Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Abstract: A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.

Abstract: A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.

Abstract: A cutting apparatus includes a rotatable holding table having a rectangular holding surface, a cutting unit having a cutting blade mounted to a rotatable spindle, and a sensor unit detecting a tip of the cutting blade entering between a light projection section and a light reception section. The sensor unit has an upper end located to be lower than a lower end of the holding table in a Z direction and is located below the axis of the spindle or an extension region of the axis, and when short sides of the rectangular holding surface are set parallel to a Y direction, an upper side of the sensor unit is opened to allow the cutting blade to enter between the light projection section and the light reception section.

Abstract: A cutting apparatus includes a rotatable holding table having a rectangular holding surface, a cutting unit having a cutting blade mounted to a rotatable spindle, and a sensor unit detecting a tip of the cutting blade entering between a light projection section and a light reception section. The sensor unit has an upper end located to be lower than a lower end of the holding table in a Z direction and is located below the axis of the spindle or an extension region of the axis, and when short sides of the rectangular holding surface are set parallel to a Y direction, an upper side of the sensor unit is opened to allow the cutting blade to enter between the light projection section and the light reception section.