Abstract: There are provided 3D image glasses which are ready for a plurality of methods (output patterns of a timing signal) different from one another and moreover which are adaptable for various types of 3D image display devices. A ROM 6 stores a plurality of output patterns, and a plurality of command signals corresponding to the output patterns. A microcomputer 5 selects from the ROM 6 an output pattern coincident with an output pattern of a timing signal received from the 3D image display device, and moreover, by a command signal of the selected output pattern, controls opening and closing of right-eye and left-eye liquid-crystal shutters in synchronization with the received timing signal.

Abstract: There are provided 3D image glasses which are ready for a plurality of methods (output patterns of a timing signal) different from one another and moreover which are adaptable for various types of 3D image display devices. A ROM 6 stores a plurality of output patterns, and a plurality of command signals corresponding to the output patterns. A microcomputer 5 selects from the ROM 6 an output pattern coincident with an output pattern of a timing signal received from the 3D image display device, and moreover, by a command signal of the selected output pattern, controls opening and closing of right-eye and left-eye liquid-crystal shutters in synchronization with the received timing signal.

Abstract: An optical and electric signals transmission apparatus includes a receptacle having a light-receiving element and/or a light-receiving element and electrical connecting terminals, a plug having electrical connecting terminals to establish electrical coupling with the receptacle and optical coupling with the light-emitting element and/or the light-receiving element, an electric signal transmission line, and an optical signal transmission line. The receptacle has a fitting recess, and when the plug is fitted in the fitting recess in a direction substantially perpendicular to the optical axis of the light-emitting element or the light-receiving element, the optical coupling, the electrical coupling, and engagement of the receptacle with the plug are established at a location where the fitting recess and the plug are adjacent to each other.

Abstract: The portable telephone has an optical signal transmission section 100 for performing signal transmission between a first casing 101 and a second casing 102 by optical signals. A need for any complex electromagnetic shield structure can be eliminated. There is no occurrence of electromagnetic-wave noise from an optical signal transmission section 100. Thus, electromagnetic-wave noise of the whole portable telephone can be extremely reduced.

Abstract: An optical and electric signals transmission apparatus includes a receptacle having a light-receiving element and/or a light-receiving element and electrical connecting terminals, a plug having electrical connecting terminals to establish electrical coupling with the receptacle and optical coupling with the light-emitting element and/or the light-receiving element, an electric signal transmission line, and an optical signal transmission line. The receptacle has a fitting recess, and when the plug is fitted in the fitting recess in a direction substantially perpendicular to the optical axis of the light-emitting element or the light-receiving element, the optical coupling, the electrical coupling, and engagement of the receptacle with the plug are established at a location where the fitting recess and the plug are adjacent to each other.

Abstract: An optical semiconductor device 1a includes a lead frame 4 having a through hole 7, a semiconductor optical element 3 which is placed on one surface of the lead frame 4 for an optical portion 6 to face and overlap with the through hole 7, a first molding portion 9 of a non-transparent molding resin which covers the semiconductor optical element 3 and is placed on one surface of the lead frame 4, and a second molding portion 10 of a transparent molding resin which covers the through hole 7 and is placed on the other surface of the lead frame 4. An area of a confronting surface of the second molding portion 10 confronting the first molding portion 9 is smaller than an area of a confronting surface of the first molding portion 9 confronting the second molding portion 10.

Abstract: The portable telephone has an optical signal transmission section 100 for performing signal transmission between a first casing 101 and a second casing 102 by optical signals. A need for any complex electromagnetic shield structure can be eliminated. There is no occurrence of electromagnetic-wave noise from an optical signal transmission section 100. Thus, electromagnetic-wave noise of the whole portable telephone can be extremely reduced.

Abstract: A jack module for optical transmission has, on a holder body into which a specified plug is to be inserted, an optical semiconductor device for inputting and outputting an optical signal via the plug. The optical semiconductor device is so constructed that a light-emitting chip and a light-receiving chip are mounted on a one-side surface of a lead frame, where the light-emitting chip and the light-receiving chip are integrally molded with a light-pervious resin. The surface of the lead frame is disposed so as to be inclined with respect to a center axis of the plug inserted into the holder body. The jack module for optical transmission is capable of easily performing communications in the half-duplex method, simple in construction and manufacturable at small size and low cost.

Abstract: An optical semiconductor device 1a includes a lead frame 4 having a through hole 7, a semiconductor optical element 3 which is placed on one surface of the lead frame 4 for an optical portion 6 to face and overlap with the through hole 7, a first molding portion 9 of a non-transparent molding resin which covers the semiconductor optical element 3 and is placed on one surface of the lead frame 4, and a second molding portion 10 of a transparent molding resin which covers the through hole 7 and is placed on the other surface of the lead frame 4. An area of a confronting surface of the second molding portion 10 confronting the first molding portion 9 is smaller than an area of a confronting surface of the first molding portion 9 confronting the second molding portion 10.

Abstract: A jack module for optical transmission has, on a holder body into which a specified plug is to be inserted, an optical semiconductor device for inputting and outputting an optical signal via the plug. The optical semiconductor device is so constructed that a light-emitting chip and a light-receiving chip are mounted on a one-side surface of a lead frame, where the light-emitting chip and the light-receiving chip are integrally molded with a light-pervious resin. The surface of the lead frame is disposed so as to be inclined with respect to a center axis of the plug inserted into the holder body. The jack module for optical transmission is capable of easily performing communications in the half-duplex method, simple in construction and manufacturable at small size and low cost.

Abstract: The input device which includes a reflection type optical sensor having light emitting means and light receiving means; an operation section disposed facing the optical sensor, the operation section being tilted when a load is applied thereto; and output means for detecting a tilt status of the operation section based on signals from the light receiving means and outputting detected results to a computer body as positional information.

Abstract: A plug-jack type transfer device includes: at least seven electric terminals for connecting a mini single-head electric plug to the transfer device and exchanging an electrical signal therewith; a container body for containing and supporting the electric terminals and receiving the mini single-head electric plug; and a switch mechanism which completes electrical connection between a fourth electric terminal and a sixth electric terminal when the mini single-head electric plug is inserted into the container body. The mini single-head electric plug includes at least seven regions. A region farthest from a plug tip electrode corresponds to a first region.

Abstract: The input device which includes a reflection type optical sensor having light emitting means and light receiving means; an operation section disposed facing the optical sensor, the operation section being tilted when a load is applied thereto; and output means for detecting a tilt status of the operation section based on signals from the light receiving means and outputting detected results to a computer body as positional information.

Abstract: A master optical signal transmitter-receiver unit and slave optical signal transmitter-receiver units are connected in series for optical transmission by way of optical fibers. Each optical signal transmitter-receiver unit includes an optical connector for converting an optical signal to an electric signal and vice versa, an optical fiber switching circuit for switching the operation mode of the transmitter-receiver unit to thereby switch the data transmission direction, and a microcomputer. Each slave optical signal transmitter-receiver unit has a second optical connector connected to the first optical connector. The optical fiber switching circuits are under control of respective microcomputers. The microcomputer of each slave optical signal transmitter-receiver unit compares address data of the unit with address data received from the master optical signal transmitter-receiver unit.

Abstract: A thermal head for a thermal recording machine including an insulating substrate which is composed of a printed circuit board made of a heat resistant resin and covered with a copper film, a plurality of thermal resistors disposed on the insulating substrate in the direction corresponding to the scanning, discrete electrodes electrically connecting first ends of the thermal resistors to a control element, a common electrode electrically connecting the other ends of the thermal resistors together, a heat releasing layer formed of the copper film of the insulating substrate on the lower portions of the thermal resistors, and a thermal accumulating layer of a polyimide resin covering the heat releasing layer.

Abstract: A thermal head including a substrate, a plurality of thermal resistance elements formed on the substrate corresponding to print dots, a driving device for applying pulse voltage to the thermal resistance elements corresponding to print data, a temperature sensor provided on the substrate for sensing the temperature of the substrate, and an analog controller provided on the substrate and receiving an output from the temperature sensor for controlling the pulse voltage, so as to unify the print characteristic of the thermal resistance elements.

Abstract: A thermal printing head includes an insulating substrate formed of a heat resisting cloth impregnated with a heat resisting resin. A plurality of heating elements of an electrically resistive material are linearly disposed on the substrate. A shield layer is interposed between the heating elements and the substrate for preventing the substrate from exerting chemical influence on the heating elements. A plurality of conduction controlling devices mounted on the substrate is included for controlling electric conduction of the heating elements corresponding to print data. A common electrode is formed on the substrate for commonly connecting an end of each of the heating elements. A discrete electrode is formed on the substrate for connecting the other end of each of the heating elements to the conduction controlling device. Finally, metal layer is interposed between the heating elements and the electrodes for connecting both of them in an ohmic contact.

Abstract: A thermal head including a substrate, a thermal element array including a plurality of thermal elements linearly disposed on the substrate, a plurality of driver ICs provided on the substrate and including a plurality of drive circuit elements for controlling the thermal elements through electric conduction in accordance with a print signal, two common electrode patterns provided on the substrate, a first wiring pattern provided on the substrate for connecting each one end of each adjacent pair of the thermal elements commonly to one of the drive circuit elements, second and third wiring patterns provided on the substrate for connecting the other ends of the thermal elements separately to two common electrodes, the plurality of driver ICs being disposed along the thermal element array, the two common electrodes being arranged on opposite sides of the thermal element array and output terminals of the driver ICs, one of the adjacent thermal elements being formed of a single thermal resistor while the other is f

Abstract: A salat time alarm electronic timepiece is implemented with a one chip microcomputer. An outer read only memory is installed in the electronic timepiece for storing the sunrise time data and the sunset time data at various cities in world. The system reads out sunrise time and sunset time data from the outer read only memory and calculates five salat times of the present day. The thus calculated salat time data is stored in a storage means and compared with the current time data to provide an alarm sound when the current time reaches one of the five salat times.