Patents by Inventor Takatoshi Nishizawa

Takatoshi Nishizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9636857
    Abstract: A label for in-mold forming comprising a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, and an antenna and an IC chip. The antenna and the IC chip are interposed between the thermoplastic resin films. The label is strong and water resistant with a high adhesive strength. The label has the function of an IC label and has a printable surface. Also provided is a thermoplastic resin container bearing the label. Bonding the label to a thermoplastic resin container does not damage the IC chip and antenna.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: May 2, 2017
    Assignee: Yupo Corporation
    Inventors: Takatoshi Nishizawa, Yasuo Iwasa
  • Patent number: 9149976
    Abstract: A label for in-mold forming which comprises a thermoplastic resin film base layer (I), a heat-sealable resin layer (II), and an antistatic layer (III), wherein the heat-sealable resin layer (II) comprises a heat-sealable resin including a copolymer of propylene and ?-olefin having 4-20 carbon atoms and has a degree of non-crystallinity of 60-90% as determined with a differential scanning calorimeter (DSC) at temperatures less than 90° C., the antistatic layer (III) comprises an antistatic agent in an amount of 0.001 to 1 g per unit area (m2) and the surface of the layer has a wettability index (JIS-K-6768) of 32-54 mN/m, and the label has a porosity higher than 10% and not higher than 70% and has an opacity (JIS-P-8138) higher than 20% and not higher than 100%; and a labeled container with the label.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: October 6, 2015
    Assignee: YUPO CORPORATION
    Inventors: Yasuo Iwasa, Masaki Shiina, Takatoshi Nishizawa
  • Patent number: 8920890
    Abstract: A label for in-mold forming which comprises a thermoplastic resin film base layer (I), a heat-sealable resin layer (II), and an antistatic layer (III), wherein the heat-sealable resin layer (II) comprises a heat-sealable resin including a copolymer of propylene and ?-olefin having 4-20 carbon atoms and has a degree of non-crystallinity of 60-90% as determined with a differential scanning calorimeter (DSC) at temperatures less than 90° C., the antistatic layer (III) comprises an antistatic agent in an amount of 0.001 to 1 g per unit area (m2) and the surface of the layer has a wettability index (JIS-K-6768) of 32-54 mN/m, and the label has a porosity higher than 10% and not higher than 70% and has an opacity (JIS-P-8138) higher than 20% and not higher than 100%; and a labeled container with the label.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: December 30, 2014
    Assignee: Yupo Corporation
    Inventors: Yasuo Iwasa, Masaki Shiina, Takatoshi Nishizawa
  • Publication number: 20120288652
    Abstract: A label for in-mold forming which comprises a thermoplastic resin film base layer (I), a heat-sealable resin layer (II), and an antistatic layer (III), wherein the heat-sealable resin layer (II) comprises a heat-sealable resin including a copolymer of propylene and ?-olefin having 4-20 carbon atoms and has a degree of non-crystallinity of 60-90% as determined with a differential scanning calorimeter (DSC) at temperatures less than 90° C., the antistatic layer (III) comprises an antistatic agent in an amount of 0.001 to 1 g per unit area (m2) and the surface of the layer has a wettability index (JIS-K-6768) of 32-54 mN/m, and the label has a porosity higher than 10% and not higher than 70% and has an opacity (JIS-P-8138) higher than 20% and not higher than 100%; and a labeled container with the label.
    Type: Application
    Filed: July 19, 2012
    Publication date: November 15, 2012
    Applicant: YUPO CORPORATION
    Inventors: Yasuo IWASA, Masaki Shiina, Takatoshi Nishizawa
  • Patent number: 8268415
    Abstract: A melt thermal transfer recording paper suitable for melt thermal transfer recording comprising a stretched resin film, wherein stretched resin film contains from 30 to 75% by weight of an inorganic fine powder and/or an organic filler and from 25 to 70% by weight in total of a thermoplastic resin having a Vicat softening point of not higher than 140° C. and a polyolefin-based resin having a Vicat softening point of higher than 140° C.; the stretched resin film contains more than 75 parts by weight and at most 900 parts by weight of the thermoplastic resin relative to 100 parts by weight of the polyolefin-based resin.
    Type: Grant
    Filed: April 13, 2010
    Date of Patent: September 18, 2012
    Assignee: Yupo Corporation
    Inventors: Hisao Ochiai, Takatoshi Nishizawa
  • Patent number: 8187692
    Abstract: The invention provides an in-mold label which enables the degree of scumming to be judged during printing and imparts a good appearance to molded articles produced through in-mold molding, and which comprises a base layer (I), a heat-sealable resin layer (II), and a printable layer (III) and has a haze in whole layer of 80-100% and an internal haze of 0-20%. The invention further provides a molded article obtained using the label.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: May 29, 2012
    Assignee: Yupo Corporation
    Inventors: Yasuo Iwasa, Masaki Shiina, Takatoshi Nishizawa, Masahiro Kimura, Hajime Mizuno
  • Patent number: 8158250
    Abstract: To provide a stretched film of void-containing thermoplastic resin having an attractive force between sheets is 50 g or less. The stretched film of void-containing thermoplastic resin has no charge therein and can be processed secondarily with lesser electrostatic disturbance even in a low-humidity environment.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: April 17, 2012
    Assignee: Yupo Corporation
    Inventors: Takatoshi Nishizawa, Minoru Kato, Hidenori Okuyama
  • Patent number: 8021727
    Abstract: The invention provides a label for in-mold forming which tenaciously adheres to molded articles regardless of the materials of the molded articles, is usable under a wide range of molded-article molding conditions, and has an excellent print finish. The invention relates to: a label for in-mold forming, which comprises a resin film comprising a heat-sealable layer and a printing layer, wherein the heat-sealable layer has a rate of surface aperture of 6-30%, the printing layer has a dot skipping of 5% or lower, and the printing layer has a Bekk's surface smoothness (JIS-P-8119) of 650-20,000 seconds; and a molded article using the label.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: September 20, 2011
    Assignee: Yupo Corporation
    Inventors: Masaki Shiina, Kazuyuki Kimura, Takatoshi Nishizawa
  • Patent number: 7981503
    Abstract: Disclosed is a stretched resin film having a liquid absorption coefficient of at least 5 ml/(m2·ms1/2). The stretched resin film has good liquid absorbability with good seepage resistance. When stuck to objects with a water-base adhesive, it dries within a short period of time and attains good adhesiveness.
    Type: Grant
    Filed: January 25, 2005
    Date of Patent: July 19, 2011
    Assignee: Yupo Corporation
    Inventors: Kazuyuki Kimura, Masaaki Yamanaka, Hiroshi Koike, Seiichiro Iida, Takatoshi Nishizawa
  • Patent number: 7862881
    Abstract: A label for in-mold formation is provided which can be readily delaminated from the container by any one because of its excellent delamination initiation property and delamination transmission property as well as its low interlaminar strength, and which can be recorded with information such as pictures and letters on the inner side concealed by the label, and therefore, enabling effective utilization of the display area, or utilization of the delaminated label portion as a request form or a discount ticket, so called coupon.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: January 4, 2011
    Assignee: Yupo Corporation
    Inventors: Takatoshi Nishizawa, Hiroshi Koike
  • Patent number: 7807243
    Abstract: The invention relates to: a label for in-mold forming having excellent suitability for delabeling which comprises a thermoplastic resin film base layer (I) and a heat-sealable resin layer (II) and in which the heat-sealable resin layer (II) has an adhesion strength as measured at 23° C. of 300 gf/15 mm or higher and an adhesion strength as measured at 90° C. of 290 gf/15 mm or lower; and a labeled resin container having the label bonded thereto.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: October 5, 2010
    Assignee: Yupo Corporation
    Inventors: Yasuo Iwasa, Masaki Shiina, Takatoshi Nishizawa
  • Publication number: 20100233462
    Abstract: To provide a stretched film of void-containing thermoplastic resin having an attractive force between sheets is 50 g or less. The stretched film of void-containing thermoplastic resin has no charge therein and can be processed secondarily with lesser electrostatic disturbance even in a low-humidity environment.
    Type: Application
    Filed: April 1, 2010
    Publication date: September 16, 2010
    Applicant: YUPO CORPORATION
    Inventors: Takatoshi NISHIZAWA, Minoru Kato, Hidenori Okuyama
  • Patent number: 7776413
    Abstract: A melt thermal transfer recording paper suitable for melt thermal transfer recording comprising a stretched resin film, wherein stretched resin film contains from 30 to 75% by weight of an inorganic fine powder and/or an organic filler and from 25 to 70% by weight in total of a thermoplastic resin having a Vicat softening point of not higher than 140° C. and a polyolefin-based resin having a Vicat softening point of higher than 140° C.; the stretched resin film contains more than 75 parts by weight and at most 900 parts by weight of the thermoplastic resin relative to 100 parts by weight of the polyolefin-based resin.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: August 17, 2010
    Assignee: Yupo Corporation
    Inventors: Hisao Ochiai, Takatoshi Nishizawa
  • Publication number: 20100203267
    Abstract: A melt thermal transfer recording paper suitable for melt thermal transfer recording comprising a stretched resin film, wherein stretched resin film contains from 30 to 75% by weight of an inorganic fine powder and/or an organic filler and from 25 to 70% by weight in total of a thermoplastic resin having a Vicat softening point of not higher than 140° C. and a polyolefin-based resin having a Vicat softening point of higher than 140° C.; the stretched resin film contains more than 75 parts by weight and at most 900 parts by weight of the thermoplastic resin relative to 100 parts by weight of the polyolefin-based resin.
    Type: Application
    Filed: April 13, 2010
    Publication date: August 12, 2010
    Applicant: YUPO CORPORATION
    Inventors: Hisao Ochiai, Takatoshi Nishizawa
  • Patent number: 7740924
    Abstract: Disclosed is an in-mold labeled thermoplastic resin container specifically so designed that the ratio of the product A of the Gurley stiffness (m·kgf) and the 3% elongation load (kgf) of the label-edge part of the labeled area thereof to the product B of the Gurley stiffness and the 3% elongation load of the label-surrounding part of the non-labeled area thereof, A/B, is at most 0.6. The container has good drop impact fracture resistance and has good producibility, and it is lightweight.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: June 22, 2010
    Assignee: Yupo Corporation
    Inventors: Yasuo Iwasa, Takatoshi Nishizawa
  • Publication number: 20090291257
    Abstract: The invention provides a label for in-mold forming which tenaciously adheres to molded articles regardless of the materials of the molded articles, is usable under a wide range of molded-article molding conditions, and has an excellent print finish. The invention relates to: a label for in-mold forming, which comprises a resin film comprising a heat-sealable layer and a printing layer, wherein the heat-sealable layer has a rate of surface aperture of 6-30%, the printing layer has a dot skipping of 5% or lower, and the printing layer has a Bekk's surface smoothness (JIS-P-8119) of 650-20,000 seconds; and a molded article using the label.
    Type: Application
    Filed: March 29, 2006
    Publication date: November 26, 2009
    Applicant: YUPO CORPORATION
    Inventors: Masaki Shiina, Kazuyuki Kimura, Takatoshi Nishizawa
  • Patent number: 7618694
    Abstract: The object of the present invention is to provide a biodegradable label for in-mold forming, which is excellent in water resistance, is printable to allow for printing letters, or the like, by various printing methods, and is biodegradable in a natural environment; and to provide a biodegradable container attached with this biodegradable label for in-mold forming. In the present invention, the gist of the first invention is a biodegradable label for in-mold forming, comprising a laminate film (a/b), having a film (a), comprising a biodegradable resin (A), and a film (b), comprising a heat-sealable biodegradable resin (B); and the gist of the second invention is a biodegradable container attached with this biodegradable label for in-mold forming.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: November 17, 2009
    Assignee: Yupo Corporation
    Inventors: Takatoshi Nishizawa, Atsushi Kasai, Rie Shirahama
  • Patent number: 7514131
    Abstract: An in-mold label includes a thermoplastic resin film substrate layer and a heat-seal resin layer. The label has a label body and a separable part. Tearable perforations are provided between the label body and the separable part. The adhesion strength between the separable part and a thermoplastic resin container is from 80 to 270 gf/10 mm, when the label is stuck to the container during in-mold production of the container. A lubricant is applied to from 55 to 80% of the surface area of the heat-seal resin layer of the separable part. The wettability index of both the thermoplastic resin film substrate layer surface and the heat-seal resin layer surface is from 34 to 73 mN/m.
    Type: Grant
    Filed: February 15, 2005
    Date of Patent: April 7, 2009
    Assignee: Yupo Corporation
    Inventors: Takashi Funato, Takatoshi Nishizawa, Masaki Shiina
  • Publication number: 20090041966
    Abstract: To provide a stretched film of void-containing thermoplastic resin having an attractive force between sheets is 50 g or less. The stretched film of void-containing thermoplastic resin has no charge therein and can be processed secondarily with lesser electrostatic disturbance even in a low-humidity environment.
    Type: Application
    Filed: August 29, 2008
    Publication date: February 12, 2009
    Applicant: YUPO CORPORATION
    Inventors: Takatoshi Nishizawa, Minoru Kato, Hidenori Okuyama
  • Publication number: 20080182117
    Abstract: A label for in-mold forming which comprises a thermoplastic resin film base layer (I), a heat-sealable resin layer (II), and an antistatic layer (III), wherein the heat-sealable resin layer (II) comprises a heat-sealable resin including a copolymer of propylene and ?-olefin having 4-20 carbon atoms and has a degree of non-crystallinity of 60-90% as determined with a differential scanning calorimeter (DSC) at temperatures less than 90° C., the antistatic layer (III) comprises an antistatic agent in an amount of 0.001 to 1 g per unit area (m2) and the surface of the layer has a wettability index (JIS-K-6768) of 32-54 mN/m, and the label has a porosity higher than 10% and not higher than 70% and has an opacity (JIS-P-8138) higher than 20% and not higher than 100%; and a labeled container with the label.
    Type: Application
    Filed: January 31, 2007
    Publication date: July 31, 2008
    Applicant: YUPO CORPORATION
    Inventors: Yasuo Iwasa, Masaki Shiina, Takatoshi Nishizawa