Patents by Inventor Takayoshi Ozeki
Takayoshi Ozeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11401393Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.Type: GrantFiled: September 28, 2018Date of Patent: August 2, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki Kitai, Mikio Sato, Yasunori Hoshino, Masashi Koda, Takayoshi Ozeki, Hiroaki Fujiwara
-
Patent number: 11242425Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.Type: GrantFiled: April 22, 2019Date of Patent: February 8, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda, Yasunori Hoshino, Takayoshi Ozeki
-
Publication number: 20210246251Abstract: A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.Type: ApplicationFiled: April 22, 2019Publication date: August 12, 2021Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mikio SATO, Hiroaki FUJIWARA, Yuki KITAI, Masashi KODA, Yasunori HOSHINO, Takayoshi OZEKI
-
Publication number: 20200270411Abstract: A prepreg includes a resin composition or a semi-cured product of the resin composition, and a glass cloth, wherein the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, a content of the modified polyphenylene ether compound is 40 to 90 mass % with respect to a total mass of the modified polyphenylene ether compound and the crosslinkable curing agent, a cured product of the resin composition has a relative permittivity of 2.6 to 3.8, the glass cloth has a relative permittivity of 4.7 or less and a dielectric loss tangent of 0.0033 or less, and a cured product of the prepreg has a relative permittivity of 2.7 to 3.8 and a dielectric loss tangent of 0.002 or less.Type: ApplicationFiled: September 28, 2018Publication date: August 27, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yuki KITAI, Mikio SATO, Yasunori HOSHINO, Masashi KODA, Takayoshi OZEKI, Hiroaki FUJIWARA
-
Patent number: 10751976Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.Type: GrantFiled: January 24, 2017Date of Patent: August 25, 2020Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.Inventors: Yohsuke Ishikawa, Yoshiaki Esaki, Takayoshi Ozeki, Jun Tochihira, Ryu Harada
-
Publication number: 20200223998Abstract: One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.Type: ApplicationFiled: September 28, 2018Publication date: July 16, 2020Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yasunori HOSHINO, Hiroaki FUJIWARA, Yuki KITAI, Takayoshi OZEKI, Mikio SATO, Masashi KODA
-
Patent number: 10543661Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component. In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.Type: GrantFiled: September 2, 2016Date of Patent: January 28, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akihiro Yamauchi, Yoshiaki Esaki, Takayoshi Ozeki, Hiroaki Umehara, Hiroharu Inoue, Yoshihiko Nakamura
-
Publication number: 20190061320Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.Type: ApplicationFiled: January 24, 2017Publication date: February 28, 2019Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD., TOMOEGAWA CO., LTD.Inventors: Yohsuke ISHIKAWA, Yoshiaki ESAKI, Takayoshi OZEKI, Jun TOCHIHIRA, Ryu HARADA
-
Publication number: 20180250916Abstract: A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component. In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group.Type: ApplicationFiled: September 2, 2016Publication date: September 6, 2018Inventors: AKIHIRO YAMAUCHI, YOSHIAKI ESAKI, TAKAYOSHI OZEKI, HIROAKI UMEHARA, HIROHARU INOUE, YOSHIHIKO NAKAMURA
-
Publication number: 20180141311Abstract: A double-sided metal-clad laminate board includes a first metal layer; a second metal layer, and an insulating layer intervening between the first metal layer and the second metal layer. And the insulating layer is in direct contact with the first metal layer and the second metal layer.Type: ApplicationFiled: January 28, 2016Publication date: May 24, 2018Inventors: TAKAYOSHI OZEKI, YOHSUKE ISHIKAWA, YOSHIAKI ESAKI
-
Patent number: 9232636Abstract: The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 ?m, a line width in the range of 50 ?m to 1 mm, and a line gap in the range of 50 ?m to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 ?m. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 ?m or less.Type: GrantFiled: February 18, 2011Date of Patent: January 5, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takayoshi Ozeki, Yohsuke Ishikawa, Yoshiaki Esaki, Hiroyuki Fukusumi
-
Patent number: 9125307Abstract: The flexible metal-cladded base material pertaining to the present invention includes a metal foil and a first resin layer. The first resin layer is of a first resin composition containing a polyamide-imide resin. The polyamide-imide resin includes a first constituent unit represented by Formula (1) and a second constituent unit represented by Formula (2). The percentage of the second constituent unit is in a range of 5 to 35% by mol.Type: GrantFiled: November 22, 2012Date of Patent: September 1, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Takayoshi Ozeki, Hiroaki Umehara, Yoshiaki Esaki
-
Publication number: 20140326487Abstract: The flexible metal-cladded base material pertaining to the present invention includes a metal foil and a first resin layer. The first resin layer is of a first resin composition containing a polyamide-imide resin. The polyamide-imide resin includes a first constituent unit represented by Formula (1) and a second constituent unit represented by Formula (2). The percentage of the second constituent unit is in a range of 5 to 35% by mol.Type: ApplicationFiled: November 22, 2012Publication date: November 6, 2014Applicant: PANASONIC CORPORATIONInventors: Takayoshi Ozeki, Hiroaki Umehara, Yoshiaki Esaki
-
Publication number: 20130256002Abstract: The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 ?m, a line width in the range of 50 ?m to 1 mm, and a line gap in the range of 50 ?m to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 ?m. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 ?m or less.Type: ApplicationFiled: February 18, 2011Publication date: October 3, 2013Applicant: PANASONIC CORPORATIONInventors: Takayoshi Ozeki, Yohsuke Ishikawa, Yoshiaki Esaki, Hiroyuki Fukusumi