Patents by Inventor Takaya ICHIMIYA

Takaya ICHIMIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230391993
    Abstract: Provided is an ethylene-based modifier with which a film having good slipperiness and relatively less fish eyes can be formed. The ethylene-based modifier has a strain-hardening exponent of 0.27 or more and 0.53 or less as determined by the LAOS method.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 7, 2023
    Inventors: Chen LIU, Takaya ICHIMIYA
  • Patent number: 11773243
    Abstract: Provided is an ethylene-based modifier with which a film having good slipperiness and relatively less fish eyes can be formed. The ethylene-based modifier has a strain-hardening exponent of 0.27 or more and 0.53 or less as determined by the LAOS method.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: October 3, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Chen Liu, Takaya Ichimiya
  • Publication number: 20230029101
    Abstract: Provided is an ethylene-based modifier with which a film having good slipperiness and relatively less fish eyes can be formed. The ethylene-based modifier has a strain-hardening exponent of 0.27 or more and 0.53 or less as determined by the LAOS method.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 26, 2023
    Inventors: Chen LIU, Takaya ICHIMIYA
  • Patent number: 11466146
    Abstract: Provided are an ethylene-based polymer capable of obtaining a film in which thickness unevenness is reduced, a method of producing the ethylene-based polymer, and a film containing the ethylene-based polymer. In the ethylene-based polymer according to the present invention, the following Expressions (1) and (2) are satisfied: 0.362??L1,256%/?L10%?0.466??(1) 0.0282?I52,506%/I12,506%?0.0328??(2).
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: October 11, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Takayuki Mino, Toshihiko Manami, Takaya Ichimiya
  • Patent number: 11459445
    Abstract: The present invention provides a composition capable of reducing adhesion of biofilms and therefore useful for producing a molded body. The composition comprises at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, and a quorum sensing inhibitor (B), and is configured such that a common logarithm log S of solubility of the quorum sensing inhibitor (B) in water of 25° C. is less than 0.1, and Ra1 is greater than 3.2 MPa1/2, provided that Ra1 is a distance between a Hansen solubility parameter of the at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins and a Hansen solubility parameter of the quorum sensing inhibitor (B).
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: October 4, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Kenta Sakurada, Eiji Nitta, Takaya Ichimiya, Shota Konishi
  • Publication number: 20210403687
    Abstract: Provided are an ethylene-based polymer capable of obtaining a film in which thickness unevenness is reduced, a method of producing the ethylene-based polymer, and a film containing the ethylene-based polymer. In the ethylene-based polymer according to the present invention, the following Expressions (1) and (2) are satisfied: 0.362??L1,256%/?L10%?0.466??(1) 0.0282?I52,506%/I12,506%?0.
    Type: Application
    Filed: June 28, 2021
    Publication date: December 30, 2021
    Inventors: Takayuki MINO, Toshihiko MANAMI, Takaya ICHIMIYA
  • Publication number: 20210054169
    Abstract: The present invention provides a composition capable of reducing adhesion of biofilms and therefore useful for producing a molded body. The composition comprises at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, and a quorum sensing inhibitor (B), and is configured such that a common logarithm log S of solubility of the quorum sensing inhibitor (B) in water of 25° C. is less than 0.1, and Rai is greater than 3.2 MPa1/2, provided that Rai is a distance between a Hansen solubility parameter of the at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins and a Hansen solubility parameter of the quorum sensing inhibitor (B).
    Type: Application
    Filed: February 12, 2019
    Publication date: February 25, 2021
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Kenta SAKURADA, Eiji NITTA, Takaya ICHIMIYA, Shota KONISHI