Abstract: A device which enables protection against an abruptly rising pulse such as an electromagnetic pulse in a compact size at a device level and a semiconductor package in which the device is mounted are provided. The semiconductor package (1, 2, 3) includes a substrate (12, 60, 70), an IC chip (21) arranged on the substrate (12, 60, 70), a plurality of connection parts (30) configured to connect the IC chip (21) to the outside, a plurality of bonding wires (40) configured to connect the IC chip (21) and corresponding ones of the plurality of connection parts (30), and a mechanism configured to bypass surge current applied to any of the plurality of connection parts (30) from the connection parts (30) to a ground potential via a path different from the plurality of bonding wires (40).

Abstract: A squib comprising a cup body, a cup body cover, and a header for holding a plurality of electrode pins insulated from one another and closing the opening portion of the cup body, wherein the internal of the cup body has an ignition powder, and a heating element connected to the electrode pins for igniting the ignition powder by externally applying electric current arranged in contact with the ignition powder, wherein a metal cylindrical or ring restraining member is provided in the outer periphery of the cup body and covered around with the cup body cover.