Patents by Inventor Takayoshi Komatsu

Takayoshi Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240092890
    Abstract: A bispecific antibody including a first domain which specifically binds to a mutant calreticulin protein and a second domain which specifically binds to a CD3 antigen. A pharmaceutical composition including the bispecific antibody or a functional fragment thereof. A diagnostic method for a myeloproliferative neoplasm, including detecting a polypeptide in a biological sample with the bispecific antibody.
    Type: Application
    Filed: August 26, 2021
    Publication date: March 21, 2024
    Applicants: JUNTENDO EDUCATIONAL FOUNDATION, MEIJI SEIKA PHARMA CO., LTD.
    Inventors: Norio KOMATSU, Marito ARAKI, Yoshihiko KIHARA, Yoji ISHIDA, Koichi KITAMURA, Takayoshi FUKUSHIMA, Kaori YASUI
  • Publication number: 20090223823
    Abstract: A method of separating a protein by gel electrophoresis, which comprises a staining step for bringing a protein-containing sample into contact with a staining liquid containing a staining agent, a surfactant and a buffer solution, and an electrophoresis step for subjecting the protein-containing sample after the staining step to gel electrophoresis. According to the present invention, using a staining liquid containing a surfactant such as SDS and the like, a protein-containing sample can be stained in a short time, and can develop color with high sensitivity. In addition, since an excess staining agent migrates earlier than protein by electrophoresis, a washing operation is not necessary. Furthermore, by staining, after the first dimension electrophoresis, with a staining liquid containing a surfactant such as SDS and the like, the second dimension electrophoresis can be performed immediately.
    Type: Application
    Filed: December 6, 2005
    Publication date: September 10, 2009
    Applicants: National Institute of Advanced Industrial Science and Technology, Sharp Corporation, Toppan Printing Co., Ltd., Katayanagi Institute
    Inventors: Ichiji Namatame, Yoshinori Ishii, Yoshimasa Saito, Takayoshi Komatsu, Yasuhiro Ogawa, Takashi Shibata, Hideki Kinoshita, Kenji Yokoyama
  • Publication number: 20050016242
    Abstract: A continuous hot-rolling mill includes an upper rolling unit including a plurality of rolling stands, and a lower rolling unit including a plurality of rolling stands and disposed downstream with respect to the upper rolling unit in a workpiece passing direction in which a workpiece to be rolled is passed. The two or more rolling stands of the lower rolling unit are differential or very-small-diameter rolling stands. Each of the two or more differential or very-small-diameter rolling stands of the lower rolling unit is provided with a drive motor having a capacity greater than that of any one of drive motors included in the rolling stands disposed upstream the differential or very-small-diameter rolling stands. The continuous hot-rolling mill is suitable for producing hot-rolled, fine-grained steel sheets and is excellent in sheet passing abilities for preventing the steel sheet from meandering and for rolling the steel sheet in a desired shape.
    Type: Application
    Filed: September 30, 2002
    Publication date: January 27, 2005
    Inventors: Ryurou Kurahashi, Shinji Ueno, Takayoshi Komatsu, Masanori Takahashi, Akio Adachi, Shinji Takaoka
  • Patent number: 4268614
    Abstract: A novel circuit board in which circuit portions including pad portions, through-hole portions and conductors are formed, at least at the pad portions and the through-hole portions of the circuit, in the vacant portions defined by a cured photopolymeric resin composition and the vacant portions are plated with electroless copper. When only the pad portions and through-hole portions are plated with electroless copper, the conductors are all covered with the resin composition, thereby enabling fears of mechanical and chemical damages to be eliminated. When all the circuit portions are plated with electroless copper, the amount of copper required can be considerably reduced.
    Type: Grant
    Filed: December 7, 1978
    Date of Patent: May 19, 1981
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tamotsu Ueyama, Yukihiko Wada, Masaji Homma, Hitoshi Aisawa, Takayoshi Komatsu, Tatsuhisa Shibata, Hiroharu Kamiyama