Patents by Inventor Takayo KITAJIMA

Takayo KITAJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition
    Patent number: 11691389
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: July 4, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Yuya Hirayama, Takayo Kitajima, Kenichi Tomioka, Keisuke Kushida, Minoru Kakitani, Hiroshi Shimizu
  • RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION
    Publication number: 20210079172
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 18, 2021
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
  • RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN COMPOSITION
    Publication number: 20190161586
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: May 15, 2017
    Publication date: May 30, 2019
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU