Patents by Inventor Takayoshi Marui

Takayoshi Marui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9203224
    Abstract: Provided is an electrical junction box which prevents a bonder cap from falling out of a bonder cap accommodating part without using a bundling tie. The electrical junction box includes a frame having a bonder cap accommodating part and a terminal-attached wire accommodating part, and a cover. An edge forming an insertion port of the bonder cap accommodating part includes a low pro file portion with the same height as that of an edge of the terminal-attached wire accommodating part and a projecting portion projecting beyond the low profile portion. In a state where the cover is attached to the frame, a distance between the low profile portion and the cover is longer than the full length of the bonder cap, and a distance between the most projected portion of the projecting portion and the cover is shorter than the full length of the bonder cap. The wire bundle outside the bonder cap accommodating part is bent toward the low profile portion.
    Type: Grant
    Filed: August 21, 2013
    Date of Patent: December 1, 2015
    Assignee: Yazaki Corporation
    Inventors: Masaki Yamamoto, Kazutoshi Kurachi, Kei Tomita, Taisuke Tomita, Takayoshi Marui
  • Publication number: 20150236489
    Abstract: Provided is an electrical junction box which prevents a bonder cap from falling out of a bonder cap accommodating part without using a bundling tie. The electrical junction box includes a frame having a bonder cap accommodating part and a terminal-attached wire accommodating part, and a cover. An edge forming an insertion port of the bonder cap accommodating part includes a low profile portion with the same height as that of an edge of the terminal-attached wire accommodating part and a projecting portion projecting beyond the low profile portion. In a state where the cover is attached to the frame, a distance between the low profile portion and the cover is longer than the full length of the bonder cap, and a distance between the most projected portion of the projecting portion and the cover is shorter than the full length of the bonder cap. The wire bundle outside the bonder cap accommodating part is bent toward the low profile portion.
    Type: Application
    Filed: August 21, 2013
    Publication date: August 20, 2015
    Inventors: Masaki Yamamoto, Kazutoshi Kurachi, Kei Tomita, Taisuke Tomita, Takayoshi Marui