Patents by Inventor Takayasu Onoda

Takayasu Onoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6129558
    Abstract: A connector for a printed circuit board including a board-shaped housing with windows and connecting terminals arranged for the windows. An intermediate part of each connecting terminal is fixed to a housing part at an edge of the window, and a contacting part of the connecting terminal is arranged so that it can undergo elastic deformation in the window in the direction of thickness of the housing near the top of the housing. The external end of the connecting terminal is formed as a lead, and the connecting terminal is provided with a reinforcing lead that extends from the intermediate part toward the bottom of the housing in the window. If necessary, a reinforcing frame is embedded in the housing. A production method thereof is indicated by example, wherein connecting terminals and a frame being connected together are press-formed, and they are integrally molded with the housing, then the connecting terminals and the frame are disconnected from the rest.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: October 10, 2000
    Assignee: Japan Solderless Terminal Mfg. Co., Ltd.
    Inventors: Satoru Kihira, Masaaki Harasawa, Takayasu Onoda
  • Patent number: 5238412
    Abstract: A surface mount connector including an insulating housing and pairs of an upper and lower pin contacts which comprising terminal pins piercing the housing and being in vertical alignment and partially in a bifurcated pattern, in each pair. Each pin contact has a lead 15A or 15B integral with its base portion 15A or 15B and solderable to a pad on a printed circuit board. The leads are included in a single plane intermediate two further planes in which the upper and lower terminal pins respectively, respectively extend, respectively. A bottom contact surface of each lead protrudes downwardly between stepped regions of the lead. The insulating housing is partially cut off at its lower corner under the leads so as to provide a cutout tightly engageable with a side edge of the printed circuit board, so that visual inspection and correcting of soldered leads of the connector is facilitated, while ensuring reliable soldering of the leads, and further reducing the size and height of the connector from the board.
    Type: Grant
    Filed: June 12, 1992
    Date of Patent: August 24, 1993
    Assignee: Nippon Acchakutanshi Seizo Kabushiki Kaisha
    Inventors: Yoshimasa Morishita, Takayasu Onoda