Abstract: The present invention relates to a silicon wafer carrier consisting of a composition composed of (a) 100 parts by weight of a polyester, (b) 5 to 100 parts by weight of a polyether ester amide, (c) 10 to 2,500 ppm (based on the polyether ester amide) of an alkaline metal and (d) 0 to 40 parts by weight of a modified polyolefin, generating not more than 10 ppm of volatile gas by the heat-treatment at 150° C. for 60 minutes and eluting not more than 10 ppm of the alkaline metal by the immersion treatment in pure water at 80° C. for 120 minutes. The silicon wafer carrier has the generation of volatile gas and the elution of metal suppressed to an extent not to essentially cause the surface contamination of a silicon wafer and is provided with excellent permanent antistaticity and high mechanical properties and heat-resistance.

Abstract: A resin composition exhibiting excellent antistaticity and static charge dissipating performance and having extremely small variations of antistatic properties (saturated static voltage and half-life period of static voltage) on the surface of a molded article and a transportation jig for electronic field made of the above resin composition are provided by using a resin composition produced by compounding (A) 100 parts by weight of a thermoplastic resin with (B) 1 to 30 parts by weight of a carbon fiber having a diameter of 1 nm to 1 &mgr;m, a length of 1 &mgr;m to 3 mm and a volume resistivity of smaller than 1 &OHgr;cm and (C) 5 to 200 parts by weight of an antistatic polymer having a surface resistivity of 108 to 1011&OHgr; (measured under impressed voltage of 500V), a melting point of 100° C. or above, an apparent melt viscosity of 10 to 1,000 Pa·s at apparent shear rate of 1,000 sec−1 at 260° C.

Abstract: The present invention relates to a silicon wafer carrier consisting of a composition composed of (a) 100 parts by weight of a polyester, (b) 5 to 100 parts by weight of a polyether ester amide, (c) 10 to 2,500 ppm (based on the polyether ester amide) of an alkaline metal and (d) 0 to 40 parts by weight of a modified polyolefin, generating not more than 10 ppm of volatile gas by the heat-treatment at 150° C. for 60 minutes and eluting not more than 10 ppm of the alkaline metal by the immersion treatment in pure water at 80° C. for 120 minutes. The silicon wafer carrier has the generation of volatile gas and the elution of metal suppressed to an extent not to essentially cause the surface contamination of a silicon wafer and is provided with excellent permanent antistaticity and high mechanical properties and heat-resistance.

Abstract: A destaticizing thermoplastic resin composition compristing(A) a thermoplastic resin;(B) a polymer having a surface resistivity measured at 500 V of 10.sup.8 to 10.sup.11 .OMEGA., a melting point of 100.degree. C. or higher, an apparent malt viscosity at an apparent shear rate at 260.degree. C. of 1,000 sec.sup.-1 of 10 to 1,000 Pa.multidot.s, and a ratio of the above apparent melt viscosity to the apparent melt viscosity of the thermoplastic resin at an apparent shear rate at 260.degree. C. of 1,000 sec.sup.-1 of 0.01 to 1.3; or a carbon fiber having a diameter of 1 nm to 1 .mu.m, a length of 1 .mu.m to 10 mm and a volume resistivity of less than 1 .OMEGA.cm; or a combination of the polymer and the carbon fiber; and(C) a fibrous conductive filler having a volume resistivity of 100 .OMEGA..multidot.cm or less.The destaticizing composition is useful for preparation of a carrier jig for use in an electronic field.

Abstract: A sticking material for hemostasis has a flexible strip-shaped base member having a high recovery property, a main surface, and side edges extending in a first longitudinal direction. An adhesive layer is disposed on the main surface of the base member. A pad is disposed on the adhesive layer and extends in a second longitudinal direction substantially transverse to the first longitudinal direction such that a space is defined between the pad and each of the side edges of the base member. The pad is of a size sufficient to exert pressure at a puncture area including punctures of both a blood vessel and a skin surface. The pad has a slight elasticity and a hardness capable of securely exerting pressure on the punctures by a shrinking action of the base member when the base member is adhered to the skin surface while being stretched to secure the pad over the punctures.