Patents by Inventor Takayoshi Nishimura

Takayoshi Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10603832
    Abstract: A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: March 31, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Yasuhiro Funayama, Junji Ishihara, Shinsuke Miyachi, Takayoshi Nishimura
  • Publication number: 20180345560
    Abstract: A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.
    Type: Application
    Filed: February 9, 2018
    Publication date: December 6, 2018
    Applicant: HITACHI METALS, LTD.
    Inventors: Yasuhiro Funayama, Junji Ishihara, Shinsuke Miyachi, Takayoshi Nishimura
  • Patent number: D761433
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: July 12, 2016
    Assignee: KANEKA CORPORATION
    Inventors: Takayoshi Nishimura, Shinya Nakamura, Toshio Sakaguchi