Patents by Inventor Takaya Noguchi
Takaya Noguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11901201Abstract: A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.Type: GrantFiled: August 15, 2022Date of Patent: February 13, 2024Assignee: Mitsubishi Electric CorporationInventors: Shunichi Kawakami, Takaya Noguchi
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Patent number: 11828786Abstract: An object is to provide a technique capable of creating a precise measurement condition in a facilitated manner relating to an electrical characteristic inspection for a semiconductor device. An electrical characteristic inspection device includes a storage unit configured to store a measurement condition of the semiconductor device being an inspection subject, a control unit configured to read out the measurement condition corresponding to inspection contents to be executed from the storage unit, an inductive inductance control circuit unit configured to set inductive inductance for the semiconductor device, and a floating inductance control circuit unit configured to set floating inductance for the semiconductor device. Based on the measurement condition read out from the storage unit, the control unit is configured to adjust the inductive inductance by controlling the inductive inductance control circuit unit, and adjust the floating inductance by controlling the floating inductance control circuit unit.Type: GrantFiled: October 12, 2021Date of Patent: November 28, 2023Assignee: Mitsubishi Electric CorporationInventors: Sumito Ogata, Yasushi Hisaoka, Takaya Noguchi
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Publication number: 20230131572Abstract: A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.Type: ApplicationFiled: August 15, 2022Publication date: April 27, 2023Applicant: Mitsubishi Electric CorporationInventors: Shunichi KAWAKAMI, Takaya NOGUCHI
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Publication number: 20220244292Abstract: A semiconductor test apparatus includes a chuck top on which a semiconductor wafer is mounted, and contact probes that contact measurement points of semiconductor chips formed on the semiconductor wafer, the chuck top includes a conductor that contacts a lower surface of the semiconductor wafer, a mounting table arranged below the conductor, and a first vacuum tube and a second vacuum tube connected to the mounting table, the conductor has a plurality of suction holes that are arranged in a spiral form in top view, in the mounting table, a flow pass communicating with the plurality of suction holes and having a spiral form in top view, the first vacuum tube is connected to an inner circumference portion of the flow pass, and the second vacuum tube is connected to an outer circumference portion of the flow pass.Type: ApplicationFiled: November 29, 2021Publication date: August 4, 2022Applicant: Mitsubishi Electric CorporationInventors: Yoshiyuki Ueda, Takaya Noguchi
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Publication number: 20220229103Abstract: An object is to provide a technique capable of creating a precise measurement condition in a facilitated manner relating to an electrical characteristic inspection for a semiconductor device. An electrical characteristic inspection device includes a storage unit configured to store a measurement condition of the semiconductor device being an inspection subject, a control unit configured to read out the measurement condition corresponding to inspection contents to be executed from the storage unit, an inductive inductance control circuit unit configured to set inductive inductance for the semiconductor device, and a floating inductance control circuit unit configured to set floating inductance for the semiconductor device. Based on the measurement condition read out from the storage unit, the control unit is configured to adjust the inductive inductance by controlling the inductive inductance control circuit unit, and adjust the floating inductance by controlling the floating inductance control circuit unit.Type: ApplicationFiled: October 12, 2021Publication date: July 21, 2022Applicant: Mitsubishi Electric CorporationInventors: Sumito OGATA, Yasushi HISAOKA, Takaya NOGUCHI
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Patent number: 11380596Abstract: A semiconductor test apparatus includes: a power supply; a high-voltage wire connecting high-voltage terminals of a plurality of semiconductor devices which are objects to be tested to a high-voltage side of the power supply; a low-voltage wire connecting low-voltage terminals of the semiconductor devices to a low-voltage side of the power supply; first switches connected in series to the semiconductor devices respectively, each of the first switches having one end connected to the low-voltage side of the power supply via the low-voltage wire and other end connected to the low-voltage terminal; second switches connected to the semiconductor devices respectively, each of the second switches having one end connected to the high-voltage terminal and other end connected to the low-voltage terminal; and a control circuit controlling the first switches and the second switches.Type: GrantFiled: April 9, 2020Date of Patent: July 5, 2022Assignee: Mitsubishi Electric CorporationInventors: Yuji Ebiike, Takaya Noguchi, Yoshinori Ito, Yoshikazu Ikuta, Koichi Takayama
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Publication number: 20210098314Abstract: A semiconductor test apparatus includes: a power supply; a high-voltage wire connecting high-voltage terminals of a plurality of semiconductor devices which are objects to be tested to a high-voltage side of the power supply; a low-voltage wire connecting low-voltage terminals of the semiconductor devices to a low-voltage side of the power supply; first switches connected in series to the semiconductor devices respectively, each of the first switches having one end connected to the low-voltage side of the power supply via the low-voltage wire and other end connected to the low-voltage terminal; second switches connected to the semiconductor devices respectively, each of the second switches having one end connected to the high-voltage terminal and other end connected to the low-voltage terminal; and a control circuit controlling the first switches and the second switches.Type: ApplicationFiled: April 9, 2020Publication date: April 1, 2021Applicant: Mitsubishi Electric CorporationInventors: Yuji EBIIKE, Takaya NOGUCHI, Yoshinori ITO, Yoshikazu IKUTA, Koichi TAKAYAMA
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Patent number: 10725086Abstract: Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.Type: GrantFiled: August 15, 2017Date of Patent: July 28, 2020Assignee: Mitsubishi Electric CorporationInventors: Akira Okada, Takaya Noguchi
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Patent number: 10495668Abstract: An evaluation apparatus for a semiconductor device includes: a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; and a plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from the surface of the chuck stage, and come into contact with an arrangement surface of the semiconductor device arranged in the chuck stage, wherein a height protruding from the surface of the chuck stage of at least one of the in-chuck probes is different from a height protruding from the surface of the chuck stage of the other in-chuck probe.Type: GrantFiled: July 7, 2016Date of Patent: December 3, 2019Assignee: Mitsubishi Electric CorporationInventors: Takaya Noguchi, Akira Okada
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Patent number: 10459005Abstract: An evaluation apparatus for a semiconductor device includes: a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; and a plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from the surface of the chuck stage, and come into contact with an arrangement surface of the semiconductor device arranged in the chuck stage, wherein a height protruding from the surface of the chuck stage of at least one of the in-chuck probes is different from a height protruding from the surface of the chuck stage of the other in-chuck probe.Type: GrantFiled: July 7, 2016Date of Patent: October 29, 2019Assignee: Mitsubishi Electric CorporationInventors: Takaya Noguchi, Akira Okada
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Patent number: 10436833Abstract: Provided is a technique capable of preventing occurrence of partial discharge. An evaluation apparatus includes a probe disposed on an undersurface of an upper component; a sidewall part disposed on the undersurface of the upper component and enclosing sides of the probe; and a first gas supplying part. The first gas supplying part is capable of supplying a gas to a to-be-measured object that is placed on a stage when the sidewall part comes in proximity to the stage, and to a space enclosed by the stage, the sidewall part, and the upper component when the sidewall part is in contact with the stage.Type: GrantFiled: August 14, 2017Date of Patent: October 8, 2019Assignee: Mitsubishi Electric CorporationInventors: Akira Okada, Kinya Yamashita, Masaki Ueno, Takaya Noguchi
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Patent number: 10359448Abstract: Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.Type: GrantFiled: December 12, 2016Date of Patent: July 23, 2019Assignee: Mitsubishi Electric CorporationInventors: Akira Okada, Takaya Noguchi, Norihiro Takesako
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Patent number: 10209273Abstract: A probe position inspection apparatus capable of inspecting the position of contact portions of respective probe tips easily and accurately, an apparatus for inspecting a semiconductor device, and a method of inspecting a semiconductor device are provided. The probe position inspection apparatus includes a transparent plate, a camera for taking an image of one surface of the transparent plate, and a pressure passive member covering the other surface of the transparent plate. The tip of a probe for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate, with the pressure passive member therebetween. The probe position inspection apparatus further includes an image processor for processing the image taken by the camera to detect the position of the probe in the plane of the transparent plate.Type: GrantFiled: July 11, 2016Date of Patent: February 19, 2019Assignee: Mitsubishi Electric CorporationInventors: Norihiro Takesako, Takaya Noguchi, Akira Okada
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Patent number: 10168380Abstract: A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.Type: GrantFiled: January 23, 2015Date of Patent: January 1, 2019Assignee: Mitsubishi Electric CorporationInventors: Takaya Noguchi, Akira Okada, Koichi Mochizuki
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Publication number: 20180180660Abstract: Provided is a technique capable of preventing occurrence of partial discharge. An evaluation apparatus includes a probe disposed on an undersurface of an upper component; a sidewall part disposed on the undersurface of the upper component and enclosing sides of the probe; and a first gas supplying part. The first gas supplying part is capable of supplying a gas to a to-be-measured object that is placed on a stage when the sidewall part comes in proximity to the stage, and to a space enclosed by the stage, the sidewall part, and the upper component when the sidewall part is in contact with the stage.Type: ApplicationFiled: August 14, 2017Publication date: June 28, 2018Applicant: Mitsubishi Electric CorporationInventors: Akira OKADA, Kinya YAMASHITA, Masaki UENO, Takaya NOGUCHI
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Publication number: 20180180659Abstract: Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.Type: ApplicationFiled: August 15, 2017Publication date: June 28, 2018Applicant: Mitsubishi Electric CorporationInventors: Akira OKADA, Takaya NOGUCHI
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Publication number: 20180088169Abstract: A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.Type: ApplicationFiled: January 23, 2015Publication date: March 29, 2018Applicant: Mitsubishi Electric CorporationInventors: Takaya NOGUCHI, Akira OKADA, Koichi MOCHIZUKI
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Patent number: 9804197Abstract: A probe position inspection apparatus which incorporates a rotatable internal prism is attached to a supporting unit for supporting semiconductor device, thus making it possible to accurately inspect in-plane positions of tips of probes in a short time and also making it possible to adapt the probe position inspection apparatus to a double-sided prober.Type: GrantFiled: October 3, 2016Date of Patent: October 31, 2017Assignee: Mitsubishi Electric CorporationInventors: Norihiro Takesako, Akira Okada, Takaya Noguchi
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Publication number: 20170299630Abstract: Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.Type: ApplicationFiled: December 12, 2016Publication date: October 19, 2017Applicant: Mitsubishi Electric CorporationInventors: Akira OKADA, Takaya NOGUCHI, Norihiro TAKESAKO
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Publication number: 20170199225Abstract: A probe position inspection apparatus which incorporates a rotatable internal prism is attached to a supporting unit for supporting semiconductor device, thus making it possible to accurately inspect in-plane positions of tips of probes in a short time and also making it possible to adapt the probe position inspection apparatus to a double-sided prober.Type: ApplicationFiled: October 3, 2016Publication date: July 13, 2017Applicant: Mitsubishi Electric CorporationInventors: Norihiro TAKESAKO, Akira OKADA, Takaya NOGUCHI