Abstract: A phosphor-containing cured silicone that is a cured silicone which has a structure represented by general formulae (1) and/or (2) and also has units selected from general formulae (3) and/or (4), the phosphor-containing cured silicone includes a phosphor and particles having units selected from general formulae (3) and/or (4): wherein R1 to R3 are each a hydrogen atom, a methyl group, an ethyl group or a propyl group; X represents a methylene group, a dimethylene group or a trimethylene group, and may be the same or different; and R4 to R6 are each a substituted or unsubstituted monovalent hydrocarbon group, and may be the same or different. An object of the present invention is to provide a cured silicone in which a phosphor is uniformly dispersed, the cured silicone is characterized in that a silicone material has good thermal resistance and lightfastness.

Abstract: A phosphor-containing cured silicone that is a cured silicone which has a structure represented by general formulae (1) and/or (2) and also has units selected from general formulae (3) and/or (4), the phosphor-containing cured silicone includes a phosphor and particles having units selected from general formulae (3) and/or (4): wherein R1 to R3 are each a hydrogen atom, a methyl group, an ethyl group or a propyl group; X represents a methylene group, a dimethylene group or a trimethylene group, and may be the same or different; and R4 to R6 are each a substituted or unsubstituted monovalent hydrocarbon group, and may be the same or different. An object of the present invention is to provide a cured silicone in which a phosphor is uniformly dispersed, the cured silicone is characterized in that a silicone material has good thermal resistance and lightfastness.

Abstract: Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.

Abstract: A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: When a number of flexible circuit boards where a circuit pattern is formed on at least one surface are connected to each other so as to form a tape-style flexible circuit board, a space for conveyance is provided in the pairs of end portions facing each other of the flexible circuit boards, at least a portion of the space for conveyance protrudes in the direction parallel to the direction of conveyance of the flexible circuit boards, and the protruding space for conveyance overlaps and is fixed to a space for conveyance of an adjacent flexible circuit board.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

Abstract: This invention provides a color filter which comprises, a transparent substrate, color layers of plural colors, a transparent electrode and a protrusion for controlling liquid crystal alignment laminated in this order, and also has plural fixed dot spacers. In a preferable embodiment of this invention, the black matrix is formed by partially overlapping the color layers and the topmost layer of the fixed dot spacers comprises portions of the layer which constitutes the protrusion for controlling liquid crystal alignment or it comprises separate dots of the same composition as that of the protrusion for controlling liquid crystal alignment. This invention can provide a liquid crystal display device that can achieve an excellent display quality and a wide viewing angle and is furthermore excellent in productivity.

Abstract: The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

Abstract: A coating apparatus which comprises a feeding means to feed a coating liquid, a coating liquid applicator having a slot extending in one direction to discharge the coating liquid fed by the feeding means, and a conveying means to move at least either the coating liquid applicator or a substrate to be coated with the coating liquid relatively one to the other, comprising: (a) a first control means which comprises (a-1) a position detecting means to detect positions of the coating liquid applicator or the substrate which is moved by the conveying means, and (a-2) a controller capable of stopping the coating liquid applicator or the substrate which is moved by the conveying means at a position detected by the position detecting means such that a start-of-coating line of the substrate is in register with the slot of the coating liquid applicator and capable of starting the movement of the coating liquid applicator or the substrate which is stopped at the position; and (b) a second control means which comprises a

Abstract: A vertical magnetic recording medium is prepared by a process for vacuum-depositing a metal selected from cobalt and iron to form a magnetic layer on a substrate, wherein an oxygen gas and at least one gas chemically inactive in the vacuum deposition system, which is selected from nitrogen, argon, helium, neon, xenon, radon, methane and ethane, are introduced into the vacuum to an extent such that the pressure in the vicinity of the substrate is 1.times.10.sup.-3 to 5.times.10.sup.-2 Torr.

Abstract: A vertical magnetic recording medium comprising a substrate and a magnetic layer formed on the substrate and having a magnetic anisotropy in the direction vertical to the surface of the substrate is described. The magnetic layer is composed substantially of a metal selected from cobalt and/or iron, and an oxide of the metal. The metal and metal oxide consist of columnar structures oriented in the direction vertical to the surface of the substrate and spaced from one another through fine voids throughout the magnetic layer. The columnar structures have a diameter of 100 to 1000 .ANG. and the magnetic layer have a void ratio of to 56%.