first vacuum chamber by a partition wall and communicating with the first vacuum chamber through a communication opening formed in the partition wall, a shutter for closing the communication opening of the partition wall, a gate for closing a workpiece load/unload opening communicating with the second vacuum chamber, a workpiece holding unit provided in the first vacuum chamber for holding the workpiece, a processing unit for processing the workpiece held by the workpiece holding unit, a first evacuating unit for evacuating the first vacuum chamber, and a second evacuating unit for evacuating the second vacuum chamber.
    Type: Application
    Filed: January 30, 2014
    Publication date: July 31, 2014
    Applicant: Disco Corporation
    Inventors: Sakae Matsuzaki, Takatoshi Masuda
  • Patent number: 8716914
    Abstract: In a vehicle AC generator, a stator core (42) is formed by laminating thin steel sheets, the stator core (42) being provided with a plurality of slot portions (43) which accommodate a stator winding (41) and tooth portions (44) which define adjacent ones of the slot portions; the stator winding (41) is disposed in the slot portions to constitute a stator (4); the stator core (42) is filled with varnish (45) between laminates of each tooth (44) at least in an inner diameter end surface region which faces the rotor (3) and is coated with epoxy resin varnish (46) on the tooth surface of the inner diameter end surface region to form an anti-rust film.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: May 6, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazunori Tanaka, Takatoshi Masuda
  • Patent number: 8415232
    Abstract: A wafer is divided into individual devices along division lines formed on the front side of the wafer. The devices are respectively formed in a plurality of regions partitioned by the division lines. A protective member is provided on the front of the wafer, and the back of the wafer is ground to a predetermined thickness. A laser beam is applied to the wafer from the back side of the wafer along the division lines with the focal point of the laser beam set inside the wafer at a position corresponding to each division line, thereby forming a plurality of modified layers inside the wafer along the division lines. The wafer is divided along the modified layers into the individual devices, and the back side of the wafer is ground to remove the modified layers and reduce the thickness of each device to the finished thickness.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: April 9, 2013
    Assignee: Disco Corporation
    Inventors: Keiichi Kajiyama, Takatoshi Masuda
  • Publication number: 20120100694
    Abstract: A wafer is divided into individual devices along division lines formed on the front side of the wafer. The devices are respectively formed in a plurality of regions partitioned by the division lines. A protective member is provided on the front of the wafer, and the back of the wafer is ground to a predetermined thickness. A laser beam is applied to the wafer from the back side of the wafer along the division lines with the focal point of the laser beam set inside the wafer at a position corresponding to each division line, thereby forming a plurality of modified layers inside the wafer along the division lines. The wafer is divided along the modified layers into the individual devices, and the back side of the wafer is ground to remove the modified layers and reduce the thickness of each device to the finished thickness.
    Type: Application
    Filed: October 20, 2011
    Publication date: April 26, 2012
    Applicant: DISCO CORPORATION
    Inventors: Keiichi Kajiyama, Takatoshi Masuda
  • Publication number: 20120062065
    Abstract: In a vehicle AC generator, a stator core (42) is formed by laminating thin steel sheets, the stator core (42) being provided with a plurality of slot portions (43) which accommodate a stator winding (41) and tooth portions (44) which define adjacent ones of the slot portions; the stator winding (41) is disposed in the slot portions to constitute a stator (4); the stator core (42) is filled with varnish (45) between laminates of each tooth (44) at least in an inner diameter end surface region which faces the rotor (3) and is coated with epoxy resin varnish (46) on the tooth surface of the inner diameter end surface region to form an anti-rust film.
    Type: Application
    Filed: June 23, 2009
    Publication date: March 15, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazunori Tanaka, Takatoshi Masuda
  • Patent number: 8100742
    Abstract: A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding ring is passed through the center of the wafer, and feeding the grinding ring in a direction perpendicular to the chuck table; a wafer positioning step for positioning the upper surface of an outer circumferential portion of the wafer directly below the locus of rotation of the grinding ring; and a second grinding step for grinding the upper surface of the wafer by first stopping the rotation of the chuck table so that the mark indicating the crystal orientation of the wafer held on the chuck table is pointed in a predetermined direction, next feeding the grinding ring in the direction perpendicular to the chuck table, and next relatively moving the chuck table and the grinding ring in parallel.
    Type: Grant
    Filed: March 20, 2009
    Date of Patent: January 24, 2012
    Assignee: Disco Corporation
    Inventor: Takatoshi Masuda