Abstract: The invention relates to a method for producing a microfibrillated cellulose fiber dispersion containing microfibrillated cellulose fibers, at least one of a resin and a resin precursor, and an organic solvent, and the method comprises a fibrillation step of fibrillating cellulose fibers in a starting material dispersion containing cellulose fibers, at least one of a resin and a resin precursor, and an organic solvent, to obtain microfibrillated cellulose fibers.

Abstract: An imide skeleton resin represented by the following general formula (1) has a coefficient of linear expansion as low as that of polyimide resin and excellent processability like epoxy resin, and is useful as a resin composition for electrical laminates. Five percent by mole or more of the entirety of the A component is a linking group having an imide skeleton represented by the following general formula (4-1). B denotes a hydrogen atom or a group represented by the following structural formula (5). n denotes an integer in the range of 0 to 200. If both of the B's are hydrogen atoms, then n denotes an integer of 1 or more.

Abstract: An aggregate of carbon nanotubes satisfying all of the following requirements (1) to (3): (1) the volume resistivity is from 1×10?5 ?·cm to 5×10?3 ?·cm; (2) at least 50 out of 100 carbon nanotubes are double-walled carbon nanotubes in observation by a transmission electron microscope; and (3) the weight loss from 200° C. to 400° C. in thermogravimetry at a temperature rise of 10° C/min is from 5% to 20%.

Abstract: An aggregate of carbon nanotubes satisfying all of the following requirements (1) to (3): (1) the volume resistivity is from 1×10?5 ?·cm to 5×10?3 ?·cm; (2) at least 50 out of 100 carbon nanotubes are double-walled carbon nanotubes in observation by a transmission electron microscope; and (3) the weight loss from 200° C. to 400° C. in thermogravimetry at a temperature rise of 10° C./min is from 5% to 20%.

Abstract: An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.

Abstract: A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.

Abstract: The object was to provide an epoxy resin composition which has excellent flame retardancy, heat resistance and humidity resistance and is advantageously used for semiconductor encapsulating, laminated boards, electrical insulation and the like.