Abstract: An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.

Abstract: The object of the present invention is to provide a non-magnetic or feebly magnetic diamond sintered compact available for a magnetic article or magnetic material. This object can be achieved by a non-magnetic or feebly magnetic diamond sintered compact whose magnetic susceptibility is at most 3% of Fe, consisting of a high hardness sintered compact comprising at least 50 volume % of diamond with a grain size of 0.1 to 100 .mu.m and a binder phase containing a metallic component selected from the group consisting of ferromagnetic iron group metals such as Ni, Co, Fe, etc. and mixtures thereof, in which at least one of feebly magnetic metal components each having a magnetic susceptibility of at most 5.times.10.sup.-8 (emu/g), for example, Cr, V, Cu, Si, Zn, Al Mo, W, etc.