Abstract: The present invention relates to a film including at least a substrate and an antistatic layer, in which a ratio of a peeled area when a tape peeling test is performed under the following conditions after 300% uniaxial stretching at 25° C. is less than 5%, the tape peeling test is that: Cellotape® is pressure-bonded to a surface of the film on an antistatic layer side using a roller through 5 reciprocations with a load of 4 kg, and the Cellotape® is peeled off at a speed of 100 m/min in a direction of 180° with respect to the film within 5 minutes, thereby obtaining a ratio of a peeled area of the film to an area of an adhesive portion of the Cellotape®.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: To provide a process for producing a film excellent in water vapor barrier property, tensile elongations, and transparency. A resin material containing polychlorotrifluoroethylene (PCTFE) is melted and extruded into a film from an extrusion die, the extruded product is brought into contact with a cooling roll having a surface temperature of at most 120° C. in a state such that the surface temperature of the extruded product is higher than the crystallization temperature of PCTFE to form a film web, and the film web is subjected to heat treatment at from 80 to 200° C. to obtain a film.

Abstract: To provide a process for producing a film excellent in water vapor barrier property, tensile elongations and transparency. A resin material containing polychlorotrifluoroethylene (PCTFE) is melted and extruded into a film from an extrusion die, the extruded product is brought into contact with a cooling roll having a surface temperature of at most 120° C. in a state such that the surface temperature of the extruded product is higher than the crystallization temperature of PCTFE to form a film web, and the film web is subjected to heat treatment at from 80 to 200° C. to obtain a film.

Abstract: To provide a film made of polychlorotrifluoroethylene (PCTFE), of which a laminate with other layer is less likely to curl when subjected to drawing. A film comprising PCTFE, having thermal shrinkage rates within ±1.2% in MD and in TD when heated at 140° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.

Abstract: To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board. A roll film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 ?m, the dimensional change rate of which is less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: A method for manufacturing an encapsulating material sheet for a solar battery of the invention includes a step of producing an additive-containing pellet by soaking an additive A into a pellet including a polyolefin-based resin as a main component, a step of injecting the additive-containing pellet into a cylinder from a supply opening in an extrusion molder, and melting and kneading a resin composition including the polyolefin-based resin and the additive A in the cylinder, and a step of molding by extrusion the resin composition from a die in the extrusion molder into a sheet shape.

Abstract: To provide a glass laminate of which an increase of the peel strength between a glass substrate and a silicone resin layer is suppressed even after a high temperature heat treatment, and from which the glass substrate can readily be separated. A glass laminate comprising a support substrate, a silicone resin layer and a glass substrate in this order, with a peel strength at the interface between the support substrate and the silicon resin layer higher than the peel strength at the interface between the silicone resin layer and the glass substrate, wherein a silicone resin in the silicone resin layer is a cured product obtained by reacting an alkenyl-group containing organopolysiloxane (A) and a hydrogen polysiloxane (B) having a hydrosilyl group, and the mixing molar ratio of the hydrosilyl groups in the hydrogen polysiloxane (B) to the alkenyl groups in the alkenyl group-containing organopolysiloxane (A) (that is, number of mols of hydrosilyl groups/number of mols of alkenyl groups) is from 0.15/1 to 0.65/1.

Abstract: An encapsulating sheet for solar cell for encapsulating a solar cell, in which, in a case in which a square sheet obtained by cutting the sheet so that a planar shape becomes a square shape is heated at the atmospheric pressure and 150° C. for 15 minutes and is thus thermally shrunk, when a length of one side of the square sheet before being thermally shrunk is represented by L, a direction in parallel with a first side is considered as a first direction, and a direction perpendicular to the first side is considered as a second direction, and in the thermally-shrunk square sheet, a shortest length in the first direction is represented by M1, and a shortest length in the second direction is represented by M2, 0?|(M1?M2)/L|?0.4 is satisfied.

Abstract: A method for manufacturing an encapsulating material sheet for a solar battery of the invention includes a step of producing an additive-containing pellet by soaking an additive A into a pellet including a polyolefin-based resin as a main component, a step of injecting the additive-containing pellet into a cylinder from a supply opening in an extrusion molder, and melting and kneading a resin composition including the polyolefin-based resin and the additive A in the cylinder, and a step of molding by extrusion the resin composition from a die in the extrusion molder into a sheet shape.