Patents by Inventor TAKATOSHI MITO

TAKATOSHI MITO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11921688
    Abstract: According to the invention, it is possible to efficiently construct an environment for implementing an IT system. Provided is an environment construction support device. The environment construction support device stores a tree structure model that is information representing an environment for implementing an IT system in a tree structure and can be updated as needed, a construction script structure that is information related to a construction script that is a series of codes for constructing the environment and can be updated as needed, and parameter correspondence information that is information indicating a correspondence between an element of the tree structure model and an element of the construction script, and updates the parameter correspondence information to correspond to latest contents of the tree structure model and the construction script structure by comparing at least one of the tree structure model and the construction script structure with the parameter correspondence information.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: March 5, 2024
    Assignee: HITACHI, LTD.
    Inventors: Misaki Mito, Takatoshi Ohara, Hideyuki Kanuka, Minoru Tomisaka, Kiyomi Hirohata, Tooru Kawashima
  • Patent number: 9944766
    Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: April 17, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masaaki Matsumoto, Takatoshi Mito, Tatuo Yonemoto
  • Publication number: 20170218150
    Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.
    Type: Application
    Filed: August 21, 2015
    Publication date: August 3, 2017
    Inventors: MASAAKI MATSUMOTO, TAKATOSHI MITO, TATUO YONEMOTO