Patents by Inventor Takatoshi Sakaguchi

Takatoshi Sakaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fungicidal composition
    Patent number: 11903387
    Abstract: The present invention relates to a method of controlling plant diseases caused by phytopathogenic microorganisms, comprising a step of applying a fungicidal composition comprising a compound of formula [1] or a salt thereof.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: February 20, 2024
    Assignee: Gowan Company, L.L.C.
    Inventors: Takatoshi Sakaguchi, Naoki Okada
  • FUNGICIDAL COMPOSITION
    Publication number: 20210045386
    Abstract: The present invention relates to a method of controlling plant diseases caused by phytopathogenic microorganisms, comprising a step of applying a fungicidal composition comprising a compound of formula [1] or a salt thereof.
    Type: Application
    Filed: February 8, 2016
    Publication date: February 18, 2021
    Inventors: Takatoshi Sakaguchi, Naoki Okada
  • Fused 11-membered compounds and agricultural/horticultural fungicides containing them
    Patent number: 10104891
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 23, 2018
    Assignee: SDS BIOTECH K.K.
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • FUSED 11-MEMBERED COMPOUNDS AND AGRICULTURAL/HORTICULTURAL FUNGICIDES CONTAINING THEM
    Publication number: 20180235225
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Application
    Filed: April 19, 2018
    Publication date: August 23, 2018
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • Fused 11-membered compounds and agricultural/horticultural fungicides containing them
    Patent number: 9980487
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: May 29, 2018
    Assignee: SDS BIOTECH K.K.
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • FUSED 11-MEMBERED COMPOUNDS AND AGRICULTURAL/HORTICULTURAL FUNGICIDES CONTAINING THEM
    Publication number: 20170231226
    Abstract: The invention relates to a compound or a salt thereof of formula [1], a fungicidal composition containing the compound or a salt thereof, a method for controlling plant disease occurring from phytopathogenic microorganism including the step of applying the fungicidal composition and a production method of the compound.
    Type: Application
    Filed: June 11, 2015
    Publication date: August 17, 2017
    Applicant: SDS BIOTECH K.K.
    Inventors: Hiroshi Wada, Daisuke Horikoshi, Makoto Bamba, Tsuyoshi Kawano, Takatoshi Sakaguchi
  • Method of producing heat-sealable composite films
    Publication number: 20030059593
    Abstract: A composite film is provided by providing a polypropylene or other base resin layer, laminating a first covering layer of a resin composition (1) comprising the following components (A), (B), (C) and (D) to one side of the base resin layer and a second covering layer of a resin composition (2) comprising the components (A) and (D) to the other side of the base resin layer, which composite film is optionally stretched. The resin composition (2) may contain component (C).
    Type: Application
    Filed: July 11, 2002
    Publication date: March 27, 2003
    Inventors: Takatoshi Sakaguchi, Junichi Kimura, Teruaki Yoshida
  • Heat-sealable composite films
    Patent number: 6495246
    Abstract: A composite film is provided by providing a poly-propylene or other base resin layer, laminating a first covering layer of a resin composition (1) comprising the following components (A), (B), (C) and (D) to one side of the base resin layer and a second covering layer of a resin composition (2) comprising the components (A) and (D) to the other side of the base resin layer, which composite film is optionally stretched. The resin composition (2) may contain component (C). (A) a heat-sealable olefinic polymer (e.g. a propylene series copolymer such as propylene-ethylene copolymer, propylene-butene-1 copolymer or propylene-ethylene-butene-1 copolymer) (B) a diorganopolysiloxane (e.g. dimetylpolysiloxane) (C) a fine-powdered heat-resistant resin (e.g. microspheres of a thermosetting resin) (D) a higher fatty acid amide This composite film is excellent in slidability, antistaticity, releasability and clarity and compatible with a high-speed automatic overwrap packaging machine.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: December 17, 2002
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Takatoshi Sakaguchi, Junichi Kimura, Teruaki Yoshida