Abstract: A package substrate is placed in a first predetermined position on a supporting equipment. A chip guide equipment and a magnetic-field-generating equipment in a second predetermined position are placed near the package substrate. A semiconductor chip having a photoelectric element and a solenoid electrically connected to the photoelectric element in a surface region of the semiconductor chip is placed on the package substrate with the surface region facing away from the package substrate. The photoelectric element of the semiconductor chip is exposed to light so as to move the semiconductor chip toward the chip guide equipment by an interaction between a first magnetic field of the solenoid and a second magnetic field of the magnetic-field-generating equipment. A manufacturing step to the semiconductor chip is performed while keeping the position of the semiconductor chip near the chip guide equipment.

Abstract: A package substrate is placed in a first predetermined position on a supporting equipment. A chip guide equipment and a magnetic-field-generating equipment in a second predetermined position are placed near the package substrate. A semiconductor chip having a photoelectric element and a solenoid electrically connected to the photoelectric element in a surface region of the semiconductor chip is placed on the package substrate with the surface region facing away from the package substrate. The photoelectric element of the semiconductor chip is exposed to light so as to move the semiconductor chip toward the chip guide equipment by an interaction between a first magnetic field of the solenoid and a second magnetic field of the magnetic-field-generating equipment. A manufacturing step to the semiconductor chip is performed while keeping the position of the semiconductor chip near the chip guide equipment.

Abstract: An optical communication module according to an aspect of this invention includes: a module casing; a conversion element housed in the module casing, and performing at least one of conversion from an electric signal to an optical signal and conversion from an optical signal to an electric signal; a signal processing circuit element performing signal processing, which is housed in the module casing and connected to the conversion element; and a heat conduction member, which contacts the module casing and the signal processing circuit element when a temperature of the atmosphere in the module casing is above the operational temperature range of the signal processing circuit element, but which parts from the signal processing element when a temperature of the atmosphere in the module casing is below the operational temperature range.