Abstract: A lateral photodiode with increased sensitivity. The lateral photodiode includes: a substrate, a semiconductor layer, formed on the substrate, for receiving input light, an insulation layer formed on the semiconductor layer, and electrodes formed within the insulation layer. A plurality of microlenses is formed over a surface of the insulation layer (or directly on the surface) within a light receiving area of the photodiode, and the input light is focused by the microlenses in a manner so as not to be directed toward the electrodes.

Abstract: A high-speed optical transmission system includes an optical fiber for transmitting light and an optical receiver for receiving light transmitted from the optical fiber. The optical fiber is a plastic optical fiber (POF), and the optical receiver has a lateral pin structure.

Abstract: The lead can be short in length, whereby the optical module can response at high speed. An optical module is provided with an optical element mounted on a lead frame and is mounted on a substrate by way of the lead frame. The optical element is mounted so that its optical axis intersects the surface of the substrate in a state where the optical module is mounted on the substrate, and a deflector which deflects the optical path of light propagating along the optical axis of the optical element is provided.

Abstract: An optical link module comprises a transmitting optical sub-assembly (TOSA), a receiving optical subassembly (ROSA), a board and electronic parts. The electronic parts are necessary for wire-bonding to connect electronic thereto and mounted only on either the first surface or the second surface of the board.

Abstract: A wiring pattern of a circuit board comprises two reference voltage lines holding a signal line therebetween, whereas the reference voltage lines on both ends are electrically connected to a conductive bracket. The bracket covers and electrically shields lead pins connecting a light-receiving device unit or light-emitting device unit to the circuit board.

Abstract: A light-emitting device assembly in the transmission optical module in accordance with the present invention accommodates a light-emitting device in a case, whereas a connection pin electrically connected to the anode of the light-emitting device extends outward from the case. The module also has a circuit board on which an electronic device for controlling the light-emitting device is mounted, whereas the circuit board is mounted in a board mounting part of a lead frame. The circuit board is provided with a first pad to which a predetermined potential is applied, and a second pad for supplying a source voltage, whereas wires bonding the connection pin to the first and second pads respectively.

Abstract: An optical link module comprises a transmitting optical sub-assembly (TOSA), a receiving optical subassembly (ROSA), a board and electronic parts. The electronic parts are necessary for wire-bonding to connect electronic thereto and mounted only on either the first surface or the second surface of the board.

Abstract: A light-receiving device unit (as with a light-emitting device unit) has a body accommodated in a cylindrical hole in a housing, and a flange part secured by being pressed toward an end face of the housing by a protrusion of a bracket holder. The bracket holder comprises a tilted wall corresponding to an inclined wall of the housing, and reliably presses the light-receiving device unit while being slid along a slope when being inserted. Also, it engages an abutment of the housing by using a claw at the leading end of the protrusion.

Abstract: A light-receiving device unit (as with a light-emitting device unit) has a body accommodated in a cylindrical hole in a housing, and a flange part secured by being pressed toward an end face of the housing by a protrusion of a bracket holder. The bracket holder comprises a tilted wall corresponding to an inclined wall of the housing, and reliably presses the light-receiving device unit while being slid along a slope when being inserted. Also, it engages an abutment of the housing by using a claw at the leading end of the protrusion.

Abstract: A wiring pattern of a circuit board comprises two reference voltage lines holding a signal line therebetween, whereas the reference voltage lines on both ends are electrically connected to a conductive bracket. The bracket covers and electrically shields lead pins connecting a light-receiving device unit or light-emitting device unit to the circuit board.

Abstract: A light-emitting device assembly in the transmission optical module in accordance with the present invention accommodates a light-emitting device in a case, whereas a connection pin electrically connected to the anode of the light-emitting device extends outward from the case. The module also has a circuit board on which an electronic device for controlling the light-emitting device is mounted, whereas the circuit board is mounted in a board mounting part of a lead frame. The circuit board is provided with a first pad to which a predetermined potential is applied, and a second pad for supplying a source voltage, whereas wires bonding the connection pin to the first and second pads respectively.