Patents by Inventor Takaya Yusa

Takaya Yusa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, its lead frame, and heat spreader having through holes
    Patent number: 5604378
    Abstract: In a lead frame for a semiconductor device which includes a multiplicity of leads, and a heat spreader having an edge to which the leads are bonded by an insulating material coated with an adhesive, and a central portion to which a semiconductor chip is bonded, the heat spreader has a ring-shaped portion defined between its central portion and the inner ends of the leads, and having a width of at least 0.5 mm. The ring-shaped portion has a plurality of through holes occupying not more than 60% by area of that portion, and each of those holes has a width of at least 0.5 mm.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: February 18, 1997
    Assignee: Sumitomo Metal Mining Company, Limited
    Inventors: Tadashi Kimura, Takaya Yusa