Abstract: An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.

Abstract: An electronic device including a circuit part having a semiconductor chip. The device includes a first heat radiation member kept in contact with the circuit part for radiating the heat generated by the circuit part, a second heat radiation member, and an intermediate member 32. Fins of the intermediate member are fitted in or on the fins of the first heat radiation member, and the base portion of the intermediate member is coupled to the base portion of the second heat radiation member. Therefore, the second heat radiation member can be conveniently added to the first heat radiation member via the intermediate member.