Patents by Inventor Takatsugu Matsudome

Takatsugu Matsudome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6502740
    Abstract: In order to solder a lead wire of an electronic device to a wiring pattern formed on a printed circuit board, the electronic device is first placed on a first face of the printed circuit board such that the lead wire thereof are protruded from a second face of the printed circuit board, on which the wiring pattern is formed. Then cream solder is coated on the protruded lead wire. On the other hand, there is provided a liquefied heat medium having a temperature higher than a melting temperature of the cream solder. The second face of the printed board is immersed in the liquefied heat medium in a predetermined time period, to melt the cream solder. Finally, the printed board is lifted from the liquefied heat medium.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: January 7, 2003
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Takatsugu Matsudome
  • Publication number: 20010022316
    Abstract: In order to solder a lead wire of an electronic device to a wiring pattern formed on a printed circuit board, the electronic device is first placed on a first face of the printed circuit board such that the lead wire thereof are protruded from a second face of the printed circuit board, on which the wiring pattern is formed. Then cream solder is coated on the protruded lead wire. On the other hand, there is provided a liquefied heat medium having a temperature higher than a melting temperature of the cream solder. The second face of the printed board is immersed in the liquefied heat medium in a predetermined time period, to melt the cream solder. Finally, the printed board is lifted from the liquefied heat medium.
    Type: Application
    Filed: March 13, 2001
    Publication date: September 20, 2001
    Inventor: Takatsugu Matsudome
  • Patent number: 6047453
    Abstract: A air-core coil forming system which comprises a sheath peeling section and a coil forming section. The sheath peeling section includes a rotatable cylindrical cutting head having a through hole provided at radial center portion thereof into which the sheathed wire is inserted, a blade portion for peeling the sheath of the sheathed wire, and a blade support member for supporting in a manner that the blade is brought into contact with the sheath by means of a centrifugal force produced when the cutting head is rotated, a motor directly connected with the cutting head for rotating the same, and a rotary shaft provided in the motor such that a central axis thereof coincides with the through hole of the cutting head and having hollowed structure into which the sheathed wire is inserted.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: April 11, 2000
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Takatsugu Matsudome